Abstract: Polyamide molding materials for transparent molding parts. The materials comprise transparent copolyamides that contain: (A) 40 to 100 wt % of at least one transparent copolyamide with a glass transition temperature (Tg) of at least 80° C. and not more than 150° C., composed of at least two diamines that are different from each other, wherein the at least two diamines are a mixture of (a) 50 to 90 mol % bis-(4-amino-3-methylcyclohexyl)methane (MACM) and/or bis-(4-amino-3-ethylcyclohexyl)methane (EACM) and/or bis-(4-amino-3,5-dimethylcyclohexyl)methane (TMACM) and b) 10 to 50 mol % aliphatic diamine having 9 to 14 carbon atoms, in particular decandiamine, particularly preferably at least 20 mol % decandiamine, each relative to the total amount of diamines, and of one or more aliphatic dicarboxylic acids, having 6 to 36 carbon atoms, (B) 0 to 60 wt % of at least one further polymer, (C) 0 to 10 wt % of additives, the sum of the components (A), (B) and (C) totaling 100% by weight.

Abstract: What is described is the use of a polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at least 2. Here, the composition contains 30-100% by weight of a polyamide or a polyamide mixture, consisting of 50-100% by weight of at least one amorphous and/or microcrystalline polyamide having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms, and 0-50% by weight of at least one semi-aromatic polyamide. In addition the moulding composition comprises 0.01-20% by weight of one or several inorganic white pigments.

Abstract: What is described is the use of a polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at least 2. Here, the composition contains 30-100% by weight of a polyamide or a polyamide mixture, consisting of 50-100% by weight of at least one amorphous and/or microcrystalline polyamide having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms, and 0-50% by weight of at least one semi-aromatic polyamide. In addition, 0-70% by weight of fibrous fillers (B1) and/or particulate fillers (B2), 0-30% by weight of impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant, and 0-3% by weight of additives may also be contained.

Abstract: A polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at most 15. The composition contains 30-100% by weight of a polyamide mixture, consisting of more than 50 and up to 98% by weight of at least one semi-aromatic polyamide comprising 2 to up to 50% by weight of amorphous and/or microcrystalline polyamides having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms. In addition, the composition comprises inorganic white pigments. fibrous or particulate additives, impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant.

Abstract: What is described is the use of a polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at most 15. Here, the composition contains 30-100% by weight of a polyamide mixture, consisting of more than 50 and up to 98% by weight of at least one semi-aromatic polyamide comprising 2 to up to 50% by weight of amorphous and/or microcrystalline polyamides having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms. In addition, 0-70% by weight of fibrous additives (B1) and/or particulate additives (B2), 0-30% by weight of impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant, and 0-3% by weight of additives may also be contained.

Abstract: Polyamide moulding compounds for the production of unvarnished moulded articles with a high-gloss surface and outstandin toughness are provided. By means of moulded articles which are produced with very high surface quality from the moulding compounds, the complex, cost-intensive and frequently environmentally impacting varnishing processes can be avoided.

Abstract: Filled polyamide molding materials, in particular polyamide molding materials with medium filler content, are producible from a polyamide blend and for example by compounding with chopped or endless fibers on two-screw extruders, and have a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part, such as an antenna housings of stationary or mobile communication devices. These thermoplastic polyamide molding materials are suitable for manufacturing molded parts and other semi-finished or finished parts, for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.

Abstract: The invention discloses novel polyamide moulding materials which are characterized by a significantly improved processability, in particular in injection-moulding, an acceptable deformation in climatic testing, a very high transparency, low haze and even an increased biobased content. The polyamide moulding materials on the basis of transparent copolyamides for producing transparent moulding parts having a high tenacity, low water absorption and low distorsion in climatic testing contain: (A) 40 to 100 percent by weight of at least one transparent copolyamide with a glass transition temperature (Tg) of at least 80 ° C. and not more than 150 ° C.

Abstract: Filled polyamide molding materials, in particular polyamide molding materials with medium filler content, are producible from a polyamide blend and for example by compounding with chopped or endless fibers on two-screw extruders, and have a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part, such as an antenna housings of stationary or mobile communication devices. These thermoplastic polyamide molding materials are suitable for manufacturing molded parts and other semi-finished or finished parts, for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.

Abstract: The invention relates to a polyamide moulding compound, containing a) 95 to 5% by weight of an amorphous copolyamide of the formula PA MACMI/MACMT/12 ?with a MACMI proportion in the copolyamide in the range of 5 to 95% by weight, MACMT proportion in the range of 0 to 90% by weight and LC12 proportion in the range of 5 to 60% by weight, the sum of these three proportions in the copolyamide a) being 100% by weight, b) 5 to 95% by weight of an amorphous or microcrystalline or partially crystalline polyamide of the formula PA(MACMX)x/(PACMY)y/(MXDU)u/(LCZ)z ?the proportions x, y, u and z of the four monomer groups being respectively between 0 and 100% by weight, the sum of these four proportions in polyamide b) being 100% by weight; X, Y and U meaning dicarboxylic acids, selected from the group comprising DC4, DC6, DC9, DC10, DC11, DC12, DC13, DC14, DC15 to DC36, and LCZ lactams or corresponding amino carboxylic acids selected from the group comprising LC4, LC6, LC11 and LC12, c) 1 to 30% by weight at

Abstract: The present invention relates to filled polyamide molding materials, in particular polyamide molding materials with medium filler content, which are producible from a polyamide blend and for example by compounding with chopped or endless fibers on two-screw extruders, and have a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part, such as an antenna housings of stationary or mobile communication devices. The thermoplastic polyamide molding materials according to the present invention are suitable for manufacturing molded parts and other semi-finished or finished parts, for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.

Abstract: The invention relates to a thermoplastically processible molding material with a two-phase matrix of a partially aromatic copolyamide and an aliphatic polyamide or copolyamide containing permanently magnetic or magnetizable fillers, as well as to a method for producing this molding material and using it for producing molded parts.

Abstract: Flow lines are eliminated from workpieces injection-molded from liquid crystal polymers, fiber-filled or mineral-filled thermoplastics by selecting a liquified polymer having a linear coefficient of thermal expansion less than (2-6).times.10.sup.-6 /.degree.K, providing a flow path in a mold for the polymer in two directions around a core in the mold, and subjecting the polymer to a shearing energy only simultaneously with mold filling over at least part of the flow path, whereby molecules of the polymer are disoriented and fail to produce a rigid alignment.

Abstract: An adhesive is to be provided of which one component can be stored virtually with exclusion of air, in anaerobicform, for a prolonged period, and can thus be introduced into the sleeve of an optical connector in a production operation, and the second component of which can be introduced into the first component with the fiber at the assembly site. This is achieved by an adhesive consisting of at least two components, in which the reaction is initiated by interface contact of the two components. For this purpose the two components each comprise unsaturated compounds which are dissolved in mono- and/or polyfunctional acrylates. One component of the adhesive comprises an organometallic compound and the other component an unsaturated dicarboxylic acid and peroxide.