Patents by Inventor Ewald Karl Michael Guenther

Ewald Karl Michael Guenther has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for encapsulating at least one organic light-emitting (OLED) device and OLED device
    Patent number: 7329560
    Abstract: A method for encapsulating at least one organic light-emitting (OLED) device is disclosed. The method includes the step of forming a concave region on a plate by applying a negative pressure to a predetermined area of the plate. The plate is attached to a substrate including at least one active region such that the concave region of the plate spans over the active region.
    Type: Grant
    Filed: November 7, 2005
    Date of Patent: February 12, 2008
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Wolfgang Gramann, Ewald Karl Michael Guenther
  • Laminates for encapsulating devices
    Patent number: 7262441
    Abstract: An encapsulation for an electrical device is disclosed. The encapsulation comprises plastic substrates which are laminated onto the surface of the electrical device. The use of laminated plastics is particularly useful for flexible electrical devices such as organic LEDs.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: August 28, 2007
    Assignees: Osram Opto Semiconductors GmbH & Co. OHG, Institute of Materials Research and Engineering
    Inventors: Ewald Karl Michael Guenther, Wei Wang, Soo Jin Chua
  • Encapsulation for oled devices
    Patent number: 7255823
    Abstract: An encapsulation for an organic light emitting diode (OLED) (201) device is disclosed. The encapsulation includes a sealing dam (280) surrounding the cell region of the OLED device to support a cap. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: August 14, 2007
    Assignees: Institute of Materials Research and Engineering, Osram Opto Semiconductor GmbH
    Inventors: Ewald Karl Michael Guenther, Mark Dai Joong Auch
  • Encapsulating a device
    Patent number: 7214570
    Abstract: An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: May 8, 2007
    Assignee: Osram GmbH
    Inventor: Ewald Karl Michael Guenther
  • LED arrangement
    Patent number: 7208769
    Abstract: The invention concerns an LED arrangement with at least one LED chip (11) comprising a radiation decoupling surface (12) through which the bulk of the electromagnetic radiation generated in the LED chip (11) is decoupled. Arranged on the radiation decoupling surface (12) is at least one phosphor layer (13) for converting the electromagnetic radiation generated in the LED chip. A housing (17) envelops portions of the LED chip (11) and the phosphor layer (13).
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: April 24, 2007
    Assignee: Osram Opto Semiconductor GmbH
    Inventors: Ewald Karl Michael Guenther, Günter Waitl, Herbert Brunner, Jörg Strauss
  • Transparent electrode material for quality enhancement of OLED devices
    Patent number: 7098591
    Abstract: A transparent conductive material in which the desired resistivity is achieved with a high carrier concentration is provided for use in an OLED. In one embodiment, the transparent conductive material comprises indium-tin-oxide. (ITO) with a high carrier concentration of at least at least 7×1020 cm?3. The high carrier concentration improved the performance of the OLED device.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: August 29, 2006
    Assignees: Osram Opto Semiconductors GmbH, Institute of Materials Research and Engineering
    Inventors: Furong Zhu, Ewald Karl Michael Guenther, Soo Jin Chua
  • Patterning of electrodes in OLED devices
    Patent number: 7057337
    Abstract: An OLED device having pillars with cross section that is wider on the top. The pillars structure a conductive layer during deposition into distinct portions located between the pillars and on the top of the pillars. The pillars are formed by patterning a single photosensitive material which is inert to the chemicals used to deposit the organic functional layers of the OLED device. By using such pillars, the electrodes can be formed without damaging organic functional layers while achieving high resolution.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: June 6, 2006
    Assignee: Osram Opto Semiconductors GmbH
    Inventor: Ewald Karl Michael Guenther
  • Encapsulation for organic LED device
    Patent number: 6952078
    Abstract: An encapsulation for a device is disclosed. In one embodiment, spacer particles (270) are selectively located in the device region. The spacer particles (270) prevent a cap mounted on the substrate (460) from contacting the active components, thereby protecting them from being damaged.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: October 4, 2005
    Assignee: Osram Opto Semiconductord GmbH
    Inventor: Ewald Karl Michael Guenther
  • Encapsulation for organic LED device
    Patent number: 6949880
    Abstract: An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: September 27, 2005
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Ewald Karl Michael Guenther, Hagen Klausmann
  • Laminates for encapsulating devices
    Patent number: 6949825
    Abstract: An encapsulation for an electrical device is disclosed. The encapsulation comprises plastic substrates which are laminated onto the surface of the electrical device. The use of laminated plastics is particularly useful for flexible electrical devices such as organic LEDs.
