Patents by Inventor Eun Tae Park

Eun Tae Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE AND NON-SHRINKAGE CERAMIC SUBSTRATE USING THE SAME
    Publication number: 20090114434
    Abstract: There is provided a method of manufacturing a non-shrinkage ceramic substrate, and a non-shrinkage ceramic substrate using the same.
    Type: Application
    Filed: November 4, 2008
    Publication date: May 7, 2009
    Applicant: SAMSUNG ELECTRO-MECHNICS CO., LTD.
    Inventors: Min Ji Ko, Jong Myeon Lee, Eun Tae Park
  • MANUFACTURING METHOD OF MULTI-LAYER CERAMIC SUBSTRATE
    Publication number: 20090107616
    Abstract: Provided is a manufacturing method of a multi-layer ceramic substrate. The manufacturing method includes preparing an unsintered ceramic laminated body with a cavity, mounting a chip device within the cavity, filling the cavity, in which the chip device is mounted, with a ceramic slurry, attaching a constrained layer on top and/or bottom of the ceramic laminated body, and firing the ceramic laminated body. Accordingly, since the deformation of the cavity is prevented during the firing of the ceramic laminated body, the dimension precision and reliability of the multi-layer ceramic substrate can be improved.
    Type: Application
    Filed: October 30, 2008
    Publication date: April 30, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soo Hyun Lyoo, Jong Myeon Lee, Eun Tae Park, Hyoung Ho Kim
  • Method of fabricating printed circuit board having embedded multi-layer passive devices
    Patent number: 7293356
    Abstract: The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.
    Type: Grant
    Filed: January 3, 2006
    Date of Patent: November 13, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Hyun Sohn, Yul Kyo Chung, Hyun Ju Jin, Eun Tae Park