Patents by Inventor Erik Reddington

Erik Reddington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
    Patent number: 10100421
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: October 16, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides
    Patent number: 10104782
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: October 16, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
    Patent number: 10006136
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: June 26, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Julia Kozhukh, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
    Patent number: 9932684
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ?-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: April 3, 2018
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE COMPOUNDS, BISEPOXIDES AND HALOBENZYL COMPOUNDS
    Publication number: 20170037528
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Julia Kozhukh, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE AND BISEPOXIDE COMPOUNDS
    Publication number: 20170037526
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF ALPHA AMINO ACIDS AND BISEPOXIDES
    Publication number: 20170037527
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ?-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRIDYL ALKYLAMINES AND BISEPOXIDES
    Publication number: 20170042037
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Metal plating compositions and methods
    Patent number: 8956523
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: September 16, 2012
    Date of Patent: February 17, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • METAL PLATING COMPOSITIONS AND METHODS
    Publication number: 20140081045
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Application
    Filed: September 16, 2012
    Publication date: March 20, 2014
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Method for forming metal contacts
    Patent number: 8536049
    Abstract: Methods of forming metal contacts with metal inks in the manufacture of photovoltaic devices are disclosed. The metal inks are selectively deposited on semiconductor coatings by inkjet and aerosol apparatus. The composite is heated to selective temperatures where the metal inks burn through the coating to form an electrical contact with the semiconductor. Metal layers are then deposited on the electrical contacts by light induced or light assisted plating.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: September 17, 2013
    Assignees: Rohm and Haas Electronic Materials LLC, Alliance for Sustainable Energy, LLC
    Inventors: Erik Reddington, Thomas C. Sutter, Lujia Bu, Alexandra Cannon, Susan E. Habas, Calvin J. Curtis, Alexander Miedaner, David S. Ginley, Marinus Franciscus Antonius Maria Van Hest
  • Metal plating compositions
    Patent number: 8337688
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: December 25, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Metal plating compositions and methods
    Patent number: 8329018
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: December 11, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Plating bath and method
    Patent number: 8268158
    Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: September 18, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Zukhra I. Niazimbetova, Elie H. Najjar, Maria Anna Rzeznik, Erik Reddington
  • METHOD FOR FORMING METAL CONTACTS
    Publication number: 20120129332
    Abstract: Methods of forming metal contacts with metal inks in the manufacture of photovoltaic devices are disclosed. The metal inks are selectively deposited on semiconductor coatings by inkjet and aerosol apparatus. The composite is heated to selective temperatures where the metal inks burn through the coating to form an electrical contact with the semiconductor. Metal layers are then deposited on the electrical contacts by light induced or light assisted plating.
    Type: Application
    Filed: October 14, 2011
    Publication date: May 24, 2012
    Applicants: Alliance for Sustainable Energy, LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Erik REDDINGTON, Thomas C. Sutter, Lujia Bu, Alexandra Perras, Susan E. Habas, Calvin J. Curtis, Alexander Miedaner, David S. Ginley, Marinus Franciscus Antonius Maria Van Hest
  • METAL PLATING COMPOSITIONS
    Publication number: 20120034371
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Application
    Filed: August 15, 2011
    Publication date: February 9, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • METAL PLATING COMPOSITIONS AND METHODS
    Publication number: 20110318479
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Application
    Filed: September 6, 2011
    Publication date: December 29, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Erik REDDINGTON, Gonzalo Urrutia DESMAISON, Zukhra I. NIAZIMBETOVA, Donald E. CLEARY, Mark LEFEBVRE
  • PLATING BATH AND METHOD
    Publication number: 20110290660
    Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
    Type: Application
    Filed: August 11, 2011
    Publication date: December 1, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Zukhra I. NIAZIMBETOVA, Elie H. Najjar, Maria Anna Rzeznik, Erik Reddington
  • Metal plating compositions
    Patent number: 8048284
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: November 1, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Plating bath and method
    Publication number: 20110220512
    Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
    Type: Application
    Filed: March 15, 2010
    Publication date: September 15, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Zukhra I. Niazimbetova, Elie H. Najjar, Maria Anna Rzeznik, Erik Reddington