Abstract: The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 50 to 95 wt % of a mixture comprising the specific polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.510 to 1.539; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% by weight; wherein the content of (A1) in the mixture (A) is >50 wt %, if the ratio is ?2/?1>1 and the content of (A2) in the mixture (A) is >50 wt %, if the ratio is ?2/?1?1, where ?1=n(A1)?n(B) applies and ?2=n(B)?n(A2) applies; wherein the transparent polyamides (A1) and (A2) have a transparency of at least 90% and a haze of at most 3%; and wherein the mixture (A) has a transparency of at least 88% and a haze of at most 5%. The present invention furthermore relates to molded bodies composed of these polyamide molding compounds.

Abstract: The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 50 to 95 wt % of a mixture comprising the specific polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.540 to 1.600; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% by weight; wherein the content of (A1) in the mixture (A) is >50 wt %, if the ratio is ?2/?1>1 and the content of (A2) in the mixture (A) is >50 wt %, if the ratio is ?2/?1?1, where ?1=n(A1)?n(B) applies and ?2=n(B)?n(A2) applies; wherein the transparent polyamides (A1) and (A2) have a transparency of at least 90% and a haze of at most 3%; and wherein the mixture (A) has a transparency of at least 88% and a haze of at most 5%. The present invention additionally relates to molded bodies composed of these polyamide molding compounds.

Abstract: The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 40 to 95 wt % of a specific polyamide mixture consisting of the polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.540 to 1.600; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% wt %; wherein the at least one transparent polyamide (A2) has a transparency of at least 90% and a haze of at most 3%. The present invention additionally relates to molded bodies composed of this polyamide molding compound.

Abstract: Thermoplastic, flameproof plastic molding materials are described having improved mechanical properties and improved surface properties, in particular for use in LDS. The thermoplastic molding compound consists of: (A) 30-84.9% by weight of a thermoplastic polymer mixture, comprising (A1) 50-90% by weight of a partially aromatic, partially crystalline polyamide or a mixture of such polyamides; (A2) 5-50% by weight of a polyphenylether or a mixture of such polyphenylethers; (A3) 0-40% by weight of a partially crystalline, aliphatic polyamide, wherein (A1)-(A3) add up to 100% by weight of component (A); (B) 15-60% by weight of glass fibers; (C) 0.1%-10% by weight of a LDS additive or a mixture of LDS additives, wherein at least one LDS additive is composed entirely or partially of inorganic compounds of copper and/or tin; (D) 0-40% by weight of a particulate filler different from (C); (F) 0-5% by weight of other additional additives; wherein the sum of (A)-(E) amounts to 100% by weight.

Abstract: The invention relates to microwave-resistant mouldings comprising at least one amorphous or microcrystalline copolyamide moulding compound, comprising at least one amorphous or microcrystalline copolyamide (A), said copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine, (b) 0.25 to 30 mol % of at least one dimeric fatty acid and (c) at least one aromatic dicarboxylic acid, where the proportions of all the monomers add up to 100 mol % and which has a glass transition temperature of at least 155° C. and a dielectric loss factor tan ? of not more than 8.30×10?3. The invention also relates to the use of an amorphous or microcrystalline copolyamide moulding compound comprising the copolyamide (A) for production of microwave-resistant mouldings.

Abstract: The present invention relates to an amorphous or microcrystalline copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine; (b) 0.25 to 4.4 mol % of at least one dimeric fatty acid; and (c) 12 to 49.75 mol % of at least one aromatic dicarboxylic acid selected from the group consisting of isophthalic acid, terephthalic acid and naphthalenedicarboxylic acid, and (d) 0 to 37.75 mol % of at least one aliphatic dicarboxylic acid; where the molar proportion of isophthalic acid is at least equal to the molar proportion of terephthalic acid, and where the monomers (b), (c) and optionally (d) add up to 50 mol % and the molar proportions of all the monomers present in the copolyamide (A) add up to 100 mol %. The invention further relates to moulding compounds comprising the copolyamide (A), to mouldings made therefrom and to the use thereof.

Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Abstract: The invention relates to polyamide moulding compounds comprising the following components: a) 50 to 95% by weight of a single amorphous copolyamide constructed from monomers a1) to a6), b) 5 to 50% by weight of at least one glass filler, c) 0 to 15% by weight of at least one monomeric lactam and/or polyamide 12, d) 0 to 19% by weight of additives, the sum of components a) to d) producing 100% by weight. Furthermore, the invention relates to moulded articles made of this polyamide moulding compound.

Abstract: Thermoplastic, flame-retarded plastic molding compounds with improved mechanical properties, in particular for LDS applications, are described. The thermoplastic molding compound consists of: (A) 21-81.9 wt. % thermoplastic material, consisting of (A1) 55-100 wt. % polyamide, containing at least 50 wt. % partly aromatic, partly crystalline polyamide; (A2) 0-45 wt. % non-polyamide based thermoplastic material, wherein (A1) and (A2) add up to 100 wt. % component (A); (B) 10-70 wt. % glass fibers; (C) 0.1-10 wt. % LDS additive or a mixture of LDS additives; (D) 8-18 wt. % halogen-free flame retardant; (E) 0-40 wt. % particulate filler, different from (C); (F) 0-2 wt. % other further additives; wherein the sum of (A)-(F) makes up 100 wt. %.

