Abstract: An apparatus for transmitting a bit in addition to a plurality of payload data symbols of a communication protocol is provided. The apparatus comprises an input interface configured to receive information about a bit value of the bit. Further, the apparatus comprises a transmission circuit configured to, if the bit value is a first value, transmit the plurality of payload data symbols at predetermined positions in a data signal as pulses of variable pulse length. The respective pulse length of each of the pulses is selected based on the symbol value of the payload data symbol represented by the respective pulse. If the bit value is a second value, the transmission circuit is configured to transmit a pulse exhibiting a pulse length being longer than a maximum payload data symbol pulse length defined in the communication protocol at the predetermined position of the pulse for the d-th payload data symbol of the plurality of payload data symbols, d=k+i if k+i?z. d=([k+i] mod z) if k+i>z.

Abstract: In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.

Abstract: In various aspects of this disclosure, a communication device is provided. The communication device may include a first radiohead circuit including a first transceiver chain configured to transmit a first radio frequency signal associated with a first transmission configuration and to transmit a second radio frequency signal associated with a second transmission configuration a second radiohead circuit comprising a second transceiver chain configured to receive the first radio frequency signal and the second radio frequency signal, and one or more processors configured to determine a first signal parameter associated with the first radio frequency signal received at the second transceiver chain and a second signal parameter associated with the second radio frequency signal received at the second transceiver chain, and to determine a preferred transmission configuration for the first transceiver chain by using the first signal parameter and the second signal parameter.

Abstract: In various aspects, a radio communication device is described including a housing, a plurality of radiohead circuits attached to the housing, baseband circuitry connected to the plurality of radiohead circuits via a digital interface; and one or more processors configured to select one or more radiohead circuits of the plurality of radiohead circuits for communication with another radio communication device to fulfill one or more predefined selection criteria with respect to a quality of a communication with the other radio communication device using the one or more selected radiohead circuits and to control the baseband circuitry to perform communication with the other radio communication device using the one or more selected radiohead circuits.

Abstract: An apparatus for generating a data signal comprises a processing circuit configured to generate the data signal, the data signal comprising a sequence of a first signal edge of a first type, a second signal edge of a second type, and a third signal edge of the first type, the first signal edge and the second signal edge being separated by a first time period corresponding to first data to be transmitted, and the second signal edge and the third signal edge being separated by a second time period corresponding to second data to be transmitted. An output interface circuit is configured to output the data signal.

Abstract: For example, an apparatus may include an encoder configured to encode data into a plurality of codewords according to a parity function for a transmission modulated according to a Differential Modulation (DM) scheme, and/or a decoder to decode received codewords of the transmission.

Abstract: An apparatus for transmitting a bit in addition to a plurality of payload data symbols of a communication protocol is provided. The apparatus comprises an input interface configured to receive information about a bit value of the bit. Further, the apparatus comprises a transmission circuit configured to, if the bit value is a first value, transmit the plurality of payload data symbols at predetermined positions in a data signal as pulses of variable pulse length. The respective pulse length of each of the pulses is selected based on the symbol value of the payload data symbol represented by the respective pulse. If the bit value is a second value, the transmission circuit is configured to transmit a pulse exhibiting a pulse length being longer than a maximum payload data symbol pulse length defined in the communication protocol at the predetermined position of the pulse for the d-th payload data symbol of the plurality of payload data symbols, d=k+i if k+i?z. d=([k+i] mod z) if k+i>z.

Abstract: Some demonstrative embodiments may include an apparatus including an integrated Radio Head (RH), the integrated RH including an antenna; a transceiver chain to transmit a Radio Frequency (RF) transmit (Tx) signal via the antenna, and to receive an RF Receive (Rx) signal via the antenna; a Physical layer (PHY) time-domain (TD) processor configured to generate a digital PHY TD Rx signal based on the RF Rx signal, and to cause the transceiver chain to transmit the RF Tx signal based on a digital PHY TD Tx signal; and a digital interface to communicate the digital PHY TD Tx signal and the digital PHY TD Rx signal over a digital link.

Abstract: An apparatus for generating a data signal comprises a processing circuit configured to generate the data signal, the data signal comprising a sequence of a first signal edge of a first type, a second signal edge of a second type, and a third signal edge of the first type, the first signal edge and the second signal edge being separated by a first time period corresponding to first data to be transmitted, and the second signal edge and the third signal edge being separated by a second time period corresponding to second data to be transmitted. An output interface circuit is configured to output the data signal.

Abstract: Various aspects provide a radiohead circuit and a communication device including the radiohead circuit. In an example, the radiohead circuit includes an antenna interface, a radio frequency front end configured to receive a wireless communication signal via the antenna interface, and a processor configured to perform an initial signal detection to detect if a wireless communication signal has been received based on whether a signal the processor received from the radio frequency front end fulfill a predefined radiohead circuit detection criterion, generate an initial signal detection information comprising an information as to whether the wireless communication signal has been received based on the initial signal detection; and provide the initial signal detection information to a communication interface for a final signal detection; the communication interface configured to couple the processor to a radiohead circuit-external processor external to the radiohead circuit.

Abstract: Devices and methods presented in this disclosure provide a single-channel WLAN device with a small add-on in the form of a second digital interface component and switch circuitry to allow for two such WLAN devices to be cascaded to support dual-channel WLAN operations. The WLAN device may include a first digital interface component including a first digital interface terminal configured for communicating with a first device external to the WLAN device; a second digital interface component including a second digital interface terminal configured for communicating with a second device external to the WLAN device; a switch circuitry coupling the first digital interface component to the second digital interface component and to a WLAN modem; and the WLAN modem configured to operate in one or more frequency bands and including one or more terminals configured to be coupled with a RF front end (FE) circuitry.

Abstract: In various aspects, a radio communication device is described including a housing, a plurality of radiohead circuits attached to the housing, baseband circuitry connected to the plurality of radiohead circuits via a digital interface; and one or more processors configured to select one or more radiohead circuits of the plurality of radiohead circuits for communication with another radio communication device to fulfill one or more predefined selection criteria with respect to a quality of a communication with the other radio communication device using the one or more selected radiohead circuits and to control the baseband circuitry to perform communication with the other radio communication device using the one or more selected radiohead circuits.

Abstract: A component (e.g. a module configuration system) of a device may include an interface and processor circuitry. The processor circuitry may be configured to: determine identification information of a hardware device (e.g. module, microchip) connected to the component via the interface; obtain device information for the connected hardware device based on the determined identification information; and initialize the connected hardware device based on the obtained device information.

Abstract: An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.

Abstract: An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.

Abstract: An apparatus for generating a data signal comprises a processing circuit configured to generate the data signal, the data signal comprising a sequence of a first signal edge of a first type, a second signal edge of a second type, and a third signal edge of the first type, the first signal edge and the second signal edge being separated by a first time period corresponding to first data to be transmitted, and the second signal edge and the third signal edge being separated by a second time period corresponding to second data to be transmitted. An output interface circuit is configured to output the data signal.

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.

Abstract: An encoding circuit for selecting a transmit data symbol for transmission over a data bus may include an alternate symbol generation circuit configured to generate an alternate data symbol based on an encoded data symbol scheduled for transmission over the data bus and a decision circuit configured to select the encoded data symbol or the alternate data symbol as the transmit symbol based on a plurality of phasors. The decision circuit may include a plurality of phasor generation circuits configured to generate the plurality of phasors based on the encoded data symbol and a plurality of target frequencies.

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.