Abstract: Wafer scale fabrication of three dimentional substantially enclosed structures on a MEMS/IC die use a combination of electrodeposition of structural and sacrificial layers and flip-chip alignment and bonding technology. A first wafer contains a die with MEMS and/or IC structures. On this MEMS/IC processed die, a first three dimensional structural component is formed using standard lithographic processes and electrodeposition of a structural layer. A second sacrificial wafer is separately processed using similar lithographic and electrodeposition processes to form a corresponding second three dimensional structural component. The wafers are placed in a flip-chip bonder and aligned. Once aligned, the structural components are bonded together. The bonded wafers are then removed from the bonder and the second sacrificial wafer substrate removed. The resultant die includes a three dimensional structural component with a substantially enclosed cavity as well as MEMS and IC elements.

Abstract: A system for depositing a material is described. The system uses at least one cantilever, and more typically a plurality of cantilever to transfer small amounts of material from a source of material to a substrate surface. One application for the system is a printing system in which the material is an ink and the substrate is a sheet of paper. By repeating this process, the cantilever places many units of ink to form the pixels in an image.

Abstract: A system for printing is described. The system uses at least one cantilever, and more typically a plurality of cantilever to transfer charge, either to or from a dielectric surface. The resulting charge distribution represents an image. Toner deposited over the dielectric surface is attracted to the charged portions of the dielectric. Thus the toner also forms the image. The toner image is then transferred and affixed to a printing surface.

Abstract: A system for depositing a material is described. The system uses at least one cantilever, and more typically a plurality of cantilever to transfer small amounts of material from a source of material to a substrate surface. One application for the system is a printing system in which the material is an ink and the substrate is a sheet of paper. By repeating this process, the cantilever places many units of ink to form the pixels in an image.

Abstract: A system for printing is described. The system uses at least one cantilever, and more typically a plurality of cantilever to transfer charge, either to or from a dielectric surface. The resulting charge distribution represents an image. Toner deposited over the dielectric surface is attracted to the charged portions of the dielectric. Thus the toner also forms the image. The toner image is then transferred and affixed to a printing surface.

Abstract: Various particle transport systems and components for use in such systems are described. The systems utilize one or more traveling wave grids to selectively transport, distribute, separate, or mix different populations of particles. Numerous systems configured for use in two dimensional and three dimensional particle transport are described.

Abstract: A light-producing device integrated with a power monitoring system include a light-producing device from which light is emitted in wavelengths that can range from approximately 700 nm to approximately 3 microns. A semi-transparent sensor is located such that at least a portion of the light emitted passes through the semi-transparent sensor and at least a portion of light is absorbed by the semi-transparent sensor. The semi-transparent sensor is configured to be semi-transparent at wavelengths that can range from 700 nm to 3 microns. The semi-transparent sensor may also be used with an external light source, for example with fiber-optic cables.

Abstract: A method for detecting chemical reactions uses a nanocalorimeter having a substrate including thermal isolation capability residing on the substrate, thermal equilibration regions residing within the thermal isolation capability, and thermal measurement capability residing within each of the thermal equilibration regions. The thermal measurement device is connected to detection electronics. The method includes depositing drops of potentially reactive chemical solutions within the thermal equilibration region. These potentially reactive solution drops are merged through the use of drop merging electrodes residing within the thermal isolation region. The thermal change occurring within the merged solution drops is then measured with the detection electronics.

Abstract: A magnetostatic actuator uses a ferrofluid slug confined in a cylindrical tube which is wrapped in a conducting coil. By applying a current to the coil, a magnetic field is generated inside the coil. The ferrofluid slug may be attracted to the interior of the coil by the interaction of its magnetic moment with the field generated inside the coil. Movement of the ferrofluid slug in response to the magnetic field may be used to actuate various devices, such as a droplet dispenser.

Abstract: A MEMS system including a fixed electrode and a suspended moveable electrode that is controllable over a wide range of motion. In traditional systems where an fixed electrode is positioned under the moveable electrode, the range of motion is limited because the support structure supporting the moveable electrode becomes unstable when the moveable electrode moves too close to the fixed electrode. By repositioning the fixed electrode from being directly underneath the moving electrode, a much wider range of controllable motion is achievable. Wide ranges of controllable motion are particularly important in optical switching applications.

