Abstract: Systems and methods for improving loading and unloading of a read or write head onto and off of a disk medium. Particular embodiments may assist in loading a read or write head to, or unloading a read or write head from, a load location over a surface of a disk medium in such a manner that damage to the surface of the disk medium (e.g., load location) is either prevented or minimized. The prevention or reduction of damage may be achieved by ensuring that a read or write head has sufficient clearance over the surface of a disk medium as the read or write head moves over the surface (e.g., as the head moves parallel to the surface) during a head loading or unloading process.

Abstract: Systems and methods for improving loading and unloading of a read or write head onto and off of a disk medium. Particular embodiments may assist in loading a read or write head to, or unloading a read or write head from, a load location over a surface of a disk medium in such a manner that damage to the surface of the disk medium (e.g., load location) is either prevented or minimized. The prevention or reduction of damage may be achieved by ensuring that a read or write head has sufficient clearance over the surface of a disk medium as the read or write head moves over the surface (e.g., as the head moves parallel to the surface) during a head loading or unloading process.

Abstract: There is provided a copper-base alloy useful for coinage that has a golden visual appearance. The material has a transverse electrical conductivity substantially similar to that of copper alloy C713 and when clad to a copper alloy C110 core, a transverse electrical conductivity substantially similar to both sides of a Susan B. Anthony United States dollar coin. The copper-base alloy is a copper-manganese-zinc-nickel alloy.

Abstract: A composite lead-free bullet is disclosed comprising a heavy constituents selected from the group of tungsten, tungsten carbide, carballoy, and ferro-tungsten and a second binder constituent consisting of either a metal alloy or a plastic blend.

Abstract: A composite lead-free bullet is disclosed comprising a heavy constituents selected from the group of tungsten, tungsten carbide, carballoy, and ferro-tungsten and a second binder constituent consisting of either a metal alloy or a plastic blend.

Abstract: A thin interface pellicle probe for making temporary or permanent interconnections to pads or bumps on a semiconductor device wherein the pads or bumps may be arranged in high density patterns is described incorporating an electrode for each pad or bump wherein the electrode has a raised portion thereon for penetrating the surface of the pad or bump to create sidewalls to provide a clean contact surface and the electrode has a recessed surface to limit the penetration of the raised portion. The electrodes may be affixed to a thin flexible membrane to permit each contact to have independent movement over a limited distance and of a limited rotation. The invention overcomes the problem of making easily breakable electrical interconnections to high density arrays of pads or bumps on integrated circuit structures for testing, burn-in or package interconnect and testing applications.

Abstract: A metal extrusion process and apparatus therefor in which a strip material of a rectangular shape may be produced by maintaining frictional engagement of the metal by passageway-defining surfaces of a member which is moved toward a die such that the frictional drag of the passageway-defining surfaces urges the metal through the die. The process utilizes strip material as the starting material which enables the extrusion of metal strip by the frictional drag process to be accomplished.

Abstract: The present invention discloses a rigid magnetic recording disk and a method of making the same. The substrate is formed by metallurgically bonding at least a first and second layer of clad materials. The hardness and mechanical strength of the first layer is substantially greater than the second layer. The first layer has a thickness which is from about 0.2% to about 20% the thickness of the second layer. The unbonded surface of the first layer is substantially flat and asperity free. The second layer is less dense than the first layer. A magnetic layer is deposited on the unbonded surface of the first layer.

Abstract: In a data processing system including a relatively large, page-formatted memory, memory control functions are distributed over a plurality of microprocessors connected in an array with each microprocessor controlling a respective area of the large memory. Upon overflow of its assigned memory area, a microprocessor may "borrow" free memory space assigned to one of its neighbors in the microprocessor array. Memory control functions with respect to different areas in the memory can effectively be performed in parallel, thus improving the operating efficiency.

Abstract: The present invention relates to composites having excellent combinations of bending strength, electrical conductivity, stress relaxation in bending and bend formability and having particular utility in electrical connector applications. The composites of the present invention have a core formed from a copper base alloy having an electrical conductivity of at least about 80% IACS and a clad formed from a copper-nickel alloy containing more than about 30% by weight nickel. Preferred composites are triclad composites formed from copper alloy C151 and MONEL 400 and having clad layer thicknesses of at least about 10%, most preferably at least about 20%, of the overall composite thickness.

