Patents by Inventor Eun-Jung Seo
Eun-Jung Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150127320Abstract: A method and an apparatus for processing a translation process which can minimize a change of a position of a text and an object and a change of a layout, where are included in original text are provided. A translation method includes identifying original text and translated text in which the original text is translated, and replacing at least one first translation object included in the translated text with a second translation object by comparing a length of the original text and a length of the translated text.Type: ApplicationFiled: November 3, 2014Publication date: May 7, 2015Inventors: Eun-Jung SEO, Gyu-Cheol CHOI
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Patent number: 8963196Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.Type: GrantFiled: January 22, 2014Date of Patent: February 24, 2015Assignee: Seoul Semiconductor Co., Ltd.Inventor: Eun Jung Seo
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Publication number: 20140374788Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.Type: ApplicationFiled: September 8, 2014Publication date: December 25, 2014Inventors: Eun Jung SEO, Jae Ho Cho, Bang Hyun Kim
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Patent number: 8881198Abstract: A method for providing Digital Video Broadcasting-Handheld (DVB-H) and streaming services in a portable terminal includes receiving Electronic Service Guide (ESG) data of DVB-H and displaying a DVB-H channel, confirming whether a field associated with a streaming channel is present in a reserved field of the received ESG data, and if the associated field is present in the ESG data, displaying a steaming channel corresponding to the associated field together with the DVB-H channel.Type: GrantFiled: July 1, 2010Date of Patent: November 4, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Eun-Jung Seo, Jeong-Wook Seo, Hak-Sung Lyou, Bryan Kim
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Publication number: 20140306257Abstract: A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.Type: ApplicationFiled: June 27, 2014Publication date: October 16, 2014Inventors: Chung Hoon LEE, Yoon Hee KIM, Byung Yeol PARK, Bang Hyun KIM, Eun Jung SEO, Hyouk Won KWON
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Patent number: 8829552Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.Type: GrantFiled: June 19, 2013Date of Patent: September 9, 2014Assignee: Seoul Semiconductor Co., Ltd.Inventors: Eun Jung Seo, Jae Ho Cho, Bang Hyun Kim
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Publication number: 20140131762Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.Type: ApplicationFiled: January 22, 2014Publication date: May 15, 2014Applicant: Seoul Semiconductor Co., Ltd.Inventor: Eun Jung SEO
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Publication number: 20140110739Abstract: A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.Type: ApplicationFiled: December 27, 2013Publication date: April 24, 2014Applicant: Seoul Semiconductor Co., Ltd.Inventors: Chung Hoon Lee, Yoon Hee Kim, Byung Yeol Park, Bang Hyun Kim, Eun Jung Seo, Hyouk Won Kwon
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Patent number: 8659050Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.Type: GrantFiled: September 28, 2012Date of Patent: February 25, 2014Assignee: Seoul Semiconductor Co., Ltd.Inventor: Eun Jung Seo
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Publication number: 20130277705Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.Type: ApplicationFiled: June 19, 2013Publication date: October 24, 2013Inventors: Eun Jung SEO, Jae Ho Cho, Bang Hyun Kim
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Patent number: 8558270Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.Type: GrantFiled: May 11, 2011Date of Patent: October 15, 2013Assignee: Seoul Semiconductor Co., Ltd.Inventors: Eun Jung Seo, Jae Ho Cho, Bang Hyun Kim
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Patent number: 8319248Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.Type: GrantFiled: November 18, 2008Date of Patent: November 27, 2012Assignee: Seoul Semiconductor Co., Ltd.Inventor: Eun Jung Seo
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Publication number: 20110210366Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.Type: ApplicationFiled: May 11, 2011Publication date: September 1, 2011Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Eun Jung SEO, Jae Ho CHO, Bang Hyun KIM
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Patent number: 7964943Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.Type: GrantFiled: December 19, 2008Date of Patent: June 21, 2011Assignee: Seoul Semiconductor Co., Ltd.Inventors: Eun Jung Seo, Jae Ho Cho, Bang Hyun Kim
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Publication number: 20110108866Abstract: An LED package is disclosed herein. The disclosed LED package comprises a base having an LED chip mounted thereon, an encapsulation member formed by a light-transmittable resin to encapsulate the LED chip, and a housing formed to expose a top portion of the encapsulation member and to encompass a side surface of the encapsulation member, wherein the encapsulation member is formed by a transfer molding process using a mold to have a predetermined shape. Further, the housing may be light-transmittable.Type: ApplicationFiled: December 2, 2008Publication date: May 12, 2011Applicant: Seoul Semiconductor Col, Ltd.Inventors: Chung Hoon Lee, Yoon Hee Kim, Byung Yeol Park, Bang Hyun Kim, Eun Jung Seo, Hyouk Won Kwon
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Publication number: 20110113456Abstract: A method for providing a digital broadcasting service and a streaming service in a portable terminal is provided. The method include receiving a request for moving a play position of broadcast content provided via the digital broadcasting service, determining whether streaming content corresponding to the broadcast content is available, the streaming content being provided in the streaming service, and playing the streaming content from the moved play position in a streaming fashion.Type: ApplicationFiled: November 12, 2010Publication date: May 12, 2011Applicant: Samsung Electronics Co. Ltd.Inventors: Dong-Hwan JI, Jeong-Wook SEO, Bryan KIM, Eun-Jung SEO
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Publication number: 20110004903Abstract: A method for providing Digital Video Broadcasting-Handheld (DVB-H) and streaming services in a portable terminal includes receiving Electronic Service Guide (ESG) data of DVB-H and displaying a DVB-H channel, confirming whether a field associated with a streaming channel is present in a reserved field of the received ESG data, and if the associated field is present in the ESG data, displaying a steaming channel corresponding to the associated field together with the DVB-H channel.Type: ApplicationFiled: July 1, 2010Publication date: January 6, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eun-Jung SEO, Jeong-Wook SEO, Hak-Sung LYOU, Bryan KIM
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Publication number: 20100270571Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.Type: ApplicationFiled: November 18, 2008Publication date: October 28, 2010Applicant: Seoul Semiconductor Co., Ltd.Inventor: Eun Jung Seo
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Publication number: 20100123156Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.Type: ApplicationFiled: December 19, 2008Publication date: May 20, 2010Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Eun Jung SEO, Jae Ho Cho, Bang Hyun Kim
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Patent number: 7697960Abstract: A method for displaying status information on a mobile terminal is provided. The method comprises the steps of when an event is generated in the mobile terminal, determining whether a function for displaying a character image has been set for the event; if the function has been set, processing the generated event, selecting a character image corresponding to the event in a character memory and displaying an event processing result together with the selected character image; and if the function has not been set, processing the generated event and displaying the event processing result.Type: GrantFiled: April 22, 2005Date of Patent: April 13, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Jeong-Wook Seo, Jong-Kerl Lee, Eun-Jung Seo, Wei-Jin Park