Patents by Inventor Evan G. Colgan
Evan G. Colgan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10892170Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, a first directional heat spreader, and a second directional heat spreader. Presented herein is a fabrication method that includes attaching the stiffening frame to the carrier. The stiffening frame includes a central opening, a base portion, a first pair of opposing sidewalls, and a second pair of opposing sidewalls. The method includes electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening. The method includes thermally contacting the first directional heat spreader to the semiconductor chip. The first directional heat spreader transfers heat from the semiconductor chip towards the first pair of opposing sidewalls. The method includes thermally contacting the second directional heat spreader to the first directional heat spreader.Type: GrantFiled: June 1, 2018Date of Patent: January 12, 2021Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Yi Pan, Hilton T. Toy, Jeffrey A. Zitz
-
Patent number: 10727159Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.Type: GrantFiled: December 6, 2019Date of Patent: July 28, 2020Assignee: International Business Machines CorporatinInventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
-
Patent number: 10727158Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.Type: GrantFiled: November 20, 2019Date of Patent: July 28, 2020Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
-
Publication number: 20200118907Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.Type: ApplicationFiled: December 6, 2019Publication date: April 16, 2020Inventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
-
Patent number: 10596540Abstract: Apparatus and methods for using a flow cell array are provided herein. A method includes delivering multiple items of chemical matter independently to multiple reaction sites of a flow cell array across multiple distinct instances of time; imaging multiple parallel chemical reactions at the multiple reaction sites of the flow cell array; and recording an emission from each of the multiple chemical reactions site.Type: GrantFiled: December 17, 2015Date of Patent: March 24, 2020Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Alexey Y. Lvov, Stanislav Polonsky
-
Publication number: 20200091037Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.Type: ApplicationFiled: November 20, 2019Publication date: March 19, 2020Inventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
-
Patent number: 10583414Abstract: Apparatus and methods for using a flow cell array are provided herein. A method includes determining placement of multiple reaction site openings, wherein each reaction site opening is connected to a first sub-surface channel; connecting the first sub-surface channel to two or more additional sub-surface channels by multiple vias; and providing a material for multiple reaction sites, wherein an overlap of the multiple reaction site openings and the material delineate the multiple reaction sites.Type: GrantFiled: December 17, 2015Date of Patent: March 10, 2020Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Alexey Y. Lvov, Stanislav Polonsky
-
Patent number: 10566215Abstract: A method includes electrically connecting an IC chip module to a motherboard and thermally contacting a heat sink to the IC chip module. The IC chip module includes a carrier comprising a top surface and a bottom surface configured to be electrically connected to the motherboard. The IC chip module includes a stiffening frame attached to the carrier top surface. The stiffening frame includes a base portion that has a central opening and a plurality of opposing sidewalls. The IC chip module further includes a semiconductor chip electrically connected to the carrier top surface and concentrically arranged within the central opening. The IC chip module further includes a first directional heat spreader thermally contacting the semiconductor chip. The first directional heat spreader includes a directionally thermally conductive material arranged to efficiently transfer heat from the semiconductor chip in a first opposing bivector direction towards first opposing sidewalls.Type: GrantFiled: November 3, 2017Date of Patent: February 18, 2020Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Yi Pan, Hilton T. Toy, Jeffrey A. Zitz
-
Patent number: 10529648Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.Type: GrantFiled: February 13, 2018Date of Patent: January 7, 2020Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
-
Publication number: 20190298317Abstract: A health analysis fixture includes a receptacle. A volume of water and a body fluid sample form a water line within the receptacle. A light-emitting device and a light-sensing device are disposed within the receptacle. A measurement device determines a height of the water line before and after an introduction of the body fluid sample. A computer processor is configured to receive sensor data from the light-sensing device, receive the determined height of the water line before and after the introduction of the body fluid sample from the measurement device, calculate a dilution factor for the body fluid sample from the received height of the water line before and after the introduction of the body fluid sample, receive sensor data from the light-sensing device, and interpret the received sensor data based on the dilution factor to generate health information therefrom.Type: ApplicationFiled: April 2, 2018Publication date: October 3, 2019Inventors: Evan G. Colgan, Minhua Lu, Vince S. Siu
-
Patent number: 10424494Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.Type: GrantFiled: November 3, 2017Date of Patent: September 24, 2019Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Yi Pan, Hilton T. Toy, Jeffrey A. Zitz
-
Patent number: 10282646Abstract: A data readout device is provided and includes a reflective base, reflective sidewalls disposed about the reflective base and an actuation system. The actuation system is configured to modify relative positioning of one of the reflective base and the reflective sidewalls to either reflect incoming radiation back toward an origin thereof or to reflect the incoming radiation away from the origin thereof.Type: GrantFiled: November 13, 2017Date of Patent: May 7, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan G. Colgan, Fuad E. Doany, Li-Wen Hung, Reinaldo A. Vega, Bucknell C. Webb
-
