Patents by Inventor Ertugrul Demircan

Ertugrul Demircan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7820520
    Abstract: An integrated circuit has a plurality of terminals for making electrical connection to the integrated circuit. At least one device is formed adjacent an outer edge of the integrated circuit. The device includes at least one metal conductor for forming an edge seal for protecting the integrated circuit during die singulation. The device is coupled to one or more functional circuits within the integrated circuit by routing the at least one metal conductor to the one or more functional circuits, the at least one device providing a reactance value to the one or more functional circuits for non-test operational use. The device may be formed as one or more capacitors or as one or more inductors. Various structures may be used for the capacitor and the inductor.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: October 26, 2010
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Ertugrul Demircan, Jack M. Higman
  • Publication number: 20080230873
    Abstract: An integrated circuit has a plurality of terminals for making electrical connection to the integrated circuit. At least one device is formed adjacent an outer edge of the integrated circuit. The device includes at least one metal conductor for forming an edge seal for protecting the integrated circuit during die singulation. The device is coupled to one or more functional circuits within the integrated circuit by routing the at least one metal conductor to the one or more functional circuits, the at least one device providing a reactance value to the one or more functional circuits for non-test operational use. The device may be formed as one or more capacitors or as one or more inductors. Various structures may be used for the capacitor and the inductor.
    Type: Application
    Filed: March 22, 2007
    Publication date: September 25, 2008
    Inventors: Ertugrul Demircan, Jack M. Higman
  • Patent number: 7386821
    Abstract: A method for forming an integrated circuit (280) comprises accessing (282) a library of primitive cells and edge codes in the formation of an integrated circuit layout. At least one edge code of at least one previously placed primitive cell (284) of the integrated circuit layout is used. A primitive cell is selected (286) from the library that is compatible with the at least one previously placed primitive cell and the selected primitive cell is placed into the integrated circuit layout adjacent the at least one previously placed primitive cell. The integrated circuit is manufactured (290) using the integrated circuit layout.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: June 10, 2008
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jack M. Higman, Ertugrul Demircan, Edward O. Travis
  • Publication number: 20080005717
    Abstract: A method for forming an integrated circuit (280) comprises accessing (282) a library of primitive cells and edge codes in the formation of an integrated circuit layout. At least one edge code of at least one previously placed primitive cell (284) of the integrated circuit layout is used. A primitive cell is selected (286) from the library that is compatible with the at least one previously placed primitive cell and the selected primitive cell is placed into the integrated circuit layout adjacent the at least one previously placed primitive cell. The integrated circuit is manufactured (290) using the integrated circuit layout.
    Type: Application
    Filed: June 9, 2006
    Publication date: January 3, 2008
    Inventors: Jack M. Higman, Ertugrul Demircan, Edward O. Travis
  • Patent number: 6765778
    Abstract: An integrated circuit capacitor (60) uses multiple electrically conductive stacks (63-68, 70) to optimize capacitance density. A second stack (70) is a first nearest neighbor to a first stack (66). A third stack (65) is a second nearest neighbor to the first stack. Each of the three stacks defines vertices of an isosceles triangle (20) formed in a plane substantially perpendicular to the three stacks. The isosceles triangle does not have a ninety degree angle. The isosceles triangle may also be implemented as an equilateral triangle.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: July 20, 2004
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Yang Du, Ertugrul Demircan