Patents by Inventor Erik S. Jeng

Erik S. Jeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating interconnecting lines and contacts using conformal deposition
    Patent number: 5658830
    Abstract: The present invention is a method for fabricating interconnecting lines and contacts using conformal deposition. This invention applies patterning trenches simultaneously for interconnecting lines and contact holes and forming spacers technologies to make fully filled interconnecting line and contact holes. Then, utilizing the conformal deposition and blanket etch-back etching method, the present invention can fabricating interconnecting lines and contacts simultaneously.
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: August 19, 1997
    Assignee: Vanguard International Semiconductor Corporation
    Inventor: Erik S. Jeng