Patents by Inventor Eung-Su Kim
Eung-Su Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11940734Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a supply line having a first open/close valve installed thereon and configured to supply a treating fluid to the treating space; a heater installed on the supply line and configured to heat the treating fluid; an exhaust line having a second open/close valve installed thereon and configured to exhaust the treating space; and, a controller configured to control the first open/close value and the second open/close valve such that the treating fluid heated is supplied to and exhausted from the treating space before a treating process is performed on a substrate in the treating space.Type: GrantFiled: April 21, 2022Date of Patent: March 26, 2024Assignee: SEMES CO., LTD.Inventors: Ki Hoon Choi, Eung Su Kim, Pil Kyun Heo, Jin Yeong Sung, Hae-Won Choi, Anton Koriakin, Joon Ho Won
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Publication number: 20230350304Abstract: There are provided an apparatus and a method for providing a substrate, which can suppress any additional reaction between a developing solution and a photoresist (PR) film and prevent any PR remnants from being generated from such additional reaction. The method includes: supplying an organic developing solution onto a substrate while rotating the substrate at a first revolutions per minute (rpm); substituting the organic developing solution with a nonpolar rinse solution by supplying the nonpolar rinse solution onto the substrate while rotating the substrate at a second rpm, which is lower than the first rpm; continuing to supply the nonpolar rinse solution while rotating the substrate at a third rpm, which is higher than the second rpm; and continuing to supply the nonpolar rinse solution while rotating the substrate at a fourth rpm, which is between the second rpm and the third rpm.Type: ApplicationFiled: April 29, 2022Publication date: November 2, 2023Inventors: Hae Won CHOI, Joon Ho WON, Koriakin ANTON, Ki Hoon CHOI, Eung Su KIM, Pil Kyun HEO, Min Woo KIM, Jin Yeong SUNG, Hyo Soo KIM
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Publication number: 20230341779Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a supply line having a first open/close valve installed thereon and configured to supply a treating fluid to the treating space; a heater installed on the supply line and configured to heat the treating fluid; an exhaust line having a second open/close valve installed thereon and configured to exhaust the treating space; and, a controller configured to control the first open/close value and the second open/close valve such that the treating fluid heated is supplied to and exhausted from the treating space before a treating process is performed on a substrate in the treating space.Type: ApplicationFiled: April 21, 2022Publication date: October 26, 2023Inventors: Ki Hoon Choi, Eung Su Kim, Pil Kyun Heo, Jin Yeong Sung, Hae-Won Choi, Anton Koriakin, Joon Ho Won
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Publication number: 20230113184Abstract: The present disclosure relates to a flow resistance generating unit that generates a flow resistance in a pipe to solve a flow imbalance problem due to a bent pipe and stabilizes an internal airflow, and a substrate treating apparatus including the same. The substrate treating apparatus comprises a fluid supply unit for supplying fluid for treating a substrate and including an upper fluid supply module for supplying the fluid to an upper portion of the substrate, a lower fluid supply module for supplying the fluid to a lower portion of the substrate, and a supply pipe connected to at least one of the upper fluid supply module and the lower fluid supply module, and a flow resistance generating unit installed in the supply pipe and for generating a flow resistance with respect to the fluid passing through the supply pipe.Type: ApplicationFiled: July 15, 2022Publication date: April 13, 2023Inventors: Jae Won SHIN, Jae Seong LEE, Hae Won CHOI, Joon Ho WON, Koriakin ANTON, Min Woo KIM, Hyung Seok KANG, Eung Su KIM, Pil Kyun HEO, Jin Yeong SUNG
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Patent number: 11448694Abstract: A semiconductor package test apparatus includes an interface board having connection terminals for electrically connecting a semiconductor package to a tester, a push block for pressing the semiconductor package toward the interface board to bring external terminals of the semiconductor package into contact with the connection terminals of the interface board, a temperature adjustment unit connected with the push block to heat or cool the semiconductor package to a test temperature through the push block, and a heat transfer member for thermally connecting the push block and the interface board.Type: GrantFiled: June 29, 2020Date of Patent: September 20, 2022Assignee: SEMES CO., LTD.Inventors: Eung Su Kim, Chang Taek Lee