    Type: Grant
    Filed: July 9, 1999
    Date of Patent: September 27, 2005
    Assignees: Osram Opto Semiconductor GmbH & Co. OHG, Institute of Materials Research and Engineering
    Inventors: Ewald Karl Michael Guenther, Wei Wang, Soo Jin Chua
  • Organic LED device
    Patent number: 6888308
    Abstract: The invention provides for the formation of thin devices having an overall thickness which is less than the width of the sealing frame used to mount the cap. The formation of thin devices is facilitated by the use of spacers in the device region to support the cap.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: May 3, 2005
    Assignee: Osram Opto Semiconductors GmbH
    Inventor: Ewald Karl Michael Guenther
  • Encapsulation of a device
    Patent number: 6888237
    Abstract: An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.
    Type: Grant
    Filed: July 9, 1999
    Date of Patent: May 3, 2005
    Assignee: Osram GmbH
    Inventor: Ewald Karl Michael Guenther
  • Mechanical patterning of a device layer
    Patent number: 6797211
    Abstract: A method of fabricating a device, including mechanically patterning a device layer using a stamp containing a desired pattern. The device layer is formed on a plastic or polymeric substrate. The stamp is pressed against the substrate under a load which patterns the device layer without cracking the device layer in the non-patterned areas.
    Type: Grant
    Filed: June 13, 2001
    Date of Patent: September 28, 2004
    Assignee: Osram Opto Semiconductors GmbH & Co. oHG
    Inventors: Ewald Karl Michael Guenther, Zhong Chen, Brian Cotterell
  • Oled packaging
    Patent number: 6692610
    Abstract: An improved method of fabricating a device such as OLED is disclosed. The method includes applying an adhesive on a cap or substrate. The adhesive is partially cured to initiate the cross-linking process while remaining in the liquid phase. The cap is then mounted onto the substrate and the adhesive is cured to encapsulate the device. By partially curing the adhesive prior to mounting the cap, the curing of the adhesive can be achieved without prolonged exposure to UV radiation or high temperatures which can adversely impact the device.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: February 17, 2004
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Hong Yee Low, Soo Jin Chua, Ewald Karl Michael Guenther
  • Stabilization for thin substrates
    Patent number: 6660547
    Abstract: A substrate support rim used in the fabrication of devices such as organic light emissive diodes (OLEDs) is disclosed. The support rim, which is located at the edge of a substrate, serves to reinforce the substrate, facilitating handling during and after the fabrication process to reduce damage to the device. The support rim comprises, for example, epoxy, adhesives or other materials that adhere to the substrate.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: December 9, 2003
    Assignee: Osram Opto Semiconductors GmbH
    Inventor: Ewald Karl Michael Guenther
  • Stabilization for thin substrates
    Publication number: 20030020124
    Abstract: A substrate support rim used in the fabrication of devices such as organic light emissive diodes (OLEDs) is disclosed. The support rim, which is located at the edge of a substrate, serves to reinforce the substrate, facilitating handling during and after the fabrication process to reduce damage to the device. The support rim comprises, for example, epoxy, adhesives or other materials that adhere to the substrate.
    Type: Application
    Filed: July 26, 2001
    Publication date: January 30, 2003
    Inventor: Ewald Karl Michael Guenther
  • Oled packaging
    Publication number: 20030019572
    Abstract: An improved method of fabricating a device such as OLED is disclosed. The method includes applying an adhesive on a cap or substrate. The adhesive is partially cured to initiate the cross-linking process while remaining in the liquid phase. The cap is then mounted onto the substrate and the adhesive is cured to encapsulate the device. By partially curing the adhesive prior to mounting the cap, the curing of the adhesive can be achieved without prolonged exposure to UV radiation or high temperatures which can adversely impact the device.
    Type: Application
    Filed: July 26, 2001
    Publication date: January 30, 2003
    Inventors: Hong Yee Low, Soo Jin Chua, Ewald Karl Michael Guenther