Patents by Inventor Ewald Karl Michael Guenther
Ewald Karl Michael Guenther has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10224393Abstract: A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.Type: GrantFiled: June 6, 2017Date of Patent: March 5, 2019Assignee: OSRAM Opto Semiconductors GmbHInventors: Ewald Karl Michael Günther, Andreas Plöβl, Heribert Zull, Thomas Veit, Mathias Kämpf, Jens Dennemarck, Bernd Böhm, Korbinian Perzlmaier
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Publication number: 20170271438Abstract: A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.Type: ApplicationFiled: June 6, 2017Publication date: September 21, 2017Inventors: Ewald Karl Michael Günther, Andreas Plössl, Heribert Zull, Thomas Veit, Mathias Kämpf, Jens Dennemarck, Bernd Böhm, Korbinian Perzlmaier
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Patent number: 9704945Abstract: A carrier substrate includes a first major face and a second major face opposite the first major face. A diode structure is formed between the first major face and the second major face, which diode structure electrically insulates the first major face from the second major face at least with regard to one polarity of an electrical voltage.Type: GrantFiled: February 7, 2012Date of Patent: July 11, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Ewald Karl Michael Günther, Andreas Plöβl, Heribert Zull, Thomas Veit, Mathias Kämpf, Jens Dennemarck, Bernd Böhm, Korbinian Perzlmaier
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Patent number: 9537070Abstract: An optoelectronic component contains a semiconductor chip (1) and a carrier body (10), which are provided with a transparent, electrically insulating encapsulation layer (3), the encapsulation layer (3) having two cutouts (11, 12) for uncovering a contact area (6) and a connection region (8) of the carrier body, and an electrically conductive layer (14) being led from the contact area (6) over a partial region of the encapsulation layer (3) to the electrical connection region (8) of the carrier body (10) in order to electrically connect the contact area (6) and the electrical connection region (8) to one another. The radiation emitted in a main radiation direction (13) by the semiconductor chip (1) is coupled out through the encapsulation layer (3), which advantageously contains luminescence conversion substances for the wavelength conversion of the emitted radiation.Type: GrantFiled: September 13, 2005Date of Patent: January 3, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Ewald Karl Michael Guenther, Jörg Erich Sorg, Norbert Stath
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Patent number: 8900894Abstract: In a method for producing a radiation-emitting optoelectronic component, a semiconductor chip is mounted by a first main area onto a carrier body and is electrically conductively connected at a first contact area to a first connection region, and a transparent electrically insulating encapsulation layer is applied to the chip and the carrier body. A first cutout in the encapsulation layer for at least partly uncovering a second contact area of the chip is produced, and a second cutout in the encapsulation layer for at least partly uncovering a second connection region of the carrier body is produced. Finally, an electrically conductive layer, which electrically conductively connects the second contact area of the semiconductor chip and the second connection region of the carrier body, is applied.Type: GrantFiled: August 28, 2012Date of Patent: December 2, 2014Assignee: OSRAM Opto Semiconductor GmbHInventors: Ewald Karl Michael Guenther, Jörg Erich Sorg, Norbert Stath
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Patent number: 8853732Abstract: The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a contact metallization (3a, 3b), wherein —the carrier (1) is electrically insulating, —the at least one optoelectronic semiconductor chip (2) is fastened to the first main surface (Ia) of the carrier (1) by means of a bonding material (4), particularly a solder material, —the contact metallization (3a, 3b) covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (2), and —the contact metallization (3a, 3b) is electrically conductively connected to the optoelectronic semiconductor chip (2).Type: GrantFiled: August 31, 2010Date of Patent: October 7, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Klaus Müller, Günter Spath, Siegfried Herrmann, Ewald Karl Michael Günther, Herbert Brunner
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Patent number: 8733950Abstract: An LED projector includes a plurality of light sources; and an image generator which includes an arrangement of pixels, each pixel including at least one light source; wherein the LEDs are stacked epi-LEDs which include layers arranged above one another for different colors, or each pixel includes an emission surface and at least two LEDs are arranged adjacent one another in the emission surface.Type: GrantFiled: September 9, 2009Date of Patent: May 27, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Stefan Grötsch, Ewald Karl Michael Günther, Alexander Wilm, Siegfried Herrmann
