Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and external electrodes, wherein the body includes an active portion, a side margin portion covering at least one of a first surface and a second surface of the active portion opposing each other in a second direction, and a cover portion covering the active portion in the first direction, respective dielectric layers among the plurality of dielectric layers include a barium titanate-based composition, the dielectric layer of the side margin portion includes Sn, and a content of Sn in the dielectric layer of the side margin portion is different from that of Sn in the dielectric layer of the active portion, and the dielectric layer of the side margin portion includes at least some grains having a core-shell structure.

Abstract: One aspect of the present invention relates to an ultrahigh-strength steel sheet having an excellent yield ratio, comprising, by wt %, 0.3-0.5% of C, 2.0% (excluding 0%) of Si, 3.0-6.5% of Mn, 0.02% or less of P, 0.01% or less of S, 0.01-3.0% of Al, 0.02% or less (excluding 0%) of N, and the balance of Fe and other inevitable impurities, and a microstructure comprises 5-30% of remaining austenite by area fraction and comprises 5% or less of secondary martensite.

Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each including a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, in which at least one of the first and second lead frames include three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip disposed on the top surface of the first or second lead frame, and the top surfaces of the first and second lead frames are substantially flat.

Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.

Abstract: An electronic device is provided. The electronic device includes a display; a memory for storing at least one audio signal; a communication circuit configured to establish wireless communication with an external device; and a processor electrically connected with the display, the memory, and the communication circuit, wherein the memory stores instructions for, when executed, causing the processor to: produce the at least one audio signal, receive data associated with a gesture through the communication circuit from the external device apply a sound effect, selected based at least in part on the data associated with the gesture, to the produced at least one audio source, and output or store a resulting audio signal, wherein the resulting audio signal represents application of the sound effect to the produced at least one audio signal.

Abstract: A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.

Abstract: An electronic device is provided. The electronic device includes a touch screen display, at least one of a speaker and a sound interface, a processor configured to electrically connect to the touch screen display, the speaker, and the sound interface, and a memory configured to electrically connect to the processor. The memory stores instructions for, when executed, causing the processor to display at least one item comprising a musical instrument shape on the touch screen display, receive a touch input through the touch screen display, load sound data corresponding to the at least one item based on the touch input, process the sound data based at least in part on information associated with the touch input, and output the processed sound data through the speaker or the sound interface.

Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.

Abstract: An electronic device is provided. The electronic device includes a touch screen display, at least one of a speaker and a sound interface, a processor configured to electrically connect to the touch screen display, the speaker, and the sound interface, and a memory configured to electrically connect to the processor. The memory stores instructions for, when executed, causing the processor to display at least one item comprising a musical instrument shape on the touch screen display, receive a touch input through the touch screen display, load sound data corresponding to the at least one item based on the touch input, process the sound data based at least in part on information associated with the touch input, and output the processed sound data through the speaker or the sound interface.

Abstract: An electronic device is provided. The electronic device includes a display; a memory for storing at least one audio signal; a communication circuit configured to establish wireless communication with an external device; and a processor electrically connected with the display, the memory, and the communication circuit, wherein the memory stores instructions for, when executed, causing the processor to: produce the at least one audio signal, receive data associated with a gesture through the communication circuit from the external device apply a sound effect, selected based at least in part on the data associated with the gesture, to the produced at least one audio source, and output or store a resulting audio signal, wherein the resulting audio signal represents application of the sound effect to the produced at least one audio signal.

Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.

Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each including a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, in which at least one of the first and second lead frames include three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip disposed on the top surface of the first or second lead frame, and the top surfaces of the first and second lead frames are substantially flat.

Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each comprising a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, at least one of the first and second lead frames comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip arranged on the first surface of the first or second lead frame, a resin part disposed in the fixing space to support the first and second lead frames, and the first and second lead frames exposed to the outside through bottom surface.

Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.

Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each comprising a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, at least one of the first and second lead frames comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip arranged on the first surface of the first or second lead frame, a resin part disposed in the fixing space to support the first and second lead frames, and the first and second lead frames exposed to the outside through bottom surface.

Abstract: A light-emitting device includes a first lead frame and a second lead frame spaced apart from each other, the first and second lead frames each including a first portion, and a second portion disposed on the first portion, a light-emitting diode chip disposed on the second portion of the first or second lead frame, and a resin at least partially covering the first and second lead frames. The first and second portions of the first lead frame have different planar shapes from each other, the first and second portions of the second lead frame have different planar shapes from each other, and the second portion of the first or second lead frame includes a first fixing element. A first space is disposed between the first portion of the first lead frame and the first portion of the second lead frame, and the first fixing element is disposed on the first space.

Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.

Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Abstract: A light-emitting device includes a first lead frame and a second lead frame spaced apart from each other, the first and second lead frames each including a first portion, and a second portion disposed on the first portion, a light-emitting diode chip disposed on the second portion of the first or second lead frame, and a resin at least partially covering the first and second lead frames. The first and second portions of the first lead frame have different planar shapes from each other, the first and second portions of the second lead frame have different planar shapes from each other, and the second portion of the first or second lead frame includes a first fixing element. A first space is disposed between the first portion of the first lead frame and the first portion of the second lead frame, and the first fixing element is disposed on the first space.

Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.