Abstract: A holding device (28) for a mirror element, in particular for a mirror element (19) for reflecting EUV radiation (16), having a ratio of length (L) to width (B) of more than 2:1, preferably of more than 3:1, particularly preferably of more than 4:1f, or even more than 10:1. The holding device (28) has a mount (29) with a plurality of holding elements (30) laterally clamping the mirror element (19). The holding elements (30) have projecting, resilient portions (32) for the resilient mounting of the mirror element (19). Also disclosed are an optical assembly (27) having such a mirror element (19) and holding device (28) configured to hold the mirror element (19), as well as an EUV lithography system having at least one such optical assembly (27).

Abstract: A method for incorporating temperature-regulating hollow structures into a substrate of an optical element, comprising: (A) providing a substrate consisting of a substrate material 12a; (B) progressively focusing a processing light beam onto processing locations at which temperature-regulating hollow structures are intended to arise, so that the substrate material 12a is ablated at the processing locations, wherein adjacent to the processing locations modified substrate material arises, having an increased etching susceptibility relative to the substrate material 12a; (C) applying a rinsing fluid to the processing locations while step (B) is carried out, whereby ablated substrate material is rinsed away. In a step (D), an etching medium is applied to the processing locations while step (B) is carried out, wherein the etching medium removes modified substrate material present there by way of an etching process.

Abstract: A substrate for producing an optical element and an optical element are specified. Furthermore, a semiconductor technology apparatus is specified.

Abstract: A workpiece having: at least one hollow structure (27) which runs in the workpiece (25) and configured to receive a flowing fluid (28) therein. The hollow structure has a first section and a second, adjacent section, which are mutually oriented at an angle (?) of between 60° and 120°. The hollow structure has a rounded-off section (37a, 37b), at which the first section and the second section merge into one another. A surface of a wall of the hollow structure in the first section, in the second section and/or in the rounded-off section has a roughness Ra of 25 ?m or less. Also, a method for at least partly forming a hollow structure in a workpiece by selective laser-induced etching, an associated mirror (24), and an associated reflective coating (26), applied to a surface (25a) of the substrate.

Abstract: An adaptive mirror for a microlithographic projection exposure apparatus comprises: a mirror substrate; an optical effective surface; a reflective layer system for reflecting electromagnetic radiation incident on the optical effective surface; an actuator layer for producing a locally variable deformation of the optical effective surface; and a mediator layer between the actuator layer and the reflective layer system. The mediator layer comprises an elastic mechanical mediator layer. The elastic mechanical mediator layer can be 0.1 mm and 50 mm thick and can have a modulus of elasticity of between 10 GPa and 300 GPa. A microlithographic projection exposure apparatus comprises such an adaptive mirror.

Abstract: Provided for herein is a device that includes a first base support rotatable about a first rotational axis perpendicular to a rest surface of the first base support; a second base support arranged on the first base support and rotatable about a second rotational axis perpendicular to the rest surface of the first base support; at least one third base support arranged on the second base support and rotatable about a third rotational axis perpendicular to the rest surface of the first base support; and a supporting element is arranged on the third base support and including a holding surface for holding at least one optical element, the holding surface being rotatable about a rotational axis perpendicular to the holding surface.

Abstract: This disclosure relates to a method for producing a mirror of a microlithographic projection exposure apparatus, a first mirror part and a second mirror part being provided, which are in contact in the region of a first connecting surface of the first mirror part and a second connecting surface of the second mirror part. For forming a durable connection between the first mirror part and the second mirror part, the first mirror part and the second mirror part are heated up to a holding temperature of at least 400° C. and are kept at the holding temperature during a holding time. After the holding time has elapsed, the first mirror part and the second mirror part are cooled down to a first cooling temperature at a first cooling rate of less than or equal to 100 K/h.

Abstract: This disclosure relates to a method for producing a mirror of a microlithographic projection exposure apparatus, a first mirror part and a second mirror part being provided, which are in contact in the region of a first connecting surface of the first mirror part and a second connecting surface of the second mirror part. For forming a durable connection between the first mirror part and the second mirror part, the first mirror part and the second mirror part are heated up to a holding temperature of at least 400° C. and are kept at the holding temperature during a holding time. After the holding time has elapsed, the first mirror part and the second mirror part are cooled down to a first cooling temperature at a first cooling rate of less than or equal to 100 K/h.

Abstract: A method for producing a mirror of a lithography system includes providing first and second mirror parts. Cooling channels having elongate cooling channel openings in the region of a first connecting surface of the first mirror part are formed in the first mirror part, and/or cooling channels having elongate cooling channel openings in the region of a second connecting surface of the second mirror part are formed in the second mirror part. The method also includes bringing together the first and second mirror parts so that initially a partial region of the first connecting surface and a partial region of the second connecting surface come into contact and form a common contact surface. The common contact surface is enlarged by continuing to bring the first and second mirror parts together in a direction along the longitudinal extents of the cooling channel openings.

Abstract: A method for producing a mirror of a microlithographic projection exposure apparatus comprises providing a first mirror part having a first connecting surface and a second mirror part having a second connecting surface is provided. Cooling channels and/or auxiliary channels are formed in the second mirror part. The method also includes bringing together the first and second mirror parts so that initially a partial region of the first connecting surface and a partial region of the second connecting surface come into contact and form a common contact surface. The method further includes enlarging the contact surface by continuing to bring the first and second mirror parts together in a transverse direction with respect to the cooling channels or auxiliary channels.

