Patents by Inventor Ethan Lee

Ethan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12745825
    Abstract: An outsole for an article of footwear includes a plantar surface and a peripheral surface surrounding the plantar surface. The outsole for an article of footwear also includes an annular cleat set including a first plurality of traction elements arranged in series about a central axis on the plantar surface. The outsole for an article of footwear further includes one or more radial cleat sets each including a second plurality of the traction elements aligned along a respective radial axis intersecting the central axis. At least one of the second plurality of the traction elements includes a peripheral cleat formed on the peripheral surface.
    Type: Grant
    Filed: November 15, 2024
    Date of Patent: September 29, 2026
    Assignee: NIKE, INC.
    Inventors: Mike Ekstrom, Elizabeth Fulkerson, John Hlavacs, Ethan Lee, Ricardo Salinas, Jr., Darlan Zacharia, Michael J. Hass
  • Publication number: 20260022830
    Abstract: A power supply device having a thermal insulation function includes a circuit board, and at least one heat-sensitive component and a plurality of heat-generating electronic components that are disposed on the circuit board and spaced apart from one another. A minimum distance between the heat-sensitive component and the heat-generating electronic components is 7 mm. A thermal insulation area is defined between the heat-sensitive component and the heat-generating electronic components, and none of the heat-generating electronic components is disposed within a 270° range of the thermal insulation area. The heat-generating electronic components are disposed outside the thermal insulation area to separate the heat-sensitive component from a heat source on the circuit board, such that a high temperature of the heat source has less influence on the heat-sensitive component.
    Type: Application
    Filed: September 25, 2025
    Publication date: January 22, 2026
    Inventors: JERRYSON LEE, Ethan Lee, Yu-Jia Huang, KUO-SUNG HUANG
  • Patent number: D1090506
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: August 26, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Duyeong Choi, Jaewoong Chung, Ethan Lee, Seonkeun Park, Jungwon Lee, Seungjoon Lee
  • Patent number: D1090508
    Type: Grant
    Filed: March 28, 2023
    Date of Patent: August 26, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ethan Lee, Jaewoong Chung, Seonkeun Park, Duyeong Choi
  • Patent number: D1091096
    Type: Grant
    Filed: January 12, 2024
    Date of Patent: September 2, 2025
    Assignee: NIKE, Inc.
    Inventor: Ethan Lee
  • Patent number: D1092031
    Type: Grant
    Filed: January 12, 2024
    Date of Patent: September 9, 2025
    Assignee: NIKE, Inc.
    Inventor: Ethan Lee
  • Patent number: D1096098
    Type: Grant
    Filed: March 15, 2024
    Date of Patent: October 7, 2025
    Assignee: NIKE, Inc.
    Inventors: Ethan Lee, Megan York
  • Patent number: D1096114
    Type: Grant
    Filed: March 15, 2024
    Date of Patent: October 7, 2025
    Assignee: NIKE, Inc.
    Inventor: Ethan Lee
  • Patent number: D1097495
    Type: Grant
    Filed: March 15, 2024
    Date of Patent: October 14, 2025
    Assignee: NIKE, Inc.
    Inventors: Ethan Lee, Megan York
  • Patent number: D1100461
    Type: Grant
    Filed: March 20, 2024
    Date of Patent: November 4, 2025
    Assignee: NIKE, Inc.
    Inventors: Ethan Lee, Megan York
  • Patent number: D1101386
    Type: Grant
    Filed: March 20, 2024
    Date of Patent: November 11, 2025
    Assignee: NIKE, Inc.
    Inventors: Ethan Lee, Megan York
  • Patent number: D1106196
    Type: Grant
    Filed: February 26, 2024
    Date of Patent: December 16, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaewoong Chung, Duyeong Choi, Seonkeun Park, Ethan Lee, Jungwon Lee, Seungjoon Lee
  • Patent number: D1103600
    Type: Grant
    Filed: June 6, 2024
    Date of Patent: December 2, 2025
    Assignee: NIKE, Inc.
    Inventors: Ethan Lee, Zack Matthews
  • Patent number: D1103601
    Type: Grant
    Filed: June 6, 2024
    Date of Patent: December 2, 2025
    Assignee: NIKE, Inc.
    Inventors: Ethan Lee, Zack Matthews
  • Patent number: D1138087
    Type: Grant
    Filed: August 29, 2025
    Date of Patent: August 4, 2026
    Assignee: NIKE, Inc.
    Inventors: Ethan Lee, Matthew C. Palmer
  • Patent number: D1142283
    Type: Grant
    Filed: April 17, 2025
    Date of Patent: August 18, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaewoong Chung, Duyeong Choi, Seonkeun Park, Ethan Lee, Jungwon Lee, Seungjoon Lee
  • Patent number: D1142332
    Type: Grant
    Filed: August 1, 2025
    Date of Patent: August 18, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Duyeong Choi, Jaewoong Chung, Ethan Lee, Seonkeun Park, Jungwon Lee, Seungjoon Lee
  • Patent number: D1144306
    Type: Grant
    Filed: August 1, 2025
    Date of Patent: August 25, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Duyeong Choi, Jaewoong Chung, Ethan Lee, Seonkeun Park, Jungwon Lee, Seungjoon Lee
  • Patent number: D1146268
    Type: Grant
    Filed: August 29, 2025
    Date of Patent: September 8, 2026
    Assignee: NIKE, Inc.
    Inventors: Ethan Lee, Matthew C. Palmer
  • Patent number: D1146269
    Type: Grant
    Filed: August 29, 2025
    Date of Patent: September 8, 2026
    Assignee: NIKE, Inc.
    Inventors: Ethan Lee, Matthew C. Palmer