Abstract: The invention relates to a polyamide molding composition which comprises an amorphous polyamide, a partially crystalline, aliphatic polyamide and also glass fibers for reinforcement. Furthermore, the polyamide molding composition according to the invention comprises a polyamide made of a cycloaliphatic diamine and a dimerized fatty acid. The polyamide molding compositions according to the invention are used in the production of electrical or electronic components, housings or housing components.

Abstract: The invention relates to a polyamide molding composition which comprises a partially aromatic polyamide and also a mixture of at least two UV absorbers. The invention likewise relates to molded articles which comprise corresponding polyamide molding compositions.

Abstract: A polyamide molding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at least 2. The composition contains 30-100% by weight of a polyamide or a polyamide mixture, consisting of 50-100% by weight of at least one amorphous and/or microcrystalline polyamide having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms, and 0-50% by weight of at least one semi-aromatic polyamide. In addition, the molding composition comprises any of inorganic white pigments, fillers, impact toughness modifier and/or flame retardants.

Abstract: Thermoplastic, flameproof plastic molding materials are described having improved mechanical properties and improved surface properties, in particular for use in LDS. The thermoplastic molding compound consists of: (A) 30-84.9% by weight of a thermoplastic polymer mixture, comprising (A1) 50-90% by weight of a partially aromatic, partially crystalline polyamide or a mixture of such polyamides; (A2) 5-50% by weight of a polyphenylether or a mixture of such polyphenylethers; (A3) 0-40% by weight of a partially crystalline, aliphatic polyamide, wherein (A1)-(A3) add up to 100% by weight of component (A); (B) 15-60% by weight of glass fibers; (C) 0.1%-10% by weight of a LDS additive or a mixture of LDS additives, wherein at least one LDS additive is composed entirely or partially of inorganic compounds of copper and/or tin; (D) 0-40% by weight of a particulate filler different from (C); (F) 0-5% by weight of other additional additives; wherein the sum of (A)-(E) amounts to 100% by weight.

Abstract: What is described is the use of a polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at least 2. Here, the composition contains 30-100% by weight of a polyamide or a polyamide mixture, consisting of 50-100% by weight of at least one amorphous and/or microcrystalline polyamide having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms, and 0-50% by weight of at least one semi-aromatic polyamide. In addition, 0-70% by weight of fibrous fillers (B1) and/or particulate fillers (B2), 0-30% by weight of impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant, and 0-3% by weight of additives may also be contained.

Abstract: A polyamide molding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at most 15. The composition contains 30-100% by weight of a polyamide mixture, consisting of more than 50 and up to 98% by weight of at least one semi-aromatic polyamide comprising 2 to up to 50% by weight of amorphous and/or microcrystalline polyamides having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms. In addition, the composition comprises inorganic white pigments, fibrous or particulate additives, impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant.

Abstract: What is described is the use of a polyamide molding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at most 15. Here, the composition contains 30-100% by weight of a polyamide mixture, consisting of more than 50 and up to 98% by weight of at least one semi-aromatic polyamide comprising 2 to up to 50% by weight of amorphous and/or microcrystalline polyamides having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms. In addition, 0-70% by weight of fibrous additives (B1) and/or particulate additives (B2), 0-30% by weight of impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant, and 0-3% by weight of additives may also be contained.

Abstract: The invention relates to a polyamide moulding composition which comprises an amorphous polyamide, a partially crystalline, aliphatic polyamide and also glass fibres for reinforcement. Furthermore, the polyamide moulding composition according to the invention comprises a polyamide made of a cycloaliphatic diamine and a dimerised fatty acid. The polyamide moulding compositions according to the invention are used in the production of electrical or electronic components, housings or housing components.

Abstract: The invention relates to a polyamide moulding composition which comprises a partially aromatic polyamide and also a mixture of at least two UV absorbers. The invention likewise relates to moulded articles which comprise corresponding polyamide moulding compositions.

Abstract: A polyamide molding material with the following composition is proposed: (a) 20 to 85% by weight of at least one semi-crystalline polyamide; (b) 4 to 18% by weight of carbon fibers with a fiber diameter in the range of 2 to 10 ?m; (c) 10 to 60% by weight of at least one particulate mineral or saline filler; (d) 3 to 30% by weight of at least one amorphous polymer with a glass transition temperature of at least 45° C. determined according to ISO 11357; (e) 0 to 20% by weight of carbon black; (f) 0 to 20% by weight of at least one further additive and/or addition agent; wherein the components (a) to (f) add up in total to 100% by weight.

Abstract: Thermoplastic, flame-retarded plastic moulding compounds with improved mechanical properties, in particular for LDS applications, are described. The thermoplastic moulding compound consists of: (A) 21-81.9 wt. % thermoplastic material, consisting of (A1) 55-100 wt. % polyamide, containing at least 50 wt. % partly aromatic, partly crystalline polyamide; (A2) 0-45 wt. % non-polyamide based thermoplastic material, wherein (A1) and (A2) add up to 100 wt. % component (A); (B) 10-70 wt. % glass fibres; (C) 0.1-10 wt. % LDS additive or a mixture of LDS additives; (D) 8-18 wt. % halogen-free flame retardant; (E) 0-40 wt. % particulate filler, different from (C); (F) 0-2 wt. % other further additives; wherein the sum of (A)-(F) makes up 100 wt. %.