Abstract: An organic light-emitting diode includes a carrier substrate, a scattering layer, a first electrode, an organic layer sequence with at least one active layer, and a second electrode wherein all the components are arranged in the stated sequence, the scattering layer has a higher average refractive index than the organic layer sequence, the first electrode has at least n or at least n+1 non-metal layers and n metal layers, n is a natural number greater than or equal to 1 or greater than or equal to 2, and the non-metal layers and the metal layers succeed one another alternately.

Abstract: An organic light-emitting component includes a substrate on which a functional layer stack is applied, the stack including a first electrode, an organic functional layer stack thereover including an organic light-emitting layer and a translucent second electrode thereover, and a translucent halogen-containing thin-film encapsulation arrangement over the translucent second electrode, wherein a translucent protective layer having a refractive index of more than 1.6 is arranged directly on the translucent second electrode between the translucent second electrode and the thin-film encapsulation arrangement.

Abstract: An optoelectronic component may include a first organic functional layer structure, a second organic functional layer structure, and a charge generating layer structure between the first organic functional layer structure and the second organic functional layer structure. The charge generating layer structure includes a first electron-conducting charge generating layer, and a second electron-conducting charge generating layer. The second electron-conducting charge generating layer is formed from a single substance, and the substance of the first electron-conducting charge generating layer is a substance selected from the group of substances consisting of: HAT-CN, Cu(I)pFBz, NDP-2, NDP-9, Bi(III)pFBz, F16CuPc.

Abstract: In at least one embodiment, a light-emitting diode includes a carrier and an organic layer sequence with an active layer. A mirror layer and electrical contact regions are located on a connection side of the carrier. The contact regions are provided for electrically contacting the organic layer sequence. Electrical dummy regions are located on the connection side. The dummy regions are electrically insulated from the contact regions. The mirror layer is present in the dummy regions and in the contact regions. At least two of the dummy regions are arranged in such a way that base areas of these dummy regions cannot be congruently superimposed merely by arbitrary rotation of the carrier relative to a center axis of the carrier perpendicular to the connection side.

Abstract: Various embodiments relate to an optoelectronic component, including a first electrode layer, a first organic functional layer structure on or over the first electrode layer, a nontransparent second electrode layer on or over the first organic functional layer structure, a second organic functional layer structure on or over the second electrode layer, and a third electrode layer on or over the second organic functional layer structure. The material for the second electrode layer is selected in such a way that a matt impression of at least one side of the optoelectronic component is imparted.

Abstract: Various embodiments may relate to an electronic component including a layer to be protected against moisture, and a moisture barrier layer arranged at least partly on or above and/or below the layer to be protected. The moisture bather layer includes a plurality of layers composed of the same material having different stoichiometric compositions.

Abstract: A luminaire for general lighting includes an illuminant having a first light emission surface and a second light emission surface. The illuminant includes an organic, light-generating region. The first light emission surface and the second light emission surface are arranged at two mutually opposite main surfaces of the illuminant. A first light emerges at the first light emission surface during the operation of the illuminant, and a second light emerges at the second light emission surface during the operation of the illuminant. The first light and the second light differ from one another with regard to color and/or color temperature. The first light and the second light leave the luminaire in mutually different emission directions.

Abstract: An organic light-emitting device comprising an active layer for producing radiation having a first side surface and a second side surface adjoining a corner edge. A first contact strip extends along the first side surface for injecting charge carriers of a first type into the active layer. A second contact strip extends along the second side surface for injecting charge carriers of a second type into the active layer. The first side surface has a recessed region adjoining the corner edge, and the injection of charge carriers from the first contact strip is suppressed in the recessed region.

Abstract: A light-emitting component may include: a first electrode; an organic electroluminescent layer structure on or above the first electrode; a second translucent electrode on or above the organic electroluminescent layer structure; an optically translucent layer structure on or above the second electrode, wherein the optically translucent layer structure includes photoluminescence material; and a mirror layer structure on or above the optically translucent layer structure.

Abstract: A light-emitting component may include: an electrically active region, including a first electrode, a second electrode, an organic functional layer structure between the first electrode and the second electrode, a cover arranged above the electrically active region, and a layer structure arranged between the cover and the electrically active region. The component may have at least one layer having a refractive index which is less than the refractive index of the cover.

Abstract: An encapsulation structure for an optoelectronic component, may include: a thin-film encapsulation for protecting the optoelectronic component against chemical impurities; an adhesive layer formed on the thin-film encapsulation; and a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer.

Abstract: An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.

Abstract: An organic light-emitting component, may include: a first electrode; an organic light-generating layer structure on or above the first electrode; a second translucent electrode on or above the organic light-generating layer structure; an optically translucent layer structure on or above the second electrode; and a mirror layer structure on or above the optically translucent layer structure, wherein the mirror layer structure has a light-scattering structure on that side of the mirror layer structure which lies toward the optically translucent layer structure.

Abstract: An organic light-emitting diode (1), comprising a layer stack (2) for emitting electromagnetic radiation (6). An electrically conductive first connection layer (4) is arranged on a first surface of the layer stack (2) and an electrically conductive second connection layer (5) at least predominantly transparent to a characteristic wavelength of the emittable electromagnetic radiation (6) is arranged on a second surface of the layer stack (2). The organic light-emitting diode is characterized by a conductive contact structure (7) arranged on the opposite side of the first connection layer (4) from the layer stack, which contact structure is connected electrically to the second connection layer (5) in the region of a plurality of openings (12) in the first connection layer (4). Also disclosed is a contact arrangement (15) for a two-dimensional, optically active element and to a method of producing organic light-emitting diodes (1).

Abstract: The invention relates to a method for producing dimeric and/or trimeric silicon compounds, in particular silicon halogen compounds. The claimed method is also suitable for producing corresponding germanium compounds. The invention also relates to a device for carrying out said method to the use of the produced silicon compounds.

Abstract: The invention relates to a method for producing hexachlorodisilane or Ge2CI6, which is characterized in that, in a gas containing SiCI4 or GeCI4, a) a non-thermal plasma is generated by means of an alternating voltage of the frequency f, and wherein at least one electromagnetic pulse having the repetition rate g is coupled into the plasma, the voltage component of which pulse has an edge steepness in the rising edge of 10 V ns-1 to 1 kV ns-1 and a pulse width b of 500 ns to 100 ?s, wherein a liquid phase is obtained, and b) pure hexachlorodisilane or Ge2Cl6 is obtained from the liquid phase.

Abstract: A light-emitting component may include: a first electrode; an organic electroluminescent layer structure on or over the first electrode; a second translucent electrode on or over the organic electroluminescent layer structure; and a mirror layer structure on or over the second electrode, wherein the mirror layer structure has a lateral thermal conductance of at least 1*10?3 W/K.

Abstract: The invention relates to a method for producing dimeric and/or trimeric silicon compounds, in particular silicon halogen compounds. The claimed method is also suitable for producing corresponding germanium compounds. The invention also relates to a device for carrying out said method to the use of the produced silicon compounds.

Abstract: An optoelectronic component may include: at least one layer of the optoelectronic component; at least one adhesive on the layer of the optoelectronic component; and a cover on the at least one adhesive; wherein the at least one adhesive is cured only in a partial region above at least one of a substrate and the layer.

Abstract: The present invention relates to a process for producing SiO2 mouldings, comprising the preparation of a free-flowing aqueous SiO2 composition, solidification of the aqueous SiO2 composition and drying of the solidified SiO2 composition, wherein the aqueous SiO2 composition is a self-assembly composition. The present invention further relates to a moulding obtainable by the process according to the invention.