Abstract: Disclosed is a method of manufacturing bamboo toothbrush and a toothbrush manufactured thereby. According to the method of manufacturing bamboo toothbrush of a detailed embodiment of the present invention and a toothbrush manufactured by the method, it is possible to improve strength, surface roughness, and moisture resistance of a bamboo and adjust the color of the bamboo using hot pressing. Further, since sanding and polishing and separate coating and drying are not performed, the process time is reduced, whereby the manufacturing cost can be reduced.

Abstract: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

Abstract: The present invention relates to a surface acoustic wave device package and a method of manufacturing the same, and more specifically, to a method of manufacturing a miniaturized surface acoustic wave device package.

Abstract: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

Abstract: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

Abstract: The present invention relates to a surface acoustic wave device package and a method of manufacturing the same, and more specifically, to a method of manufacturing a miniaturized surface acoustic wave device package.

Abstract: A wafer level package includes a substrate including bonding pads and a first protection dam and having a plurality of circuit pattern units disposed on a side; a printed circuit board having a plurality of connection pads, a second protection dam and via holes disposed thereon; and a connection unit connected to some of the plurality of connection pads and the second protection dam disposed on the printed circuit board. Freedom of design can be improved through the wafer level package and the manufacturing method thereof, and reliability of the wafer level package can be improved. The manufacturing process can be simplified as the bridge process is omitted when wiring is designed, and the size of an element may be reduced.

Abstract: A wafer level package includes a substrate including bonding pads and a first protection dam and having a plurality of circuit pattern units disposed on a side; a printed circuit board having a plurality of connection pads, a second protection dam and via holes disposed thereon; and a connection unit connected to some of the plurality of connection pads and the second protection dam disposed on the printed circuit board. Freedom of design can be improved through the wafer level package and the manufacturing method thereof, and reliability of the wafer level package can be improved. The manufacturing process can be simplified as the bridge process is omitted when wiring is designed, and the size of an element may be reduced.

Abstract: A wafer level package includes: a substrate having a circuit pattern unit, a pad spaced apart from the circuit pattern unit, a bonding pad disposed on a side of the pad, and a first protection dam; and a printed circuit board having a connection pad and a second protection dam, where the substrate and the printed circuit board are attached through the bonding and connection pads and the first and second protection dams. A method of manufacturing a wafer level package includes: forming a circuit pattern unit on a substrate; disposing a pad spaced apart from the circuit pattern unit; forming a secondary film on a side of the pad; forming a protection film, excluding some of the pads where the secondary film is formed; disposing a bonding pad and a protection dam on a side of the pad; attaching the manufactured substrate and printed circuit board to each other.

Abstract: Disclosed is a radiofrequency (RF) module including a surface acoustic wave (SAW) device that includes a piezoelectric substrate, an interdigital transducer (IDT) electrode and an input/output electrode formed on one surface of the piezoelectric substrate, and a bump joined to the input/output electrode, a printed circuit board (PCB) that includes a terminal corresponding to the input/output electrode and on which the SAW device is mounted to join the bump to the terminal, a molding portion that covers the SAW device, and a dam portion that surrounds the IDT electrode, the input/output electrode, and the bump not to allow a molding material that forms the molding portion to penetrate a space in which the IDT electrode, the input/output electrode, and the bump are arranged.

Abstract: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

Abstract: Disclosed herein are a magnetic field sensor and a sensing apparatus using the same. The present invention provides a magnetic field sensor including: a magnetic field detection unit which includes a substrate, a piezoelectric driving body formed on the substrate, and a magnetostrictive layer stacked on one portion of the piezoelectric driving body and is vibrated at a vibration frequency changed from a natural frequency in proportion to a magnitude of an external magnetic field; and a control unit which drives the piezoelectric driving body with a constant AC voltage and calculates a magnitude of the external magnetic field from an output voltage output from the magnetic field detection unit, and a sensing apparatus using the same.

Abstract: There is provided an orthogonal fluxgate sensor including: a magnetic core having a flat plate shape; and first and second coils enclosing the magnetic core in a solenoid form, wherein the first and second coils are disposed to be orthogonal to one another, and when alternating current (AC) is applied to the first coil, an AC voltmeter is connected to the second coil, and when AC is applied to the second coil, the AC voltmeter is connected to the first coil.

Abstract: There is provided an orthogonal fluxgate sensor including: a magnetic core unit having a lattice structure; first and second coils enclosing the magnetic core unit in a solenoid form; and a third coil surrounding the magnetic core unit and the first and second coils, wherein the first and second coils are disposed to be perpendicular to one another, and when an alternating current (AC) power source is connected to at least one of the first and second coils, an AC voltmeter is connected to the third coil, and when the AC power source is connected to the third coil, the AC voltmeter is connected to at least one of the first and second coils.

Abstract: There is provided an orthogonal fluxgate sensor including: a plurality of magnetic cores each formed to be elongated in a length direction; a first coil enclosing the plurality of magnetic cores in a solenoid form; and a second coil surrounding the plurality of magnetic cores and the first coil, wherein when an alternating current (AC) power source is connected to the first coil, an AC voltmeter is connected to the second coil, and when the AC power source is connected to the second coil, the AC voltmeter is connected to the first coil.

Abstract: Disclosed herein are a method of improving sensitivity of a terrestrial magnetism sensor and an apparatus using the same. A method of forming a terrestrial magnetism sensor includes: cleaning a surface of the terrestrial magnetism sensor; and depositing a thermoelectric material as a thin film on the cleaned surface of the terrestrial magnetism sensor. Therefore, a sensing error of the terrestrial magnetism sensor that has been generated due to heat in the prior art is decreased, thereby making it possible to allow the terrestrial magnetism sensor to calculate an accurate sensing value.

Abstract: The present invention provides an epoxy resin composition for sealing a geomagnetic sensor module, including: an epoxy resin; a curing agent; and a phase change material, and provides a geomagnetic sensor module sealed with the epoxy resin composition. The present invention is advantageous in that a geomagnetic sensor can be maintained at a predetermined temperature because a sealing material including a phase change material is used.

Abstract: Disclosed herein are a Hall sensor and a method of manufacturing the Hall sensor. The Hall sensor includes: a flexible substrate in which a groove is formed; a magnetic field flux concentrator formed in the groove of the flexible substrate; an electrode that is patterned to contact the magnetic field flux concentrator; a passivation layer formed around the electrode; and a sensor layer stacked on the passivation layer.

Abstract: Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.

Abstract: Disclosed herein are a giant magneto-resistive sensor including a free layer stacked on a substrate and having a rotatable magnetic moment; a ferromagnetic fixed layer having a magnetic moment; a pin layer disposed neighboring the fixed layer; and a spacer layer disposed between the free layer and the fixed layer and having a roughness in an interface contacting the fixed layer, and a method of manufacturing the giant magneto-resistive sensor.