Abstract: A hydraulic circuit comprises a hydraulic cylinder, an accumulator, and a bi-directional variable displacement hydraulic pump for managing flow between a head side of the hydraulic cylinder and both of a rod side of the hydraulic cylinder and the accumulator.

Abstract: A steering system has a steering control unit and a ratio adjuster for varying a flow rate amplification ratio of the steering control unit.

Abstract: An anti-overspeed system is adapted to prevent overspeeding of an engine of a vehicle. The anti-overspeed system has an anti-overspeed hydraulic circuit operably connected to the engine and a controller for controlling the hydraulic circuit in a manner that prevents overspeeding of the engine.

Abstract: A work vehicle that includes a boom; a boom actuator connected to the boom, the boom actuator being adapted to controllably move the boom about a boom pivot in response to receiving a boom control signal; and a controller having computational and time-keeping capabilities. The controller communicates with the boom actuator, and calculates the boom velocity, compares the calculated velocity to a commanded velocity to obtain a velocity error, and, if necessary, de-rates the tractive effort of the wheels to prevent the boom from stalling. The controller also determines if the operator is actuating the boom, and reads the boom position to calculate the boom velocity based upon the current boom position and a previous boom position. The controller uses a predefined algorithm to de-rate the tractive effort of the wheels as a function of the power train configuration.

Abstract: The invention relates to power management of a off-highway vehicle. A power management apparatus is described as a vehicle control unit coupled to a vehicle and the vehicle control unit is in communication with an engine and a transmission controller. In response to power management input, the vehicle control unit sends a message to the transmission controller commanding a maximum torque limit based on the maximum drivetrain torque. The maximum torque limit is configured to optimize power to the vehicle implement.

Abstract: The present invention is related to a loader of a construction apparatus such as front-end wheel loader or an agricultural tractor. Specifically, the present invention is related to a control system for a loader.

Abstract: A device and a process for integrating light energy transmit and/or receive functions with active devices such as GaAs or InP devices or light emitting devices, such as lasers. The device and process includes forming a passivation layer on top of the active device and forming a silicon photodetector on top of the passivation layer. The photodetector may be formed utilizing a standard solar cell growth process and may be formed as a mesa on top of the active or light-emitting device, thus forming a relatively less complicated semiconductor with an integrated monitoring device.

Abstract: A resonant photodetector assembly (10) which uses multiple reflections of light within a photodetector (20) to convert input light into an electrical signal. The photodetector (20) includes a combination of generally planar semiconductor layers including a photodetector active layer (36) where light is converted into an electrical output. The photodetector (20) further includes a first outer electrical contact layer (34) and a second outer electrical contact layer (42). A waveguide (22) is positioned on the photodetector (20) and has a waveguide active layer (26) positioned between a pair of waveguide cladding layers (24, 28), a first end (30) for receiving input light and a second end (50) for reflecting the light. A reflector (32) is positioned on the second end (50) of the waveguide (22) at an angle relative to a line parallel to the substrate (14), where the reflector (32) reflects the light received by the first end (30) of the waveguide active layer (26) towards the photodetector (20).

Abstract: A device and a process for integrating light energy transmit and/or receive functions with active devices such as GaAs or InP devices or light emitting devices, such as lasers. The device and process includes forming a passivation layer on top of the active device and forming a silicon photodetector on top of the passivation layer. The photodetector may be formed utilizing a standard solar cell growth process and may be formed as a mesa on top of the active or light-emitting device, thus forming a relatively less complicated semiconductor with an integrated monitoring device.

Abstract: A retainer for the installation of a seal or other component within a machine assembly including concentric first and second machine parts. One of the machine parts is formed as including a gland having a forward end wall and first and second peripheral walls. The first peripheral wall is spaced-apart a first distance from the other machine part and extends intermediate the forward end wall and an open rearward end, with the second peripheral wall being formed contiguously within the first peripheral wall intermediate the forward end wall and the open rearward end. The second peripheral wall is spaced-apart a greater second distance from the opposing machine part, and terminates at a rearward end wall. The retainer has an annular body configured to be receivable intermediate the first and second machine parts.

Abstract: An angle cavity resonant photodetector assembly (8), which uses multiple reflections of light within a photodetector (14) to convert input light into an electrical signal. The photodetector (14) has a combination of generally planar semiconductor layers including semiconductor active layers (20) where light is converted into an electrical output. The photodetector (14) is positioned relative to a waveguide (10), where the waveguide (10) has a waveguide active layer (22) located between a pair of waveguide cladding layers (24) and (26) and includes a first end (28) for receiving light and a second end (30) for transmitting the light to the photodetector (14). The photodetector (14) has a first reflector (12) and second reflector (16) that provides for multiple reflections across the semiconductor active layers (20).

Abstract: A resonant photodetector assembly (10) which uses multiple reflections of light within a photodetector (20) to convert input light into an electrical signal. The photodetector (20) includes a combination of generally planar semiconductor layers including a photodetector active layer (36) where light is converted into an electrical output. The photodetector (20) further includes a first outer electrical contact layer (34) and a second outer electrical contact layer (42). A waveguide (22) is positioned on the photodetector (20) and has a waveguide active layer (26) positioned between a pair of waveguide cladding layers (24, 28), a first end (30) for receiving input light and a second end (50) for reflecting the light. A reflector (32) is positioned on the second end (50) of the waveguide (22) at an angle relative to a line parallel to the substrate (14), where the reflector (32) reflects the light received by the first end (30) of the waveguide active layer (26) towards the photodetector (20).

