Abstract: A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. receive copper electroplating thereon: (2) forming at least one of one or more through-holes and/or one or more blind micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more blind micro-vias by contacting the electronic substrate with an acid copper electrolyte. The acid copper electrolyte is used to plate the one or more through-holes and/or the one or more blind micro-vias using a complex waveform including pulse reverse plating. DC plating and/or synchronous pulse plating. The complex waveforms can be used for filling through-holes and blind microvias with copper without defects.

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Abstract: Upon use of an immersion tin plating solution, contaminants build in the solution, which cause the plating rate and the quality of the plated deposit to decrease. One primary contaminant, which builds in the plating solution upon use, is hydrogen sulfide, H2S. If a gas is bubbled or blown through the solution, contaminants, especially hydrogen sulfide, can be effectively removed from the solution and, as a result, the high plating rate and plate quality can be restored or maintained. In this regard, any gas can be used, however, it is preferable to use a gas that will not detrimentally interact with the solution, other than to strip out contaminants. Nitrogen is particularly preferred for this purpose because it is efficient at stripping out contaminants, including hydrogen sulfide, but does not induce the oxidation of the tin ions from their divalent state to the tetravalent state, which is detrimental.

Abstract: Upon use of an immersion tin plating solution, contaminants build in the solution, which cause the plating rate and the quality of the plated deposit to decrease. One primary contaminant, which builds in the plating solution upon use, is hydrogen sulfide, H2S. If a gas is bubbled or blown through the solution, contaminants, especially hydrogen sulfide, can be effectively removed from the solution and, as a result, the high plating rate and plate quality can be restored or maintained. In this regard, any gas can be used, however, it is preferable to use a gas that will not detrimentally interact with the solution, other than to strip out contaminants. Nitrogen is particularly preferred for this purpose because it is efficient at stripping out contaminants, including hydrogen sulfide, but does not induce the oxidation of the tin ions from their divalent state to the tetravalent state, which is detrimental.

Abstract: A desktop accessory for luggage includes a desktop platform and a support platform that may be conveniently hooked to the upright telescopic carrying handles of a carrier, such as a rollaway suitcase. The portable table is operable between a deployed condition for attachment to the carrier handles and a low profile stowed condition which may be conveniently stored in the luggage. This device can be applied to almost any existing suitcase and can be transferred from one to another.

Abstract: A desktop accessory for luggage includes a desktop platform and a support platform that may be conveniently hooked to the upright telescopic carrying handles of a carrier, such as a rollaway suitcase. The portable table is operable between a deployed condition for attachment to the carrier handles and a low profile stowed condition which may be conveniently stored in the luggage. This device can be applied to almost any existing suitcase and can be transferred from one to another.

Abstract: An electroless silver plating bath and method of use is presented within. The electroless silver plating bath is designed to plate only on the desired metal substrate while preventing plating on areas other than those which are to be plated. The invention uses heavy metal based stabilizers in the electroless silver plating bath to prevent extraneous plating. The ability to control the amount of stabilizer present in the plating bath allows for elimination of extraneous plating and allows for a stable bath. The electroless silver plating bath is very stable and yet plates at an acceptable rate. The electroless silver plating bath prevents corrosion on the underlying metal that is plated on by using the stabilizers as described herein. The silver plating bath presented herein is useful for a wide variety of applications including those in electronic packaging, integrated circuits (IC) and in manufacturing of light emitting diodes (LEDs).

Abstract: A method of electrolessly metal plating exposed copper or copper alloy on an article while preventing plating on areas other than the copper or copper alloy of the article to be plated. The method comprises the steps, in order, of a) immersing the article in a ruthenium based activator solution; b) immersing the article in a solution comprising one or more divalent sulfur compounds; and c) electrolessly plating the exposed copper or copper alloy on the article. The article may optionally be cleaned and/or microetched prior to being immersed in the ruthenium based activator solution. This pre treatment method eliminates extraneous plating on the article and reduces the initiation time for plating to begin on the copper or copper alloy during subsequent electroless plating.