Patent number: 10258954Abstract: Apparatus and methods for using a flow cell array are provided herein. An apparatus includes an array comprising one or more pixels, wherein each of the one or more pixels comprises multiple reaction sites openings; a first set of one or more sub-surface channels, wherein each of the multiple reaction site openings is connected to a sub-surface channel from the first set of one or more sub-surface channels; a second set of two or more sub-surface channels; and multiple vias connecting each channel from the first set of one or more sub-surface channels to (i) a first sub-surface channel from the second set of two or more sub-surface channels and (ii) a second sub-surface channel from the second set of two or more sub-surface channels.Type: GrantFiled: December 17, 2015Date of Patent: April 16, 2019Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Alexey Y. Lvov, Stanislav Polonsky
-
Patent number: 10232337Abstract: Apparatus and methods for using a flow cell array are provided herein. A method includes determining placement of one or more reaction sites on a first component; providing a material for the one or more reaction sites in one or more surface channels of the first component; connecting the first component to a second component to form an array, wherein the one or more surface channels of the first component connect the one or more reaction sites with one or more vias, and wherein the second component comprises the one or more vias connected to multiple sub-surface channels; and aligning the one or more surface channels of the first component with the one or more vias of the second component to form a connection between the first component and the second component.Type: GrantFiled: December 17, 2015Date of Patent: March 19, 2019Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Alexey Y. Lvov, Stanislav Polonsky
-
Patent number: 10169288Abstract: Node interconnect architectures to implement a high performance supercomputer are provided. For example, a node interconnect architecture for connecting a multitude of nodes (or processors) of a supercomputer is implemented using an all-to-all electrical and optical connection network which provides two independent communication paths between any two processors of the supercomputer, wherein a communication path includes at most two electrical links and one optical link.Type: GrantFiled: April 27, 2016Date of Patent: January 1, 2019Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Monty M. Denneau, Daniel M. Kuchta
-
Patent number: 10132433Abstract: Conduit connectors for liquid manifolds and methods of fabrication are provided. In one embodiment, a conduit connector is recessed, at least in part, within a liquid manifold, and includes a conduit-receiving opening or socket and at least one releasable retention component. The conduit-receiving opening is disposed within the liquid manifold and in fluid communication with at least one liquid-carrying channel of the liquid manifold. The releasable retention component(s) is selectively operative to threadlessly secure in a fluid-tight manner a conduit within the conduit-receiving opening in fluid communication with the at least one liquid-carrying channel of the liquid manifold to facilitate flow of liquid through the liquid-carrying channel(s), or to release the conduit from the conduit-receiving opening of the conduit connector. The releasable retention component(s) resides at least partially within the liquid manifold when operatively holding the conduit within the conduit-receiving opening.Type: GrantFiled: January 25, 2018Date of Patent: November 20, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Gerd Schlottig
-
Patent number: 10107426Abstract: Conduit connectors for liquid manifolds and methods of fabrication are provided. In one embodiment, a conduit connector is integrated, at least in part, within a liquid manifold, and includes a conduit-receiving opening or socket and at least one releasable retention component. The conduit-receiving opening is disposed within the liquid manifold and in fluid communication with at least one liquid-carrying channel of the liquid manifold. The releasable retention component(s) is selectively operative to threadlessly secure in a fluid-tight manner a conduit within the conduit-receiving opening in fluid communication with the at least one liquid-carrying channel of the liquid manifold to facilitate flow of liquid through the liquid-carrying channel(s), or to release the conduit from the conduit-receiving opening of the conduit connector. The releasable retention component(s) resides at least partially within the liquid manifold when operatively holding the conduit within the conduit-receiving opening.Type: GrantFiled: August 12, 2015Date of Patent: October 23, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Gerd Schlottig
-
Patent number: 10090173Abstract: A method of fabricating a chip module is presented. The chip module includes a stiffening frame, a directional heat spreader, a carrier, and a semiconductor chip. The stiffening frame is attached to the carrier. The stiffening frame includes a base portion with a central opening to accept a semiconductor chip and a first pair of opposing sidewalls. The semiconductor chip is electronically coupled to the carrier concentrically arranged within the central opening. A first directional heat spreader is thermally coupled to the semiconductor chip. The first directional heat spreader includes directionally thermally conductive material arranged to efficiently transfer heat from the semiconductor chip in a first opposing bivector direction towards the first pair of opposing sidewalls.Type: GrantFiled: June 5, 2015Date of Patent: October 2, 2018Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Yi Pan, Hilton T. Toy, Jeffrey A. Zitz
-
Publication number: 20180277396Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.Type: ApplicationFiled: June 1, 2018Publication date: September 27, 2018Inventors: Evan G. Colgan, Yi Pan, Hilton T. Toy, Jeffrey A. Zitz
-
Publication number: 20180204100Abstract: A data readout device is provided and includes a reflective base, reflective sidewalls disposed about the reflective base and an actuation system. The actuation system is configured to modify relative positioning of one of the reflective base and the reflective sidewalls to either reflect incoming radiation back toward an origin thereof or to reflect the incoming radiation away from the origin thereof.Type: ApplicationFiled: November 13, 2017Publication date: July 19, 2018Inventors: EVAN G. COLGAN, FUAD E. DOANY, LI-WEN HUNG, REINALDO A. VEGA, BUCKNELL C. WEBB