Abstract: An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.

Abstract: An apparatus for generating a data signal comprises a processing circuit configured to generate the data signal, the data signal comprising a sequence of a first signal edge of a first type, a second signal edge of a second type, and a third signal edge of the first type, the first signal edge and the second signal edge being separated by a first time period corresponding to first data to be transmitted, and the second signal edge and the third signal edge being separated by a second time period corresponding to second data to be transmitted. An output interface circuit is configured to output the data signal.

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.

Abstract: An encoding circuit for selecting a transmit data symbol for transmission over a data bus may include an alternate symbol generation circuit configured to generate an alternate data symbol based on an encoded data symbol scheduled for transmission over the data bus and a decision circuit configured to select the encoded data symbol or the alternate data symbol as the transmit symbol based on a plurality of phasors. The decision circuit may include a plurality of phasor generation circuits configured to generate the plurality of phasors based on the encoded data symbol and a plurality of target frequencies.

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.

Abstract: In accordance with embodiments disclosed herein, there is provided systems and methods for a serial mid-speed interface. A first component includes a phase-locked loop (PLL) to receive an input clock signal and to output an output signal, an interface controller including a clock-management state machine, and a transmitter. The interface controller is to receive the input clock signal, receive the output signal from the PLL, and generate a speed-switch packet. The transmitter is to transmit a first plurality of packets to a second component at a clock rate based on the clock signal via a mid-speed interface, transmit the speed-switch packet to the second component, and transmit a second plurality of packets to the second component at a PLL rate based on the output signal, where the PLL rate is greater than the clock rate.

Abstract: A digitizer system includes a designated sensing area comprising a plurality of sensing lines for sensing an electromagnetic signal emitted by a stylus, circuitry for detecting output from the plurality of sensing lines and for determining an interacting position of the stylus in the designated sensing area based on the output detected and a peripheral area contiguous to the designated sensing area. The peripheral area includes a plurality of conductive elements for connecting the sensing lines to the circuitry and at least one auxiliary sensing line extending over the peripheral area in the vicinity of the conductive elements and connected to the circuitry. The auxiliary sensing line senses the electromagnetic signal when it is emitted over the peripheral area and the circuitry detects output from the at least one auxiliary sensing line.

Abstract: Some demonstrative embodiments include apparatuses, systems and/or methods of downloading firmware from a mobile device to a docking device. For example, an apparatus may include a docking controller to control a wireless communication unit of a mobile device to communicate with a docking device over a wireless communication link between the mobile device and the docking device, wherein the docking controller is to download a device-specific docking firmware from the mobile device to the docking device via the wireless communication link, the device-specific docking firmware is to control interaction between the docking device and the mobile device according to a configuration of the mobile device.

Abstract: An encoding circuit for selecting a transmit data symbol for transmission over a data bus may include an alternate symbol generation circuit configured to generate an alternate data symbol based on an encoded data symbol scheduled for transmission over the data bus and a decision circuit configured to select the encoded data symbol or the alternate data symbol as the transmit symbol based on a plurality of phasors. The decision circuit may include a plurality of phasor generation circuits configured to generate the plurality of phasors based on the encoded data symbol and a plurality of target frequencies.

Abstract: A method for customizing operation of a digitizer system operated with an electronic device is described, the electronic device including software applications. The method includes operating the digitizer system in a first mode of operation, the first mode of operation defined by a plurality of operating parameters, receiving instructions for adjusting one or more operating parameters of the digitizer system, wherein the instructions are defined by a software application, the software application operative to receive input from the digitizer system, and updating operation of the digitizer system responsive to the instructions defined by the software applications.

Abstract: A method for customizing operation of a digitizer system operated with an electronic device is described, the electronic device including software applications. The method includes operating the digitizer system in a first mode of operation, the first mode of operation defined by a plurality of operating parameters, receiving instructions for adjusting one or more operating parameters of the digitizer system, wherein the instructions are defined by a software application, the software application operative to receive input from the digitizer system, and updating operation of the digitizer system responsive to the instructions defined by the software applications.

Abstract: A method for customizing operation of a digitizer system operated with an electronic device is described, the electronic device including software applications. The method includes operating the digitizer system in a first mode of operation, the first mode of operation defined by a plurality of operating parameters, receiving instructions for adjusting one or more operating parameters of the digitizer system, wherein the instructions are defined by a software application, the software application operative to receive input from the digitizer system, and updating operation of the digitizer system responsive to the instructions defined by the software applications.

