Patents by Inventor Eric Su

Eric Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6230789
    Abstract: The present invention provides a heat dissipating device and a method for making the same. The heat dissipating device includes an aluminum flat base plate integrally forming a number of studs thereon, an aluminum folded fin with a number of inverted U-shaped heat dissipating fins connecting with each by bottom partitions. Each partition defines a number of holes. Thermal grease is uniformly spread on a bottom of each partition. In manufacturing the heat dissipating device, the folded fin is firstly mounted to the base plate to a position that the studs extend through the holes in the partitions. The studs are then subject to pressing operation to fixedly connect the folded fin and the base plate together, whereby the thermal grease entirely fill the gaps between the partitions and the base plate to enable heat absorbed by the base plate to be effectively dissipated by the inverted U-shaped heat dissipating fins.
    Type: Grant
    Filed: June 25, 1999
    Date of Patent: May 15, 2001
    Assignee: Foxconn Precision Componment Co., LTD
    Inventors: Hsien-Sheng Pei, Eric Su, Stanley Chen, Ken Lee
  • Patent number: 6175024
    Abstract: A method of preparing an ester of a carboxylic acid functionalized with a moiety selected from the group consisting of halides, sulfonates, ethers, hydroxyl, amines, and aldehydes, said method comprising: (a) providing either a carboxylic acid having a vinyl group or an ester thereof; (b) functionalizing the vinyl carbon closest to the carboxyl group with said moiety, wherein said functionalizing comprises cleaving said vinyl group.
    Type: Grant
    Filed: March 3, 1999
    Date of Patent: January 16, 2001
    Assignee: AlliedSignal Inc.
    Inventors: William J. Boyle, Jr., Indira Reddy, Zhenrong Qian, Heng Eric Su, David Ryckman