Abstract: A class preloading mechanism that dynamically preloads classes at runtime in a virtual machine (VM) environment. Data structures representing preloaded classes may be stored in a persistent module corresponding to a classloader. A persistent module can be directly mapped or copied into a memory region at runtime so that the classes may not have to be loaded from the class file container. The preloaded classes are not fully linked and resolved. When a classloader receives a class request, the classloader looks up the preloaded class in the memory region and completes linking and resolution of the class. Persistent modules may be pre-generated and, for example, installed with an application. Alternatively, a persistent module for a class file container may be generated at runtime by preloading classes from the class file container into a memory region and storing data structures representing the classes as a persistent module.

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Abstract: A process of making a polymeric phenazonium compound having the general formula: wherein R1, R2, R4, R5, R6, R8, and R9 are the same or different, and represent hydrogen, a low alkyl or a substituted aryl, R3 starts with NH2 and is diazotized followed by a polymerization, R5 and R8 may alternatively represent monomeric or polymeric phenazonium radicals, R7 is a carbon in the aromatic ring, Rx and Ry represent any combination of CH3, C2H5, and hydrogen, except that Rx and Ry cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable as an additive in a metal plating bath comprising copper.

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Abstract: A process of making a polymeric phenazonium compound having the general formula: wherein R1, R2, R4, R5, R6, R8 and R9 are the same or different, and represent hydrogen, a low alkyl or a substituted aryl, R3 starts with NH2 and is diazotized followed by polymerization, R5 and R8 may alternatively represent monomeric or polymeric phenazonium radicals, R7 is a substituted amine, RX and RY represent any combination of CH3, C2H5, and hydrogen, except that RX and RY cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.

Abstract: A process of making a polymeric phenazonium compound having the general formula: wherein R1, R2, R4, R5, R6, R8 and R9 are the same or different, and represent hydrogen, a low alkyl or a substituted aryl, R3 starts as NH2 and is diazotized followed by polymerization, R5 and R8 may alternatively represent monomeric or polymeric phenazonium radicals, R7 is a carbon in the aromatic ring, and wherein RX—N—RY represents a substituted amine, and RX and RY represent any combination of CH3, C2H5, and hydrogen, except that RX and RY cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100. The polymeric phenazonium compound is usable in as an additive in a metal plating bath.

Abstract: A process of making a polymeric phenazonium compound having the general formula: wherein R1, R2, R4, R5, R6, R8 and R9 are the same or different, and represent hydrogen, a low alkyl or a substituted aryl, R3 starts with NH2 and is diazotized followed by polymerization, R5 and R8 may alternatively represent monomeric or polymeric phenazonium radicals, R7 with its substituent group is a substituted amine, with RX and RY representing any combination of CH3, C2H5, and hydrogen, except that RX and RY cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable in as an additive in a metal plating bath.

Abstract: A method of providing a direct electroless palladium deposit on a copper surface is described. The method comprises the steps of (a) catalyzing the copper surface by applying a pre-dip composition to the copper surface, the pre-dip composition comprising a reducing agent; and thereafter (b) contacting the catalyzed copper surface with an electroless palladium composition to deposit a layer of palladium on the copper surface.

Abstract: A class preloading mechanism that dynamically preloads classes at runtime in a virtual machine (VM) environment. Data structures representing preloaded classes may be stored in a persistent module corresponding to a classloader. A persistent module can be directly mapped or copied into a memory region at runtime so that the classes may not have to be loaded from the class file container. The preloaded classes are not fully linked and resolved. When a classloader receives a class request, the classloader looks up the preloaded class in the memory region and completes linking and resolution of the class. Persistent modules may be pre-generated and, for example, installed with an application. Alternatively, a persistent module for a class file container may be generated at runtime by preloading classes from the class file container into a memory region and storing data structures representing the classes as a persistent module.