Abstract: A method for producing a mirror of a lithography system includes providing first and second mirror parts. Cooling channels having elongate cooling channel openings in the region of a first connecting surface of the first mirror part are formed in the first mirror part, and/or cooling channels having elongate cooling channel openings in the region of a second connecting surface of the second mirror part are formed in the second mirror part. The method also includes bringing together the first and second mirror parts so that initially a partial region of the first connecting surface and a partial region of the second connecting surface come into contact and form a common contact surface. The common contact surface is enlarged by continuing to bring the first and second mirror parts together in a direction along the longitudinal extents of the cooling channel openings.

Abstract: A method for producing a mirror of a microlithographic projection exposure apparatus comprises providing a first mirror part having a first connecting surface and a second mirror part having a second connecting surface is provided. Cooling channels and/or auxiliary channels are formed in the second mirror part. The method also includes bringing together the first and second mirror parts so that initially a partial region of the first connecting surface and a partial region of the second connecting surface come into contact and form a common contact surface. The method further includes enlarging the contact surface by continuing to bring the first and second mirror parts together in a transverse direction with respect to the cooling channels or auxiliary channels.

Abstract: A method for producing a mirror of a projection exposure apparatus for microlithography includes providing at least one material blank. The material blank comprises a material with a very low coefficient of thermal expansion and has fault zones within which at least one material parameter deviates from a specified value by more than a minimum deviation. A first mirror part having a first connecting surface is produced from the material blank. A second mirror part having a second connecting surface is produced from the material blank or a further material blank. The first and second mirror parts are permanently connected to one another in the region of the first and second connecting surfaces.

Abstract: Provided for herein is a device that includes a first base support rotatable about a first rotational axis perpendicular to a rest surface of the first base support; a second base support arranged on the first base support and rotatable about a second rotational axis perpendicular to the rest surface of the first base support; at least one third base support arranged on the second base support and rotatable about a third rotational axis perpendicular to the rest surface of the first base support; and a supporting element is arranged on the third base support and including a holding surface for holding at least one optical element, the holding surface being rotatable about a rotational axis perpendicular to the holding surface.

Abstract: A vibration isolator (10) for supporting a payload and isolating the payload from vibrations has: a pressurized gas compartment (24) formed with a rigid base structure (28), which base structure has an opening (32) covered with a flexible membrane (20) having an inner surface (21) facing into the gas compartment and an outer surface (22) facing in the opposite direction, a support member (12) for supporting the payload, which support member is arranged in contact with the outer surface (22) of the membrane, and a clamping member (62) arranged at the inner surface (21) of the membrane, wherein the support member and the clamping member form a clamping system (66), which system includes at least one magnetic element (64) effecting the membrane to be pressed against the support member.

Abstract: A lithographic apparatus includes a projection system which includes a plurality of optical elements configured to project a beam of radiation onto a radiation sensitive substrate. The lithographic apparatus also includes a metrology frame structure which includes a part of one or more optical element measurement systems to measure the position and/or orientation of at least one of the optical elements. The plurality of optical elements, a patterning device stage, and a substrate stage are arranged such that, in a two dimensional view on the projection system, a rectangle is defined such that it envelops the plurality of optical elements, the patterning device stage, and the substrate stage. The rectangle is as small as possible. The metrology frame structure is positioned within the rectangle.

Abstract: A lithographic apparatus includes a projection system which includes a plurality of optical elements configured to project a beam of radiation onto a radiation sensitive substrate. The lithographic apparatus also includes a metrology frame structure which includes a part of one or more optical element measurement systems to measure the position and/or orientation of at least one of the optical elements. The plurality of optical elements, a patterning device stage, and a substrate stage are arranged such that, in a two dimensional view on the projection system, a rectangle is defined such that it envelops the plurality of optical elements, the patterning device stage, and the substrate stage. The rectangle is as small as possible. The metrology frame structure is positioned within the rectangle.

Abstract: A projection exposure apparatus for semiconductor lithography includes at least one component, and a support device with at least one support actuator which acts on at least one support location of the component so that deformations of the component are reduced. The support device includes a control unit for triggering the at least one support actuator. The control unit is configured to trigger the support actuator in the event of a dynamic acceleration acting on the component. The disclosure also relates to a method for reducing deformations, resulting from dynamic accelerations, of a projection exposure apparatus for semiconductor lithography.

Abstract: A lithographic apparatus includes a projection system which includes a plurality of optical elements configured to project a beam of radiation onto a radiation sensitive substrate. The lithographic apparatus also includes a metrology frame structure which includes a part of one or more optical element measurement systems to measure the position and/or orientation of at least one of the optical elements. The plurality of optical elements, a patterning device stage, and a substrate stage are arranged such that, in a two dimensional view on the projection system, a rectangle is defined such that it envelops the plurality of optical elements, the patterning device stage, and the substrate stage. The rectangle is as small as possible. The metrology frame structure is positioned within the rectangle.

