Abstract: The disclosed technology relates to imaging catheters. A method is provided that includes: receiving, from a plurality of transducers disposed on a catheter probe, a corresponding plurality of analog signals; selectively sampling the plurality of analog signals; multiplexing to produce a sequence of samples; and transmitting the sequence of samples to a receiver circuit. The receiver circuit includes a clock; an analog to digital converter (ADC) in communication with the clock; and a sampling phase correction circuit in communication with the clock and the ADC. The method further includes: determining optimum sampling times based on measured signal delays associated with the system; adjusting a phase of the clock based on the measured signal delays; and communicating the phase-adjusted clock to the transmitter circuit for the selective sampling of the analog signals. Certain embodiments of the disclosed technology may further be utilized in conjunction with beamforming.

Abstract: Embodiments of the present disclosure provide for a self-pumping structure, methods of self-pumping, and the like.

Abstract: Embodiments of the present disclosure provide for a self-pumping structure, methods of self-pumping, and the like.

Abstract: Apparatus, including an insertion tube, configured to be inserted into a body cavity and having a first lumen having a first lumen diameter and a distal opening, and a tubular channel, having a second lumen and an outer channel diameter smaller than the first lumen diameter, inserted into the first lumen. The apparatus includes a support structure, configured to be passed through a space between an inner wall of the insertion tube and an outer wall of the tubular channel to the distal opening in a folded state and to unfold, upon exit of the support structure through the distal opening, in a direction transverse to the first lumen to reach a support dimension that is greater than the first lumen diameter. A plurality of planar two-dimensional arrays of ultrasonic transducers are supported by the support structure, the arrays having transverse dimensions less than the first lumen diameter.

Abstract: A CMUT on CMOS imaging chip is disclosed. The imaging chip can use direct connection, CMOS architecture to minimize external connections and minimize chip cross-section. The CMOS architecture can enable substantially the entire chip area to be utilized for element placement. The chip can utilize arbitrarily selected transmit (Tx) and receive (Rx) element arrays to improve image quality, while reducing sampling time. The chip can comprise a plurality of dummy elements dispersed throughout the Tx and Rx elements to reduce cross-talk. The chip can utilize batch firing techniques to increase transmit power using sparse Tx arrays. The chip can comprise hexagonal Tx and or Rx subarrays for improved image quality with reduce sample sizes. The chip can utilize electrode geometry, bias voltage, and polarity to create phased and amplitude apodized arrays of Tx and Rx elements.

Abstract: An intravascular guidewire with integrated imaging and pressure measurement capabilities is disclosed. The guidewire can comprise an integrated CMUT-on-CMOS ultrasound transducer array to provide 3D imaging of vasculature and other tissue. The guidewire can also comprise a conventional FFR pressure sensor or Doppler flow sensor. Due to the low power consumption of the chip, power can be provided via a single pair of wire pair proximate the core wire of the guidewire to provide power and ground to the chip. The system can also include a power wire, a ground wire, and a data wire, the data wire using similar data transmission techniques. Data from the sensor array can be transmitted over the power wire using, for example, RF or impedance modulation. Data can also be transmitted through the body using an ultra wideband wireless transmitter and flexible patch antenna on the skin.

Abstract: A CMUT on CMOS imaging chip is disclosed. The imaging chip can use direct connection, CMOS architecture to minimize both internal and external connection complexity. Intelligent power management can enable the chip to be used for various imaging applications with strict power constraints, including forward-looking intra-vascular ultrasound imaging. The chip can use digital logic to control transmit and receive events to minimize power consumption and maximize image resolution. The chip can be integrated into a probe, or catheter, and requires minimal external connections. The chip can comprise integrated temperature control to prevent overheating.

Abstract: An intravascular guidewire with integrated imaging and pressure measurement capabilities is disclosed. The guidewire can comprise an integrated CMUT-on-CMOS ultrasound transducer array to provide 3D imaging of vasculature and other tissue. The guidewire can also comprise a conventional FFR pressure sensor or Doppler flow sensor. Due to the low power consumption of the chip, power can be provided via a single pair of wire pair proximate the core wire of the guidewire to provide power and ground to the chip. The system can also include a power wire, a ground wire, and a data wire, the data wire using similar data transmission techniques. Data from the sensor array can be transmitted over the power wire using, for example, RF or impedance modulation. Data can also be transmitted through the body using an ultra wideband wireless transmitter and flexible patch antenna on the skin.

Abstract: Capacitive micromachined ultrasonic transducer (“CMUT”) devices and fabrication methods are provided. The CMUT devices can include integrated circuit devices utilizing direct connections to various CMOS electronic components. The use of integrated connections can reduce overall package size and improve functionality for use in ultrasonic imaging applications. CMUT devices can also be manufactured on multiple silicon chip layers with each layer connected utilizing through silicon vias (TSVs). External power connections can be provided if high biasing voltages are required. Forward and side looking CMUT arrays can be manufactured for use in a variety of ultrasound technologies.

Abstract: Fuel processors, methods of using fuel processors, and the like, are disclosed.