Abstract: An apparatus for and method of encapsulating Ethernet frames over a Very high speed Digital Subscriber Line (VDSL) transport facility. The VDSL frames are transmitted over a point to point VDSL link where they are subsequently extracted and forwarded as standard Ethernet frames. The VDSL facility transport system comprises an Ethernet to VDSL Customer Premises Equipment (CPE) coupled to a DSL Access Multiplexor (DSLAM) over a VDSL transport facility. The Ethernet to VDSL CPE functions to receive a 10BaseT Ethernet signal and encapsulate the Ethernet frame into a VDSL frame for transmission over the VDSL facility. The DSLAM is adapted to receive VDSL frames, extract Ethernet frames therefrom and generate and output a standard Ethernet signal. Ethernet frames are encapsulated within VDSL frames and transmitted on the wire pair without regard to the state of the SOC signals.

Abstract: A method for identifying input to a grid based digitizer sensor includes defining a matrix of data from outputs sampled from digitizer sensor, defining a function for modeling spread of a touch signal around a touch location and performing a convolution operation on the matrix of data based on the function defined for modeling spread of the touch signal. The grid based digitizer sensor defines a grid of junctions and entries in the matrix correspond to outputs at junctions of the grid based sensor. The convolution operation provides an updated matrix of data with enhanced touch information and detecting coordinates of the input to the digitizer sensor from the updated matrix of data.

Abstract: A pressure sensitive stylus, comprises a movable tip that recedes within a housing of the stylus in response to user applied contact pressure, wherein a displacement of the tip along an axis on which it recedes is a function of the applied contact pressure, and an optical sensor enclosed within the housing for optically sensing the displacement of the tip and for providing output in response to the sensing.

Abstract: A digitizer system includes a designated sensing area comprising a plurality of sensing lines for sensing an electromagnetic signal emitted by a stylus interacting with the digitizer system, circuitry for detecting output from the plurality of sensing lines and for determining an interacting position of the stylus in the designated sensing area based on the output detected and a peripheral area contiguous to the designated sensing area. The peripheral area includes a plurality of conductive elements for connecting the plurality of sensing lines to the circuitry and at least one auxiliary sensing line extending over the peripheral area in the vicinity of the plurality of conductive elements and connected to the circuitry. The at least one auxiliary sensing line is operable to sense the electromagnetic signal when it is emitted over the peripheral area and the circuitry is operable to detect output from the at least one auxiliary sensing line.

Abstract: An apparatus for and method of encapsulating Ethernet frames over a Very high speed Digital Subscriber Line (VDSL) transport facility. The VDSL frames are transmitted over a point to point VDSL link where they are subsequently extracted and forwarded as standard Ethernet frames. The VDSL facility transport system comprises an Ethernet to VDSL Customer Premises Equipment (CPE) coupled to a DSL Access Multiplexor (DSLAM) over a VDSL transport facility. The Ethernet to VDSL CPE functions to receive a 10BaseT Ethernet signal and encapsulate the Ethernet frame into a VDSL frame for transmission over the VDSL facility. The DSLAM is adapted to receive VDSL frames, extract Ethernet frames therefrom and generate and output a standard Ethernet signal. Ethernet frames are encapsulated within VDSL frames and transmitted on the wire pair without regard to the state of the SOC signals.

Abstract: An apparatus for and method of encapsulating Ethernet frames over a Very high speed Digital Subscriber Line (VDSL) transport facility. The VDSL frames are transmitted over a point to point VDSL link where they are subsequently extracted and forwarded as standard Ethernet frames. The VDSL facility transport system comprises an Ethernet to VDSL Customer Premises Equipment (CPE) coupled to a DSL Access Multiplexor (DSLAM) over a VDSL transport facility. The Ethernet to VDSL CPE functions to receive a 10BaseT Ethernet signal and encapsulate the Ethernet frame into a VDSL frame for transmission over the VDSL facility. The DSLAM is adapted to receive VDSL frames, extract Ethernet frames therefrom and generate and output a standard Ethernet signal. Ethernet frames are encapsulated within VDSL frames and transmitted on the wire pair without regard to the state of the SOC signals.

Abstract: An apparatus for and method of encapsulating Ethernet frames over a Very high speed Digital Subscriber Line (VDSL) transport facility. The VDSL frames are transmitted over a point to point VDSL link where they are subsequently extracted and forwarded as standard Ethernet frames. The VDSL facility transport system comprises an Ethernet to VDSL Customer Premises Equipment (CPE) coupled to a DSL Access Multiplexor (DSLAM) over a VDSL transport facility. The Ethernet to VDSL CPE functions to receive a 10BaseT Ethernet signal and encapsulate the Ethernet frame into a VDSL frame for transmission over the VDSL facility. The DSLAM is adapted to receive VDSL frames, extract Ethernet frames therefrom and generate and output a standard Ethernet signal. Ethernet frames are encapsulated within VDSL frames and transmitted on the wire pair without regard to the state of the SOC signals.