Abstract: A lithographic apparatus includes a projection system which includes a plurality of optical elements configured to project a beam of radiation onto a radiation sensitive substrate. The lithographic apparatus also includes a metrology frame structure which includes a part of one or more optical element measurement systems to measure the position and/or orientation of at least one of the optical elements. The plurality of optical elements, a patterning device stage, and a substrate stage are arranged such that, in a two dimensional view on the projection system, a rectangle is defined such that it envelops the plurality of optical elements, the patterning device stage, and the substrate stage. The rectangle is as small as possible. The metrology frame structure is positioned within the rectangle.

Abstract: An imaging optical system has a plurality of mirrors which image an object field in an object plane in an image field in an image plane. The imaging optical system has a pupil obscuration. The last mirror in the beam path of the imaging light between the object field and the image field has a through-opening for the passage of the imaging light. A penultimate mirror of the imaging optical system in the beam path of the imaging light between the object field and the image field has no through-opening for the passage of the imaging light. The result is an imaging optical system that provides a combination of small imaging errors, manageable production and a good throughput for the imaging light.

Abstract: A projection exposure apparatus for semiconductor lithography includes at least one component, and a support device with at least one support actuator which acts on at least one support location of the component so that deformations of the component are reduced. The support device includes a control unit for triggering the at least one support actuator. The control unit is configured to trigger the support actuator in the event of a dynamic acceleration acting on the component. The disclosure also relates to a method for reducing deformations, resulting from dynamic accelerations, of a projection exposure apparatus for semiconductor lithography.

Abstract: A lithographic apparatus includes a projection system which includes a plurality of optical elements configured to project a beam of radiation onto a radiation sensitive substrate. The lithographic apparatus also includes a metrology frame structure which includes a part of one or more optical element measurement systems to measure the position and/or orientation of at least one of the optical elements. The plurality of optical elements, a patterning device stage, and a substrate stage are arranged such that, in a two dimensional view on the projection system, a rectangle is defined such that it envelops the plurality of optical elements, the patterning device stage, and the substrate stage. The rectangle is as small as possible. The metrology frame structure is positioned within the rectangle.

Abstract: A photocathode comprises a substrate in which a cavity is formed and a film of material disposed on the substrate. The film of material comprises an electron emitting surface configured to emit electrons when illuminated by a beam of radiation. The electron emitting surface is on an opposite side of the film of material from the cavity.

Abstract: An optical apparatus includes an interchange mechanism and an optical assembly of an illumination system or a projection objective. At least one of the plurality of optical elements of the optical assembly is selected from among a plurality of ones selectable from the interchange mechanism which facilitates exchange of one for another in the beam path. To reduce transmission of vibration from the interchange mechanism to the optical assembly, the interchange mechanism is mounted on a structure which is substantially dynamically decoupled from the housing, and a selected selectable optical element is located at an operating position at which it is separate from the interchange mechanism.

Abstract: An optical apparatus includes an interchange mechanism and an optical assembly of an illumination system or a projection objective. At least one of the plurality of optical elements of the optical assembly is selected from among a plurality of ones selectable from the interchange mechanism which facilitates exchange of one for another in the beam path. To reduce transmission of vibration from the interchange mechanism to the optical assembly, the interchange mechanism is mounted on a structure which is substantially dynamically decoupled from the housing, and a selected selectable optical element is located at an operating position at which it is separate from the interchange mechanism.

Abstract: A photocathode comprises a substrate in which a cavity is formed and a film of material disposed on the substrate. The film of material comprises an electron emitting surface configured to emit electrons when illuminated by a beam of radiation. The electron emitting surface is on an opposite side of the film of material from the cavity.

Abstract: An injector arrangement for providing an electron beam. The injector arrangement comprises a first injector for providing electron bunches, and a second injector for providing electrons bunches. The injector arrangement is operable in a first mode in which the electron beam comprises electron bunches provided by the first injector only and a second mode in which the electron beam comprises electron bunches provided by the second injector only.

Abstract: An injector arrangement for providing an electron beam. The injector arrangement comprises a first injector for providing electron bunches, and a second injector for providing electrons bunches. The injector arrangement is operable in a first mode in which the electron beam comprises electron bunches provided by the first injector only and a second mode in which the electron beam comprises electron bunches provided by the second injector only.

Abstract: An arrangement for use in a projection exposure tool (100) for microlithography comprises a reflective optical element (10; 110) and a radiation detector (30; 32; 130). The reflective optical element (10; 110) comprises a carrier element (12) guaranteeing the mechanical strength of the optical element (10; 110) and a reflective coating (18) disposed on the carrier element (12) for reflecting a use radiation (20a). The carrier element (12) is made of a material which upon interaction with the use radiation (20a) emits a secondary radiation (24) the wavelength of which differs from the wavelength of the use radiation (20a), and the radiation detector (30; 32; 130) is configured to detect the secondary radiation (24).