Patents by Inventor Erik Reddington

Erik Reddington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8012334
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: September 6, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Publication number: 20080269395
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Application
    Filed: April 2, 2008
    Publication date: October 30, 2008
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Publication number: 20080268138
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Application
    Filed: April 2, 2008
    Publication date: October 30, 2008
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 7384535
    Abstract: Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brighteners and levelers in electroplating baths.
    Type: Grant
    Filed: April 24, 2004
    Date of Patent: June 10, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Wade Sonnenberg, Leon R. Barstad, Raymond Cruz, Gary Hamm, Mark J. Kapeckas, Erik Reddington, Katie Price, Thomas Buckley, Trevor Goodrich
  • Publication number: 20060151327
    Abstract: Analytical methods are disclosed for determining the quantity of organic components in a bath. The analytical methods work over a broad concentration range of organic components and are sensitive in measuring organic bath components at low concentrations.
    Type: Application
    Filed: April 24, 2004
    Publication date: July 13, 2006
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: Wade Sonnenberg, Leon Barstad, Raymond Cruz, Gary Hamm, Mark Kapeckas, Erik Reddington, Katie Price, Thomas Buckley, Trevor Goodrich
  • Publication number: 20060081475
    Abstract: A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.
    Type: Application
    Filed: November 30, 2005
    Publication date: April 20, 2006
    Applicant: Shipley Company, L.L.C.
    Inventors: Leon Barstad, Thomas Buckley, Raymond Cruz, Trevor Goodrich, Gary Hamm, Mark Kapeckas, Katie Price, Erik Reddington, Wade Sonnenberg
  • Publication number: 20050155866
    Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Application
    Filed: November 24, 2003
    Publication date: July 21, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: David Gabe, Andrew Cobley, Leon Barstad, Mark Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
  • Publication number: 20050139118
    Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Application
    Filed: December 29, 2004
    Publication date: June 30, 2005
    Applicant: SHIPLEY COMPANY, L.L.C.
    Inventors: Andrew Cobley, Mark Kapeckas, Erik Reddington, Wade Sonnenberg, Leon Barstad, Thomas Buckley
  • Patent number: 6911068
    Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: June 28, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Publication number: 20050016858
    Abstract: A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.
    Type: Application
    Filed: December 19, 2003
    Publication date: January 27, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: Leon Barstad, Thomas Buckley, Raymond Cruz, Trevor Goodrich, Gary Hamm, Mark Kapeckas, Katie Price, Erik Reddington, Wade Sonnenberg
  • Publication number: 20050016856
    Abstract: Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brighteners and levelers in electroplating baths.
    Type: Application
    Filed: April 24, 2004
    Publication date: January 27, 2005
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: Wade Sonnenberg, Leon Barstad, Raymond Cruz, Gary Hamm, Mark Kapeckas, Erik Reddington, Katie Price, Thomas Buckley, Trevor Goodrich
  • Publication number: 20040206631
    Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Application
    Filed: October 2, 2001
    Publication date: October 21, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Patent number: 6773573
    Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: August 10, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: David R. Gabe, Andrew J. Cobley, Leon R. Barstad, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
  • Publication number: 20040104124
    Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as ductility, micro-throwing power and micro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
    Type: Application
    Filed: November 24, 2003
    Publication date: June 3, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Patent number: 6736954
    Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: May 18, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Publication number: 20040074778
    Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, platinum, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
    Type: Application
    Filed: October 10, 2003
    Publication date: April 22, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Patent number: 6652731
    Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: November 25, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Publication number: 20030102226
    Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Application
    Filed: October 2, 2001
    Publication date: June 5, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: David R. Gabe, Andrew J. Cobley, Leon R. Barstad, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
  • Publication number: 20030085132
    Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
    Type: Application
    Filed: October 2, 2001
    Publication date: May 8, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Publication number: 20030070934
    Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
    Type: Application
    Filed: October 2, 2001
    Publication date: April 17, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley