Abstract: A spindle nut retainer is used with a spindle with a flat portion on its threaded end. The flat portion interrupts the threads on the threaded end. A washer with a mating flat portion is slidably mounted over the threaded end and a nut is removably threaded to the threaded end of the spindle against the washer to set the preload on bearings. The nut retainer overlays a plurality of the corners of the nut and engages the threaded portion of the spindle with tangs. A majority of the tangs are flexed or bent to remain in biased contact with the threads on the spindle. Some of the tangs are located over the flat portion and remain unbent. The tangs resist rotation of the nut by engagement with the flat portion where it meets the threads.

Abstract: Provided are compounds of Formula (I?) or (I) below, or pharmaceutically acceptable salts thereof, and methods for their use and production.

Abstract: Provided are compounds of Formula (I?) or (II?), or pharmaceutically acceptable salts thereof, and methods for their use and production.

Abstract: Provided are compounds of Formula (I?) or (I) below, or pharmaceutically acceptable salts thereof, and methods for their use and production.

Abstract: Embodiments herein include a halo having varied conductance. In some embodiments, a halo surrounding a semiconductor workpiece may include a first side opposite a second side, and a first end opposite a second end, wherein the first side is operable to receive an ion beam from an ion source. The halo may further include a plurality of apertures extending between the first side and the second side, wherein the plurality of apertures permit passage of a portion of the ion beam to pass therethrough, and wherein the halo has a varied conductance between the first and second ends. In some embodiments, at least a group of apertures of the plurality of apertures vary in at least one of: pitch, and diameter. In some embodiments, a thickness of the halo between the first side and the second side varies along a height extending between the first end and the second end.

Abstract: Embodiments herein include a halo having varied conductance. In some embodiments, a halo surrounding a semiconductor workpiece may include a first side opposite a second side, and a first end opposite a second end, wherein the first side is operable to receive an ion beam from an ion source. The halo may further include a plurality of apertures extending between the first side and the second side, wherein the plurality of apertures permit passage of a portion of the ion beam to pass therethrough, and wherein the halo has a varied conductance between the first and second ends. In some embodiments, at least a group of apertures of the plurality of apertures vary in at least one of: pitch, and diameter. In some embodiments, a thickness of the halo between the first side and the second side varies along a height extending between the first end and the second end.

Abstract: A gas injection system for an ion beam device, the gas injection system including an extraction plate, an extraction aperture formed in the extraction plate for allowing passage of an ion beam, a first gas distributor removably fastened to the extraction plate on a first side of the extraction aperture, the first gas distributor having a gas orifice formed therein, a second gas distributor removably fastened to the extraction plate on a second side of the extraction aperture opposite the first side, the second gas distributor having a gas orifice formed therein, a first gas conduit extending through the extraction plate between the first gas distributor and a gas manifold mounted to the extraction plate, and a second gas conduit extending through the extraction plate between the second gas distributor the gas manifold, and a residue removal gas source connected to the gas manifold.

Abstract: Disclosed are nozzles and nozzle assemblies of liquid jet-forming surgical instruments, surgical instruments employing such nozzles and/or nozzle assemblies, and methods of fabricating the nozzle assemblies in forming surgical instruments. Also, disclosed are liquid jet-forming surgical instruments including both liquid jet-forming nozzles and optional evacuation lumens, which when provided can be configured to receive the liquid jet and evacuate the liquid forming the liquid jet. Certain embodiments of such surgical instruments include inventive nozzle alignment component(s) to facilitate alignment of the nozzles and evacuation lumen upon assembly. In certain embodiments, surgical instruments are provided that include a nozzle that is shaped to form a liquid jet, which has surfaces that are optically smooth.

Abstract: Disclosed are nozzles and nozzle assemblies of liquid jet-forming surgical instruments, surgical instruments employing such nozzles and/or nozzle assemblies, and methods of fabricating the nozzle assemblies in forming surgical instruments. Also, disclosed are liquid jet-forming surgical instruments including both liquid jet-forming nozzles and optional evacuation lumens, which when provided can be configured to receive the liquid jet and evacuate the liquid forming the liquid jet. Certain embodiments of such surgical instruments include inventive nozzle alignment component(s) to facilitate alignment of the nozzles and evacuation lumen upon assembly. In certain embodiments, surgical instruments are provided that include a nozzle that is shaped to form a liquid jet, which has surfaces that are optically smooth.