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Publication number: 20220290921Abstract: The inventive concept provides a method for treating a substrate. The method for treating a substrate comprises: a pressurization step for increasing a pressure of an inner space of a chamber by supplying a treating fluid to the inner space, after taking the substrate into the inner space; a flow step for generating a flow of the treating fluid by combination of supplying and discharging the treating fluid to and from the inner space; and a depressurization step of decreasing the pressure of the inner space by discharging the treating fluid from the inner space, and wherein the pressurization step comprises: a bottom side supply process for increasing the pressure of the inner space by supplying the treating fluid to a backside of the substrate taken into the inner space; and a top side supply process of increasing the pressure of the inner space by supplying the treating fluid to a top side of the substrate taken into the inner space.Type: ApplicationFiled: March 11, 2022Publication date: September 15, 2022Applicant: SEMES CO., LTD.Inventors: Hae-Won CHOI, Anton KORIAKIN, Joon Ho WON, Min Woo KIM, Ki Hoon CHOI, Eung Su KIM, Tae Hee KIM, Pil Kyun HEO, Jang Jin LEE, Jin Yeong SUNG
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Publication number: 20210003631Abstract: A semiconductor package test apparatus is disclosed. The semiconductor package test apparatus includes an interface board having connection terminals for electrically connecting a semiconductor package to a tester, a push block for pressing the semiconductor package toward the interface board to bring external terminals of the semiconductor package into contact with the connection terminals of the interface board, a temperature adjustment unit connected with the push block to heat or cool the semiconductor package to a test temperature through the push block, and a heat transfer member for thermally connecting the push block and the interface board.Type: ApplicationFiled: June 29, 2020Publication date: January 7, 2021Applicant: SEMES CO., LTD.Inventors: Eung Su KIM, Chang Taek LEE
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Patent number: 10665490Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.Type: GrantFiled: January 4, 2019Date of Patent: May 26, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ja-Woo Lee, Keon-Woo Kim, Sun-Ho Kim, Eung-Su Kim, Bo-Ra Yoon, Hyan-Jung Lee, Tae-Il Cho
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Publication number: 20200013657Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.Type: ApplicationFiled: January 4, 2019Publication date: January 9, 2020Inventors: Ja-Woo Lee, Keon-Woo Kim, Sun-Ho Kim, Eung-Su Kim, Bo-Ra Yoon, Hyan-Jung Lee, Tae-Il Cho
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Publication number: 20180358253Abstract: An electrostatic chuck includes: a chuck base including a first hole; a first plate on the chuck base, wherein the first plate includes a second hole on the first hole; a first bushing in the first hole; and a porous block in the first bushing, wherein the first bushing contacts the first plate and is disposed adjacent to the porous block.Type: ApplicationFiled: January 8, 2018Publication date: December 13, 2018Inventors: YOUNGJIN NOH, NAMJUN KANG, EUNG-SU KIM, SEUNGBO SHIM, SANG-HO LEE
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Publication number: 20170330734Abstract: A plasma processing apparatus includes a process chamber providing a space for plasma processing, a lower electrode that is in the process chamber, a surface of the lower electrode being for mounting a wafer thereon, an upper electrode that is in the process chamber and faces the lower electrode, a gas supplier configured to supply process gas between the upper electrode and the lower electrode, a focus ring arranged on the lower electrode to surround an edge of the wafer mounted on the lower electrode, an edge ring arranged below the focus ring and including first bodies that are separate from each other with a space therebetween, a plurality of heaters installed in the first bodies, and a heater controller configured to separately control driving of each of the heaters.Type: ApplicationFiled: December 20, 2016Publication date: November 16, 2017Inventors: Jun-soo LEE, Je-hun WOO, Sang-min JEONG, Eung-su KIM, Hak-young KIM
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Patent number: 7592573Abstract: A microwave cooker comprises a body having a cooking chamber therein, the cooking chamber having one opened side, a microwave source disposed at the body for supplying microwave to the cooking chamber, a door coupled to the body for opening and closing the cooking chamber, and a multi-stage choke seal formed at the door and having different resonant frequencies and different LC resonant circuits for preventing the microwave from being leaked between the body and the door.Type: GrantFiled: January 13, 2006Date of Patent: September 22, 2009Assignee: LG Electronics Inc.Inventors: Sung-Hun Sim, Eung-Su Kim, Jin-Yul Hu
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Patent number: 7429721Abstract: A heating apparatus using an electromagnetic wave is disclosed, by which cut-of performance of an electromagnetic wave is enhanced by increasing an electromagnetic wave absorption bandwidth having cut-off performance below ?70 dB. The present invention includes a door provided to an open front side of a body to be opened/closed and a choke filter having a panel type choke part arranged by at least one row each along an edge of the door and a filter part arranged by at least one row each along an edge of the choke part and having a plurality of slots, wherein a prescribed choke part is provided to a most inner side among rows of the choke and filter part.Type: GrantFiled: November 7, 2005Date of Patent: September 30, 2008Assignee: LG Electronics Inc.Inventors: Eung Su Kim, Jin Yul Hu, Sung Hun Sim
