Patents by Inventor Eun Kyu SEONG

Eun Kyu SEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170096566
    Abstract: Provided are a composition for forming a conductive pattern, which enables formation of a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simplified process, a method of forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern includes a polymer resin; and a non-conductive metal compound including a coinage metal element [Group 11 (Group IB)] and a non-metal element, the non-conductive metal compound having a three-dimensional structure formed by vertex sharing of tetrahedrons including the Group 11 metal element, in which a metal core including the Group 11 metal element or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.
    Type: Application
    Filed: August 3, 2015
    Publication date: April 6, 2017
    Applicant: LG CHEM, LTD.
    Inventors: Chee-Sung PARK, Han Nah JEONG, Eun Kyu SEONG, Su Jeong LEE, Ha Na LEE
  • Publication number: 20160254071
    Abstract: The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern on a variety of polymer resin products or resin layers by a significantly simple process, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern includes: a polymer resin; and a non-conductive metal compound including at least one of first and second metals as a predetermined non-conductive metal compound including the first and second metals, wherein a metal core including the first or second metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.
    Type: Application
    Filed: November 28, 2014
    Publication date: September 1, 2016
    Inventors: Chee-Sung PARK, Jae Hyun KIM, Shin Hee JUN, Cheol-Hee PARK, Eun Kyu SEONG, Sang Yun JUNG, Jae Jin KIM, Han Nah JEONG, Su Jeong LEE
  • Publication number: 20160201198
    Abstract: Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers under a relatively low power by a simplified process, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed thereon.
    Type: Application
    Filed: August 7, 2014
    Publication date: July 14, 2016
    Inventors: Jae Hyun KIM, Eun Kyu SEONG, Su Jeong LEE, Jae Jin KIM, Cheol-Hee PARK, Chee-Sung PARK, Shin Hee JUN, Sang Yun JUNG, Han Nah JEONG
  • Publication number: 20160198569
    Abstract: The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern reducing degradation of mechanical physical properties and having excellent adhesion strength, on a polymeric resin product or resin layer, a method for forming a conductive pattern using the same, and a resin component having the conductive pattern. The composition for forming a conductive pattern includes: a polycarbonate-based resin; and particles of a non-conductive metal compound including a first metal and a second metal and having a spinel structure, wherein the particles have a particle diameter of 0.1 to 6 ?m; wherein a metal nuclei including the first metal, the second metal, or an ion thereof is formed from the particles of the non-conductive metal compound by electromagnetic wave irradiation. The non-conductive metal compound may have an average specific surface area of about 0.5 to 10 m2/g, preferably about 0.5 to 8 m2/g, more preferably about 0.7 to about 3 m2/g.
    Type: Application
    Filed: April 16, 2015
    Publication date: July 7, 2016
    Inventors: Shin Hee Jun, Jae Hyun Kim, Cheol-Hee Park, Chee-Sung Park, Jae Jin Kim, Han Nah Jeong, Eun Kyu Seong, Su Jeong Lee
  • Publication number: 20160194759
    Abstract: Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, and appropriately implementing the polymer resin products having white color or various colors, and the like, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed therefrom.
    Type: Application
    Filed: August 7, 2014
    Publication date: July 7, 2016
    Inventors: Jae Hyun KIM, Shin Hee JUN, Jae Jin KIM, Chee-Sung PARK, Eun Kyu SEONG, Su Jeong LEE, Cheol-Hee PARK, Han Nah JEONG, Sang Yun JUNG