Abstract: A gas injection system for an ion beam device, the gas injection system including an extraction plate, an extraction aperture formed in the extraction plate for allowing passage of an ion beam, a first gas distributor removably fastened to the extraction plate on a first side of the extraction aperture, the first gas distributor having a gas orifice formed therein, a second gas distributor removably fastened to the extraction plate on a second side of the extraction aperture opposite the first side, the second gas distributor having a gas orifice formed therein, a first gas conduit extending through the extraction plate between the first gas distributor and a gas manifold mounted to the extraction plate, and a second gas conduit extending through the extraction plate between the second gas distributor the gas manifold, and a residue removal gas source connected to the gas manifold.

Abstract: Radio Frequency Identification (RFID) tags are provided, along with apparatuses and methods for making. In some embodiments, the RFID tags include an RFID tag chip that is attached to an inlay and/or a strap. The inlay or strap has one or more contact bumps formed thereon. In some of these embodiments, the RFID tag chip includes pads for electrical contacts, but not chip-bumps, thanks to the contact bump.

Abstract: A plasma processing apparatus and method are disclosed which create a uniform plasma within an enclosure. In one embodiment, a conductive or ferrite material is used to influence a section of the antenna, where a section is made up of portions of multiple coiled segments. In another embodiment, a ferrite material is used to influence a portion of the antenna. In another embodiment, plasma uniformity is improved by modifying the internal shape and volume of the enclosure.

Abstract: Radio Frequency Identification (RFID) tags are provided, along with apparatuses and methods for making. In some embodiments, the RFID tags include an RFID tag chip that is attached to an inlay and/or a strap. The inlay or strap has one or more contact bumps formed thereon. In some of these embodiments, the RFID tag chip includes pads for electrical contacts, but not chip-bumps, thanks to the contact bump.

Abstract: A plasma processing apparatus and method are disclosed which create a uniform plasma within an enclosure. In one embodiment, a conductive or ferrite material is used to influence a section of the antenna, where a section is made up of portions of multiple coiled segments. In another embodiment, a ferrite material is used to influence a portion of the antenna. In another embodiment, plasma uniformity is improved by modifying the internal shape and volume of the enclosure.

Abstract: One Time Programmable (OTP) memory structures and methods for pretesting the support circuitry are provided. A group of dedicated test cells associated with one or more groups of regular OTP cells are used to test the support circuitry for the regular OTP cells. The dedicated cells are programmed and read. The read values are compared to the programmed values or expected values. As a result of the comparison, failing memories may be designated “Not Usable”, while regular OTP cells of passing memories can be programmed for their purpose resulting in elimination of wasted memories during test.

Abstract: A chip has formed thereon integrated circuit elements, which include a main circuit and an associated non volatile memory structure. A test result associated with prior testing of a function of the main circuit is stored in the non volatile memory structure. Additional apparatus and methods are disclosed.

Abstract: Manufacturing methods, testing, and RFID integrated circuit wafers that have been so prepared. A function of an integrated circuit can be tested. If the test fails, a control function of the tested circuit is disabled.

Abstract: According to one embodiment, a method of testing an integrated circuit is provided. The quiescent current measuring of an integrated circuit is measured at two voltages. The functional relationship between the current measurements is determined and compared against a predetermined functional relationship to determine whether a defect exists in the integrated circuit.

Abstract: According to one embodiment, a method of testing an integrated circuit is provided. A reference voltage is coupled to each of a first and second comparator integrated on the chip. A supply voltage is compared to the reference voltage in a comparator to determine overvoltage or undervoltage conditions. The results of the comparison are stored and sizing and placing of at least one decoupling circuit in the circuit design is made based on the stored determinations.

Abstract: A method of manufacturing a semiconductor integrated circuit includes providing a fabricated integrated circuit on a wafer. A test fixture is connected to unencapsulated pads on the integrated circuit to monitor an operating parameter for the circuit and to determine a unique identifier for the die. The parameter is analyzed in post processing.