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Publication number: 20140008770Abstract: A carrier substrate includes a first major face and a second major face opposite the first major face. A diode structure is formed between the first major face and the second major face, which diode structure electrically insulates the first major face from the second major face at least with regard to one polarity of an electrical voltage.Type: ApplicationFiled: February 7, 2012Publication date: January 9, 2014Applicant: OSRAM Opto Semiconductors GmbHInventors: Ewald Karl Michael Günther, Andreas Plößl, Heribert Zull, Thomas Veit, Mathias Kämpf, Jens Dennemarck, Bernd Böhm, Korbinian Perzlmaier
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Patent number: 8581279Abstract: In a luminescence diode chip having a radiation exit area (1) and a contact structure (2, 3, 4) which is arranged on the radiation exit area (1) and comprises a bonding pad (4) and a plurality of contact webs (2, 3) which are provided for current expansion and are electrically conductively connected to the bonding pad (4), the bonding pad (4) is arranged in an edge region of the radiation exit area (1). The luminescence diode chip has reduced absorption of the emitted radiation (23) in the contact structure (2, 3, 4).Type: GrantFiled: June 2, 2006Date of Patent: November 12, 2013Assignee: OSRAM Opto Semiconductors GmbHInventors: Johannes Baur, Volker Härle, Berthold Hahn, Andreas Weimar, Raimund Oberschmid, Ewald Karl Michael Guenther, Franz Eberhard, Markus Richter, Jörg Strauss
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Patent number: 8562142Abstract: A multicolour LED, in which layers for generating light of different colors are arranged one above the other, is used as the light source in a projector.Type: GrantFiled: May 4, 2009Date of Patent: October 22, 2013Assignee: OSRAM Opto Semiconductors GmbHInventors: Stefan Groetsch, Ewald Karl Michael Guenther, Alexander Wilm, Siegfried Herrmann
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Publication number: 20120322178Abstract: In a method for producing a radiation-emitting optoelectronic component, a semiconductor chip is mounted by a first main area onto a carrier body and is electrically conductively connected at a first contact area to a first connection region, and a transparent electrically insulating encapsulation layer is applied to the chip and the carrier body. A first cutout in the encapsulation layer for at least partly uncovering a second contact area of the chip is produced, and a second cutout in the encapsulation layer for at least partly uncovering a second connection region of the carrier body is produced. Finally, an electrically conductive layer, which electrically conductively connects the second contact area of the semiconductor chip and the second connection region of the carrier body, is applied.Type: ApplicationFiled: August 28, 2012Publication date: December 20, 2012Applicant: Osram Opto Semiconductors GmbHInventors: Ewald Karl Michael Guenther, Jörg Erich Sorg, Norbert Stath
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Publication number: 20120248492Abstract: The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a contact metallization (3a, 3b), wherein —the carrier (1) is electrically insulating, —the at least one optoelectronic semiconductor chip (2) is fastened to the first main surface (Ia) of the carrier (1) by means of a bonding material (4), particularly a solder material, —the contact metallization (3a, 3b) covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (2), and —the contact metallization (3a, 3b) is electrically conductively connected to the optoelectronic semiconductor chip (2).Type: ApplicationFiled: August 31, 2010Publication date: October 4, 2012Applicant: Osram Opto Semiconductors GmbHInventors: Klaus Müller, Günter Spath, Siegfried Herrmann, Ewald Karl Michael Günther, Herbert Brunner
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Publication number: 20110176116Abstract: An LED projector includes a plurality of light sources; and an image generator which includes an arrangement of pixels, each pixel including at least one light source; wherein the LEDs are stacked epi-LEDs which include layers arranged above one another for different colors, or each pixel includes an emission surface and at least two LEDs are arranged adjacent one another in the emission surface.Type: ApplicationFiled: September 9, 2009Publication date: July 21, 2011Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Stefan Grötsch, Ewald Karl Michael Günther, Alexander Wilm, Siegfried Herrmann