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract: Thermal detectors and thermal sensing cells can include a region of a support layer or support structure. Within the region can be reaction surfaces or other reaction regions, as well as contact pads and circuitry connecting the contact pads to other components. Also, a cell region can include a structure with reaction regions, contact pads, and control/detection circuitry connected to the contact pads; the control/detection circuitry controls occurrence of reactions in response to control signals, such as by drop merging, and also allows electrical detection of thermal signals from the reaction regions. The control/detection circuitry can include reaction control components such as drop merger electrodes and also thermal sensors such as thermistors, or it can include control/sensor elements such as semiconductor slabs that perform both functions. Each cell in an array can have control/detection circuitry that does not extend or connect outside the cell except through contact pads.

Abstract: Thermal sensing devices can include two subsets of thermal sensors connected in a bridge by circuitry on the same support layer or surface with the sensors. Each thermal sensor can be formed in a patterned layer of semiconductor material, and the bridge circuitry can include leads formed in a patterned layer of conductive material, over or under the semiconductor layer. In one implementation, the bridge circuitry includes conductive portions that extend across and electrically contact the lower surface of each sensor's semiconductor slab. The bridge circuitry can also include pads that can be electrically contacted, such as by pogo pins. The device's reaction surface can be spaced apart from or over the thermal sensors. The device's components can be shaped and positioned so that the bridge's offset voltage is below the sensitivity level required for an application, such as by left-right symmetry about an axis.

Abstract: Thermal sensors for calorimetry can include vanadium oxide, heavily p-doped amorphous silicon, or other materials with high temperature coefficients of resistivity. Such thermal sensors can have low noise equivalent temperature difference (NETD). For example, a thermal sensor with NETD no greater than 100 ?K over a bandwidth range of approximately 3 Hz or more can include a thermistor including vanadium oxide sputtered at room temperature under conditions that yield primarily V2O5; more specifically, the NETD can be no greater than 35 ?K, or even 10 ?K over a bandwidth range of approximately 3 Hz or more. If a low noise thermal sensor has NETD no greater than 50 ?K over such a bandwidth range, a low noise output circuitry connected to its thermistor can provide an electrical output signal that includes information about input thermal signal peaks with amplitude of approximately 100 ?K.

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract: A MEMS system including a fixed electrode and a suspended moveable electrode that is controllable over a wide range of motion. In traditional systems where an fixed electrode is positioned under the moveable electrode, the range of motion is limited because the support structure supporting the moveable electrode becomes unstable when the moveable electrode moves too close to the fixed electrode. By repositioning the fixed electrode from being directly underneath the moving electrode, a much wider range of controllable motion is achievable. Wide ranges of controllable motion are particularly important in optical switching applications.

Abstract: A new type of high-Q variable capacitor includes a substrate, a first electrically conductive layer fixed to the substrate, a dielectric layer fixed to a portion of the electrically conductive layer, and a second electrically conductive layer having an anchor portion and a free portion. The anchor portion is fixed to the dielectric layer and the free portion is initially fixed to the dielectric layer, but is released from the dielectric layer to become separated from the dielectric layer, and wherein an inherent stress profile in the second electrically conductive layer biases the free portion away from the dielectric layer. When a bias voltage is applied between the first electrically conductive layer and the second electrically conductive layer, electrostatic forces in the free portion bend the free portion towards the first electrically conductive layer, thereby increasing the capacitance of the capacitor.

Abstract: A method and apparatus for improving a network is described. The network uses the energy from a vehicle battery or vehicle generator to power an intermediate transmitter device that receives the signal from a portable wireless device and retransmits the information in the signal to a base station. The intermediate transmitter device also receives information from the base station and retransmits the information to the portable wireless device. The described system expands the areas in which a wireless device may be used.

Abstract: A measurement operation, such as a calorimetry measurement, is performed using a measurement array and a replaceable passivation membrane (e.g., a parylene membrane). The passivation membrane is used to cover the measurement array to provide temporary electrical and chemical passivation, while still allowing measurement of the parameter of interest (e.g., temperature, in a calorimetry measurement). By only replacing the membrane instead of the entire measurement array between measurement operations, the cost of the measurements can be significantly reduced over conventional methods. The passivation membrane can be mounted on a frame to simplify handling of the membrane.