Abstract: A method for producing a mirror of a projection exposure apparatus for microlithography includes providing at least one material blank. The material blank comprises a material with a very low coefficient of thermal expansion and has fault zones within which at least one material parameter deviates from a specified value by more than a minimum deviation. A first mirror part having a first connecting surface is produced from the material blank. A second mirror part having a second connecting surface is produced from the material blank or a further material blank. The first and second mirror parts are permanently connected to one another in the region of the first and second connecting surfaces.

Abstract: Provided for herein is a device that includes a first base support rotatable about a first rotational axis perpendicular to a rest surface of the first base support; a second base support arranged on the first base support and rotatable about a second rotational axis perpendicular to the rest surface of the first base support; at least one third base support arranged on the second base support and rotatable about a third rotational axis perpendicular to the rest surface of the first base support; and a supporting element is arranged on the third base support and including a holding surface for holding at least one optical element, the holding surface being rotatable about a rotational axis perpendicular to the holding surface.

Abstract: A vibration isolator (10) for supporting a payload and isolating the payload from vibrations has: a pressurized gas compartment (24) formed with a rigid base structure (28), which base structure has an opening (32) covered with a flexible membrane (20) having an inner surface (21) facing into the gas compartment and an outer surface (22) facing in the opposite direction, a support member (12) for supporting the payload, which support member is arranged in contact with the outer surface (22) of the membrane, and a clamping member (62) arranged at the inner surface (21) of the membrane, wherein the support member and the clamping member form a clamping system (66), which system includes at least one magnetic element (64) effecting the membrane to be pressed against the support member.

Abstract: A lithographic apparatus includes a projection system which includes a plurality of optical elements configured to project a beam of radiation onto a radiation sensitive substrate. The lithographic apparatus also includes a metrology frame structure which includes a part of one or more optical element measurement systems to measure the position and/or orientation of at least one of the optical elements. The plurality of optical elements, a patterning device stage, and a substrate stage are arranged such that, in a two dimensional view on the projection system, a rectangle is defined such that it envelops the plurality of optical elements, the patterning device stage, and the substrate stage. The rectangle is as small as possible. The metrology frame structure is positioned within the rectangle.

Abstract: A lithographic apparatus includes a projection system which includes a plurality of optical elements configured to project a beam of radiation onto a radiation sensitive substrate. The lithographic apparatus also includes a metrology frame structure which includes a part of one or more optical element measurement systems to measure the position and/or orientation of at least one of the optical elements. The plurality of optical elements, a patterning device stage, and a substrate stage are arranged such that, in a two dimensional view on the projection system, a rectangle is defined such that it envelops the plurality of optical elements, the patterning device stage, and the substrate stage. The rectangle is as small as possible. The metrology frame structure is positioned within the rectangle.

Abstract: A projection exposure apparatus for semiconductor lithography includes at least one component, and a support device with at least one support actuator which acts on at least one support location of the component so that deformations of the component are reduced. The support device includes a control unit for triggering the at least one support actuator. The control unit is configured to trigger the support actuator in the event of a dynamic acceleration acting on the component. The disclosure also relates to a method for reducing deformations, resulting from dynamic accelerations, of a projection exposure apparatus for semiconductor lithography.

Abstract: A lithographic apparatus includes a projection system which includes a plurality of optical elements configured to project a beam of radiation onto a radiation sensitive substrate. The lithographic apparatus also includes a metrology frame structure which includes a part of one or more optical element measurement systems to measure the position and/or orientation of at least one of the optical elements. The plurality of optical elements, a patterning device stage, and a substrate stage are arranged such that, in a two dimensional view on the projection system, a rectangle is defined such that it envelops the plurality of optical elements, the patterning device stage, and the substrate stage. The rectangle is as small as possible. The metrology frame structure is positioned within the rectangle.

Abstract: A lithographic apparatus includes a projection system which includes a plurality of optical elements configured to project a beam of radiation onto a radiation sensitive substrate. The lithographic apparatus also includes a metrology frame structure which includes a part of one or more optical element measurement systems to measure the position and/or orientation of at least one of the optical elements. The plurality of optical elements, a patterning device stage, and a substrate stage are arranged such that, in a two dimensional view on the projection system, a rectangle is defined such that it envelops the plurality of optical elements, the patterning device stage, and the substrate stage. The rectangle is as small as possible. The metrology frame structure is positioned within the rectangle.

Abstract: An imaging optical system has a plurality of mirrors which image an object field in an object plane in an image field in an image plane. The imaging optical system has a pupil obscuration. The last mirror in the beam path of the imaging light between the object field and the image field has a through-opening for the passage of the imaging light. A penultimate mirror of the imaging optical system in the beam path of the imaging light between the object field and the image field has no through-opening for the passage of the imaging light. The result is an imaging optical system that provides a combination of small imaging errors, manageable production and a good throughput for the imaging light.

Abstract: A projection exposure apparatus for semiconductor lithography includes at least one component, and a support device with at least one support actuator which acts on at least one support location of the component so that deformations of the component are reduced. The support device includes a control unit for triggering the at least one support actuator. The control unit is configured to trigger the support actuator in the event of a dynamic acceleration acting on the component. The disclosure also relates to a method for reducing deformations, resulting from dynamic accelerations, of a projection exposure apparatus for semiconductor lithography.