Abstract: There are provided a process for producing a two-layered tape for TAB, which comprises forming desired holes in a semi-cured polyamic acid film formed on a release film or in a semi-cured polyamic acid film subjected to stretching of 10% or more, then pressure-bonding the resulting film or film laminate to a conductor foil or a conductor foil on which a semi-cured light-transmittable polyamic acid film is formed, so that the polyamic acid film and the conductor foil contact with each other or the two polyamic acid films contact with each other, conducting imidization, and thereafter forming a desired pattern in the conductor foil; a process for producing a stretched polyamic acid film by subjecting a polyamic acid film to stretching of 10% or more; and a process for producing a flexible base board for printed circuit or a flexible printed circuit board with a cover layer, both using said stretched polyamic acid film.

Abstract: The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a polyamic acid) as a component for imparting improved adhesion, flexibility or heat resistance, and a diazoquinone compound and/or a dihydropyridine compound as a photosensitive agent. This photo-sensitive resin composition can form a pattern of high resolution and further has excellent adhesion and mechanical properties. The present invention further provides three novel diazoquinone compounds as a photo-sensitive agent, which compounds give high resolution, high contrast and thick-film formability when compounded in a positive photo-sensitive resin composition. The present invention furthermore provides a new type positive photo-sensitive resin composition obtained by reacting a polybenzoxazole precursor with a diazoquinone compound as a photo-sensitive agent.

Abstract: The present invention provides a photosensitive resin composition which comprises as essential components:(A) a polyamic acid having a recurring unit represented by the following formula [I]: ##STR1## wherein 0.5-50 mol % of R.sub.1 consists of a silicone diamine residue represented by the following formula [II]: ##STR2## wherein n represents an integer of 1-50, and the remainder of 50-99.5 mol % of R.sub.1 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, and a heterocyclic group, and R.sub.2 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, a heterocyclic group, and a silicone group, and m represents 1 or 2,(B) an amide compound having carbon-carbon double bond, and(C) a photosensitizer.The present invention further provides a semiconductor apparatus in which the above composition is used.

Abstract: The present invention provides a photosensitive resin composition which comprises, as essential components:(A) a polyamic acid having a recurring unit represented by the following formula [I]: ##STR1## wherein R.sub.1 and R.sub.2 each represents an organic group selected from the group consisting of an aromatic group, an alicyclic group, an aliphatic group, and a heterocyclic group and m is 1 or 2,(B) an amide compound having carbon-carbon double bond, and(C) a photosensitizer.