Abstract: A microphone having an optical component for converting the sound-induced motion of the diaphragm into an electronic signal using a diffraction grating. The microphone with inter-digitated fingers is fabricated on a silicon substrate using a combination of surface and bulk micromachining techniques. A 1 mm×2 mm microphone diaphragm, made of polysilicon, has stiffeners and hinge supports to ensure that it responds like a rigid body on flexible hinges. The diaphragm is designed to respond to pressure gradients, giving it a first order directional response to incident sound. This mechanical structure is integrated with a compact optoelectronic readout system that displays results based on optical interferometry.

Abstract: A CMUT on CMOS imaging chip is disclosed. The imaging chip can use direct connection, CMOS architecture to minimize external connections and minimize chip cross-section. The CMOS architecture can enable substantially the entire chip area to be utilized for element placement. The chip can utilize arbitrarily selected transmit (Tx) and receive (Rx) element arrays to improve image quality, while reducing sampling time. The chip can comprise a plurality of dummy elements dispersed throughout the Tx and Rx elements to reduce cross-talk. The chip can utilize batch firing techniques to increase transmit power using sparse Tx arrays. The chip can comprise hexagonal Tx and or Rx subarrays for improved image quality with reduce sample sizes. The chip can utilize electrode geometry, bias voltage, and polarity to create phased and amplitude apodized arrays of Tx and Rx elements.

Abstract: Harmonic capacitive micromachined ultrasonic transducer (“cMUT”) devices and fabrication methods are provided. In a preferred embodiment, a harmonic cMUT device generally comprises a membrane having a non-uniform mass distribution. A mass load positioned along the membrane can be utilized to alter the mass distribution of the membrane. The mass load can be a part of the membrane and formed of the same material or a different material as the membrane. The mass load can be positioned to correspond with a vibration mode of the membrane, and also to adjust or shift a vibration mode of the membrane. The mass load can also be positioned at predetermined locations along the membrane to control the harmonic vibrations of the membrane. A cMUT can also comprise a cavity defined by the membrane, a first electrode proximate the membrane, and a second electrode proximate a substrate. Other embodiments are also claimed and described.

Abstract: A CMUT on CMOS imaging chip is disclosed. The imaging chip can use direct connection, CMOS architecture to minimize both internal and external connection complexity. Intelligent power management can enable the chip to be used for various imaging applications with strict power constraints, including forward-looking intra-vascular ultrasound imaging. The chip can use digital logic to control transmit and receive events to minimize power consumption and maximize image resolution. The chip can be integrated into a probe, or catheter, and requires minimal external connections. The chip can comprise integrated temperature control to prevent overheating.

Abstract: Asymmetric membrane capacitive micromachined ultrasonic transducer (“cMUT”) devices and fabrication methods are provided. In a preferred embodiment, a cMUT device according to the present invention generally comprises a membrane having asymmetric properties. The membrane can have a varied width across its length so that its ends have different widths. The asymmetric membrane can have varied flex characteristics due to its varied width dimensions. In another preferred embodiment, a cMUT device according to the present invention generally comprises an electrode element having asymmetric properties. The electrode element can have a varied width across its length so that its ends have different widths. The asymmetric electrode element can have different reception and transmission characteristics due to its varied width dimensions. In another preferred embodiment, a mass load positioned along the membrane can alter the mass distribution of the membrane. Other embodiments are also claimed and described.

Abstract: Multiple electrode element capacitive micromachined ultrasonic transducer (“cMUT”) devices and fabrication methods are provided. Some embodiments can include a forward or side looking catheter device having a plurality of cMUT arrays for transmitting and receiving ultrasonic energy. The forward or side looking intravascular device can generally comprise a plurality of cMUT arrays being disposed on a substrate in a spaced apart arrangement. The plurality of cMUT arrays can each comprise a plurality of cMUT elements. At least a portion of the plurality of cMUT elements can comprise a flexible membrane disposed above the substrate and a multiple element electrode. The multiple element electrode can comprise a plurality of electrode elements shaped and sized to have a width less than the width of the membrane, and be further configured to operatively shape the membrane in a reception state to receive ultrasonic energy and a transmission state to transmit ultrasonic energy.

Abstract: Embodiments of the present disclosure provide for self-pumping structure, methods of self-pumping, and the like.

Abstract: Multiple electrode element capacitive micromachined ultrasonic transducer (“cMUT”) devices and fabrication methods are provided. A cMUT device generally comprises a top electrode disposed within a membrane, a bottom electrode disposed on a substrate, and a cavity between the membrane and the bottom electrode. In a preferred embodiment of the present invention, at least one of the first electrode and the second electrode comprises a plurality of electrode elements. The electrode elements can be positioned and energized to shape the membrane and efficiently transmit and receive ultrasonic energy, such as ultrasonic waves. Other embodiments are also claimed and described.

Abstract: Electrospray systems, electrospray structures, removable electrospray structures, methods of operating electrospray systems, and methods of fabricating electrospray systems, are disclosed.

Abstract: A system for measuring a property of a sample includes an actuation device disposed on a substrate and includes a flexible surface spaced apart from the substrate and configured so as to allow placement of the sample thereupon. The actuation device also includes a vertical actuator that is configured to cause the flexible surface to achieve a predetermined displacement from the substrate when a corresponding potential is applied thereto. A sensing probe is disposed so as to be configured to interact with the sample thereby sensing the property of the sample.