Abstract: The present invention relates to an optical fiber cable for use in motor vehicle applications. The cable comprises at least one optical fiber encapsulated within a tubular structure formed from a metal or metal alloy having a thermal conductivity in excess of about 20 BTU/ft.sup.2 /ft/hr/.degree.F. at 68.degree. F. The metal tube surrounding the optical fiber(s) functions as a heat sink for conducting heat away from the fiber(s).

Abstract: The present invention relates to a process for maintaining the fine grain size of and providing excellent bend formability, hot ductility and strength properties to a copper-nickel-manganese alloy to be exposed to elevated temperatures. The process of the present invention includes a final cold working step during which the material to be fabricated into a desired article and/or exposed to the elevated temperatures has its thickness reduced by about 4% to about 30%, preferably from about 5% to about 25%. The alloys described herein have particular utility in brazed articles or assemblies.

Abstract: The present invention is directed to a cermet material comprising a matrix of aluminum alloy with ceramic particles distributed therein. The cermet is adapted for use as a semiconductor substrate and is manufactured using powder technology procedures. The cermet comprises from about 40 to about 60 volume % of aluminum or aluminum alloy, from an effective amount up to about 10 volume % of binder for enhancing bonding between the aluminum alloy and ceramic particles, and the balance essentially ceramic particles.

Abstract: The present invention is directed to a cermet material comprising a matrix of aluminum alloy with ceramic particles distributed therein. The cermet is adapted for use as a semiconductor substrate and is manufactured using powder technology procedures. The cermet comprises from about 40 to about 60 volume % of aluminum or aluminum alloy, from an effective amount up to about 10 volume % of binder for enhancing bonding between the aluminum alloy and ceramic particles, and the balance essentially ceramic particles.

Abstract: The present invention relates to composites having excellent combinations of bending strength, electrical conductivity, stress relaxation in bending and bend formability and having particular utility in electrical connector applications. The composites of the present invention have a core formed from a copper base alloy having an electrical conductivity of at least about 80% IACS and a clad formed from a copper-nickel alloy containing more than about 30% by weight nickel. Preferred composites are triclad composites formed from copper alloy C151 and MONEL 400 and having clad layer thicknesses of at least about 10%, most preferably at least about 20%, of the overall composite thickness.

Abstract: The present invention relates to a copper base alloy consisting essentially of from about 3.5% to about 6.0% aluminum, from about 0.1% to about 3.0% nickel, from about 0.03% to about 1.0% magnesium and the balance essentially copper. The alloys of the present invention have been found to be cost effective and easily processable. They have also been found to have particular utility in electronic and electrical applications such as electrical connectors.

Abstract: The present invention relates to iron-nickel alloys having improved glass sealing properties. Alloys of the present invention contain from about 30% to about 60% nickel, from about 0.5% to about 3% silicon, from about 0.5% to about 3.5% aluminum and the balance essentially iron. Preferably, the alloys have a total aluminum plus silicon content of less than about 4%. The alloys of the present invention have particular utility in electronic and electrical applications. For example, they may be used as a lead frame or a similar component in a semiconductor package.

Abstract: The present invention relates to copper-silicon-tin alloys having improved cleanability. These alloys consist essentially of from about 1.0% to about 5.0% tin, from about 1.0% to about 4.5% silicon, an element selected from the group consisting of from about 0.05% to about 0.5% magnesium and from about 0.01% to about 0.5% lithium, and the balance essentially copper. The alloys may also contain from about 0.01% to about 0.45% chromium.

Abstract: The present invention relates to a process and apparatus for fabricating optical fiber cables having improved hermeticity. The optical fiber cables are formed by first reducing the water content of the buffer material surrounding each optical fiber. Thereafter, the dried optical fiber(s) are encapsulated into a metal or metal alloy tube. After fiber encapsulation, the tube may be sealed to prevent the ingress of moisture and/or water from the surrounding environment.

Abstract: Method and apparatus for the physical design of very large scale integrated (VLSI) circuits, and in particular the interconnection and wire routing between circuits formed on a chip. Apparatus is set forth for determining the wire routings in a VLSI circuit comprised of cells, wherein the cells are composed of electronic devices functioning as logic gates. Groups of cells may be interconnected to function as flip flops, shift registers and the like. A supervisory controller communicates with n, where n is an integer, identical multi-port processors, with one processor dedicated to each cell, for determining the wire routings between the respective cells. Each processor communicates simultaneously with its four adjacent neighbor processors to determine channel routings from one point to the next in the array of cells, wherein a channel routing includes vertical and horizontal paths. Following determination of global channel routings, exact vertical and horizontal tracks for the wire paths are assigned.