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Patent number: 7906352Abstract: A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.Type: GrantFiled: July 20, 2006Date of Patent: March 15, 2011Assignee: Osram Opto Semiconductors GmbHInventors: Herbert Brunner, Dieter Eissler, Helmut Fischer, Ewald Karl Michael Guenther, Alexander Heindl
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Publication number: 20090212308Abstract: A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.Type: ApplicationFiled: July 20, 2006Publication date: August 27, 2009Applicant: OSRAM OPTO SEMICONDUCTORS GmbHInventors: Herbert Brunner, Dieter Eissler, Helmut Fischer, Ewald Karl Michael Guenther, Alexander Heindl
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Publication number: 20090212307Abstract: In a luminescence diode chip having a radiation exit area (1) and a contact structure (2, 3, 4) which is arranged on the radiation exit area (1) and comprises a bonding pad (4) and a plurality of contact webs (2, 3) which are provided for current expansion and are electrically conductively connected to the bonding pad (4), the bonding pad (4) is arranged in an edge region of the radiation exit area (1). The luminescence diode chip has reduced absorption of the emitted radiation (23) in the contact structure (2, 3, 4).Type: ApplicationFiled: June 2, 2006Publication date: August 27, 2009Inventors: Johannes Baur, Volker Hárle, Berthold Hahn, Andreas Weimar, Raimund Oberschmid, Ewald Karl Michael Guenther, Franz Eberhard, Markus Richter, Jörg Strauss
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Publication number: 20090127573Abstract: An optoelectronic component contains a semiconductor chip (1) and a carrier body (10), which are provided with a transparent, electrically insulating encapsulation layer (3), the encapsulation layer (3) having two cutouts (11, 12) for uncovering a contact area (6) and a connection region (8) of the carrier body, and an electrically conductive layer (14) being led from the contact area (6) over a partial region of the encapsulation layer (3) to the electrical connection region (8) of the carrier body (10) in order to electrically connect the contact area (6) and the electrical connection region (8) to one another. The radiation emitted in a main radiation direction (13) by the semiconductor chip (1) is coupled out through the encapsulation layer (3), which advantageously contains luminescence conversion substances for the wavelength conversion of the emitted radiation.Type: ApplicationFiled: September 13, 2005Publication date: May 21, 2009Inventors: Ewald Karl Michael Guenther, Jorg Erich Sorg, Norbert Stath
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Patent number: 7510888Abstract: The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.Type: GrantFiled: March 15, 2007Date of Patent: March 31, 2009Assignee: Osram Opto Semiconductors GmbHInventors: Ewald Karl Michael Guenther, Günter Waitl, Herbert Brunner, Jörg Strauss
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Patent number: 7498737Abstract: The invention discloses a method for manufacturing an organic electro-luminescent display device, the method comprising the steps of: providing a light-permeable substrate; arranging a plurality of transparent electrodes in a stripe-like manner on the light-permeable substrate, the transparent electrodes being made of a light-permeable conductive film; forming at least one organic layer on the subassembly, the at least one organic layer being made of an organic electro-luminescent medium so that the at least one organic layer covers the electrodes; forming a conductive film all over the at least one organic layer; and removing at least one portion of the conductive film so as to create stripe-like electrodes being electrical isolated to each other and extending in a direction perpendicular to the transparent electrodes using a radiation method.Type: GrantFiled: August 9, 2004Date of Patent: March 3, 2009Assignee: Osram Opto Semiconductors GmbHInventors: Ewald Karl Michael Guenther, Karsten Heuser, Georg Wittmann
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Patent number: 7462878Abstract: Disclosed is a light-emitting diode chip comprising a semiconductor layer sequence suitable for emitting primary electromagnetic radiation and further comprising a converter layer that is applied to at least one main face of the semiconductor layer sequence and comprises at least one phosphor suitable for converting a portion of the primary radiation into secondary radiation, at least a portion of the secondary radiation and at least a portion of the unconverted primary radiation overlapping to form a mixed radiation with a resulting color space. The converter layer is purposefully structured to adjust a dependence of the resulting color space on viewing angle. Also disclosed is a method of making a light-emitting diode chip in which a converter layer is purposefully structured.Type: GrantFiled: September 23, 2005Date of Patent: December 9, 2008Assignee: Osram Opto Semiconductors GmbHInventors: Markus Richter, Franz Eberhard, Peter Holzer, Ewald Karl Michael Guenther