Abstract: A resonant photodetector assembly (10) which uses multiple reflections of light within a photodetector (20) to convert input light into an electrical signal. The photodetector (20) includes a combination of generally planar semiconductor layers including a photodetector active layer (36) where light is converted into an electrical output. The photodetector (20) further includes a first outer electrical contact layer (34) and a second outer electrical contact layer (42). A waveguide (22) is positioned on the photodetector (20) and has a waveguide active layer (26) positioned between a pair of waveguide cladding layers (24, 28), a first end (30) for receiving input light and a second end (50) for reflecting the light. A reflector (32) is positioned on the second end (50) of the waveguide (22) at an angle relative to a line parallel to the substrate (14), where the reflector (32) reflects the light received by the first end (30) of the waveguide active layer (26) towards the photodetector (20).

Abstract: A method for fabricating a monolithic micro-optical component. The construction of the micro-optical components is accomplished by using standard semiconductor fabrication techniques. The method comprises the steps of depositing an etch stop layer (44) onto a semiconductor substrate (42); depositing an optical component layer (46) onto the etch stop layer (44); coating the entire surface of the optical component layer with a photoresist material; applying a photoresist mask (50) to the photoresist material on the optical component layer (46); selectively etching away the optical component layer (46) to form at least one optical column (52); forming a pedestal (54) for each of the optical columns (52) by selectively etching away the etch stop layer (44); and finally polishing each of the optical columns (52), thereby forming monolithic optical components (56).

Abstract: An angle cavity resonant photodetector assembly (8), which uses multiple reflections of light within a photodetector (14) to convert input light into an electrical signal. The photodetector (14) has a combination of generally planar semiconductor layers including semiconductor active layers (20) where light is converted into an electrical output. The photodetector (14) is positioned relative to a waveguide (10), where the waveguide (10) has a waveguide active layer (22) located between a pair of waveguide cladding layers (24) and (26) and includes a first end (28) for receiving light and a second end (30) for transmitting the light to the photodetector (14). The photodetector (14) has a first reflector (12) and second reflector (16) that provides for multiple reflections across the semiconductor active layers (20).

Abstract: The invention relates to an optical integrated circuit microbench system for accurately aligning optical fiber and waveguides to efficiently couple energy between optical devices. This is accomplished by using the anisotropic etch characteristics of III-V semiconductor materials in two orthogonal directions. One etch direction serves to provide a channel for precise fiber-positioning; the other direction, which is orthogonal provides a reflecting surface for directing the optical energy onto optical devices.

Abstract: A micromirror device (10) is provided with a rotatable optical component (22) for use in a digital image processing application. The micromirror device (10) includes a semiconductor wafer (12), having a recess (14) formed therein, and a platform (20) with the optical component (22) deposited thereon that is movably coupled to the side surface of the recess (14). A first magnetic field source (24) is disposed around the periphery of the optical component (22) on the platform (20) and a second magnetic field source (26) is disposed proximate to this first magnetic field source (24), such that these magnetic field sources are selectively activatable to generate an electromagnetic field for rotating the platform (20). More specifically, the second magnetic field source (26) is disposed on the angular side surfaces of the recess (14) or adjacent to the recess (14) on a top surface of the wafer (12).

Abstract: An interconnected apparatus for producing a low loss, reproducible electrical interconnection between a semiconductor device and a substrate includes a rod and rod receptor. The rod, generally cylindrically shaped, is attached to the semiconductor device and includes an outer circumferential wall which comes into contact with the rod receptor during a bonding process. A lip portion is formed on one end of the rod receptor for interlocking engagement with the rod. The rod receptor is plated on the substrate and includes a generally circularly shaped body which forms a centrally disposed well for receiving the rod. A lip portion is formed on one end or mouth of the rod receptor for interlocking engagement with the rod. When the rod and corresponding receptor are aligned and brought together, the rod deforms and interlocks with its corresponding rod receptor. A thermo-compression bonding process is utilized to bond the rod to the rod receptor, thereby producing a strong interlocking bond.

Abstract: An interconnected apparatus for producing a low loss, reproducible electrical interconnection between a semiconductor device and a substrate includes a rod and rod receptor. The rod, generally cylindrically shaped, is attached to the semiconductor device and includes an outer circumferential wall which comes into contact with the rod receptor during a bonding process. A lip portion is formed on one end of the rod receptor for interlocking engagement with the rod. The rod receptor is plated on the substrate and includes a generally circularly shaped body which forms a centrally disposed well for receiving the rod. A lip portion is formed on one end or mouth of the rod receptor for interlocking engagement with the rod. When the rod and corresponding receptor are aligned and brought together, the rod deforms and interlocks with its corresponding rod receptor. A thermo-compression bonding process is utilized to bond the rod to the rod receptor, thereby producing a strong interlocking bond.

Abstract: The invention relates to an optical integrated alignment device for accurately aligning optical fiber and waveguides to efficiently couple energy between optical devices. This is accomplished by using the anisotropic etch characteristics of III-V semiconductor materials. One orthogonal etch direction serves to provide a channel for precise fiber-positioning; the other direction, which is also orthogonal provides a reflecting surface for directing the optical energy between optical devices; and finally, a non-selective etch to form a micro-optical lens to focus optical energy to an optical device.