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Patent number: 7402784Abstract: A microwave cooker comprises a body having a cooking chamber therein, the cooking chamber having one opened side, a microwave source disposed at the body for supplying microwave to the cooking chamber, a door coupled to the body for opening and closing the cooking chamber, and a multi-stage choke seal formed at the door, having different resonant frequencies at a frequency region higher than a central frequency of microwave, and having different LC resonant circuits for preventing the microwave from being leaked between the body and the door.Type: GrantFiled: January 13, 2006Date of Patent: July 22, 2008Assignee: LG Electronics Inc.Inventors: Sung-Hun Sim, Eung-Su Kim, Jin-Yul Hu
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Patent number: 7388180Abstract: A microwave oven includes a cooking chamber; a magnetron for generating a microwave; a waveguide for guiding the microwave from the magnetron toward the cooking chamber; an antenna between the cooking chamber and the waveguide for propagating the microwave guided by the waveguide into the cooking chamber; and a driving unit for moving the antenna along a first direction and rotating the antenna.Type: GrantFiled: March 28, 2006Date of Patent: June 17, 2008Assignee: LG Electronics Inc.Inventors: Eung Su Kim, Kwang Yong Kim, Young Min Lee
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Patent number: 7301132Abstract: A heating apparatus using an electromagnetic wave is disclosed, by which cut-of performance of an electromagnetic wave is enhanced by increasing an electromagnetic wave absorption bandwidth having cut-off performance below ?70 dB. The present invention includes a door provided to an open front side of a body to be opened/closed, a choke filter having a panel type choke part arranged by at least one or more rows along an edge of the door and a filter part arranged by at least one or more rows along the choke and having a plurality of slots wherein a prescribed choke part is provided to a most inner side, a glass panel attached to an inner lateral side of the door and the choke filter, and a flange part provided to an external end portion of the door along the edge of the door to lie in a same level with an inner lateral side of the glass panel.Type: GrantFiled: November 7, 2005Date of Patent: November 27, 2007Assignee: LG Electronics Inc.Inventors: Eung Su Kim, Jin Yul Hu, Sung Hun Sim
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Patent number: 7291819Abstract: A heating apparatus using an electromagnetic wave is disclosed, by which a capacity of a cavity is increased and by which cut-off performance of the electromagnetic wave and facilitation of door cleaning can be enhanced. The present invention includes a door provided to an open front side of a body to be opened/closed, a choke filter having a panel type choke part arranged by at least one or more rows along an edge of the door and a filter part having a plurality of slots wherein a prescribed choke part is provided to a most outer side, and a glass panel attached to an inner lateral side of the door and the choke filter.Type: GrantFiled: November 2, 2005Date of Patent: November 6, 2007Assignee: LG Electronics Inc.Inventors: Eung Su Kim, Jin Yul Hu, Sung Hun Sim
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Patent number: 7247823Abstract: A defrost vessel for a microwave oven includes a body having a certain space therein for receiving a refrigerating load, and an antenna connected to the body for oscillating a microwave into the space of the body. When microwave is supplied into a cavity of the microwave oven, the microwave is oscillated into the space of the body by the antenna and thus the microwave is deeply penetrated up to inside of the refrigerating load. Also, the microwave is secondly emitted into the space of the body from an edge of the slot, thereby completely defrosting the refrigerating load.Type: GrantFiled: October 28, 2005Date of Patent: July 24, 2007Assignee: LG Electronics Inc.Inventors: Won-Hui Lee, Eung-Su Kim
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Publication number: 20070039952Abstract: A heating apparatus using an electromagnetic wave is disclosed, by which a capacity of a cavity is increased and by which cut-off performance of the electromagnetic wave and facilitation of door cleaning can be enhanced. The present invention includes a door provided to an open front side of a body to be opened/closed, a choke filter having a panel type choke part arranged by at least one or more rows along an edge of the door and a filter part having a plurality of slots wherein a prescribed choke part is provided to a most outer side, and a glass panel attached to an inner lateral side of the door and the choke filter.Type: ApplicationFiled: November 2, 2005Publication date: February 22, 2007Inventors: Eung Su Kim, Jin Yul Hu, Sung Hun Sim
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Publication number: 20070012691Abstract: A microwave cooker comprises a body having a cooking chamber therein, the cooking chamber having one opened side, a microwave source disposed at the body for supplying microwave to the cooking chamber, a door coupled to the body for opening and closing the cooking chamber, and a multi-stage choke seal formed at the door, having different resonant frequencies at a frequency region higher than a central frequency of microwave, and having different LC resonant circuits for preventing the microwave from being leaked between the body and the door.Type: ApplicationFiled: January 13, 2006Publication date: January 18, 2007Inventors: Sung-Hun Sim, Eung-Su Kim, Jin-Yul Hu