Patents by Inventor Fabio Quaglia
Fabio Quaglia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133843Abstract: An integrated electronic system is provided with a package formed by a support base and a coating region arranged on the support base and having at least a first system die, including semiconductor material, coupled to the support base and arranged in the coating region. The integrated electronic system also has, within the package, a monitoring system configured to determine the onset of defects within the coating region, through the emission of acoustic detection waves and the acquisition of corresponding received acoustic waves, whose characteristics are affected by, and therefore are indicative of, the aforementioned defects.Type: ApplicationFiled: October 17, 2023Publication date: April 25, 2024Applicant: STMICROELECTRONICS S.r.l.Inventors: Domenico GIUSTI, Marco DEL SARTO, Fabio QUAGLIA, Enri DUQI
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Patent number: 11950511Abstract: A device for emitting an ultrasound acoustic wave in a propagation medium, comprising: a package including a base substrate and a cap coupled to the base substrate and defining therewith a chamber in the package; a semiconductor die, coupled to the base substrate in the chamber, comprising a semiconductor body; a micromachined ultrasonic transducer (MUT) integrated at least in part in the semiconductor body and including a cavity in the semiconductor body and a membrane suspended over the cavity; and an actuator, operatively coupled to the membrane, which can be operated for generating a deflection of the membrane. The membrane is designed in such a way that a resonance frequency thereof matches an acoustic resonance frequency that, during operation of the MUT, develops in said chamber of the package.Type: GrantFiled: February 15, 2019Date of Patent: April 2, 2024Assignee: STMICROELECTRONICS S.R.L.Inventors: Francesco Procopio, Fabio Quaglia
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Patent number: 11891298Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.Type: GrantFiled: June 13, 2022Date of Patent: February 6, 2024Assignee: STMICROELECTRONICS S.r.l.Inventors: Fabio Quaglia, Marco Ferrera, Marco Del Sarto
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Publication number: 20240034618Abstract: A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.Type: ApplicationFiled: October 16, 2023Publication date: February 1, 2024Applicant: STMICROELECTRONICS S.r.l.Inventors: Domenico GIUSTI, Fabio QUAGLIA
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Publication number: 20230381816Abstract: Micromachined pressure transducer including: a fixed body of semiconductor material, which laterally delimits a main cavity; a transduction structure, which is suspended on the main cavity and includes at least a pair of deformable structures and a movable region, which is formed by semiconductor material and is mechanically coupled to the fixed body through the deformable structures. Each deformable structure includes: a support structure of semiconductor material, which includes a first and a second beam, each of which has ends fixed respectively to the fixed body and to the movable region, the first beam being superimposed, at a distance, on the second beam; and at least one piezoelectric transduction structure, mechanically coupled to the first beam. The piezoelectric transduction structures are electrically controllable so that they cause corresponding deformations of the respective support structures and a consequent translation of the movable region along a translation direction.Type: ApplicationFiled: May 19, 2023Publication date: November 30, 2023Applicant: STMICROELECTRONICS S.r.l.Inventors: Domenico GIUSTI, Fabio QUAGLIA, Marco FERRERA
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Patent number: 11807519Abstract: A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.Type: GrantFiled: June 2, 2021Date of Patent: November 7, 2023Assignee: STMICROELECTRONICS S.r.l.Inventors: Domenico Giusti, Fabio Quaglia
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Publication number: 20230129720Abstract: PMUT acoustic transducer formed in a body of semiconductor material having a face and accommodating a plurality of first buried cavities, having an annular shape, arranged concentrically with each other and extending at a distance from the face of the body. The first buried cavities delimit from below a plurality of first membranes formed by the body so that each first membrane extends between a respective first buried cavity of the plurality of first buried cavities and the face of the body. A plurality of piezoelectric elements extend on the face of the body, each piezoelectric element extending above a respective first membrane of the plurality of first membranes. The first membranes have different widths, variable between a minimum value and a maximum value.Type: ApplicationFiled: October 14, 2022Publication date: April 27, 2023Applicant: STMICROELECTRONICS S.r.l.Inventors: Domenico GIUSTI, Fabio QUAGLIA, Carlo Luigi PRELINI
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Patent number: 11600765Abstract: The MEMS actuator is formed by a substrate, which surrounds a cavity; by a deformable structure suspended on the cavity; by an actuation structure formed by a first piezoelectric region of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure formed by a second piezoelectric region of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.Type: GrantFiled: December 29, 2020Date of Patent: March 7, 2023Assignee: STMICROELECTRONICS S.r.l.Inventors: Domenico Giusti, Carlo Luigi Prelini, Marco Ferrera, Carla Maria Lazzari, Luca Seghizzi, Nicolo′ Boni, Roberto Carminati, Fabio Quaglia
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Publication number: 20220306456Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.Type: ApplicationFiled: June 13, 2022Publication date: September 29, 2022Applicant: STMICROELECTRONICS S.r.l.Inventors: Fabio QUAGLIA, Marco FERRERA, Marco DEL SARTO
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Patent number: 11383971Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.Type: GrantFiled: July 22, 2019Date of Patent: July 12, 2022Assignee: STMICROELECTRONICS S.r.l.Inventors: Fabio Quaglia, Marco Ferrera, Marco Del Sarto
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Publication number: 20220169497Abstract: A micromechanical device for transducing acoustic waves in a propagation medium, comprising: a body; a first electrode structure superimposed to the body and electrically insulated from the body, the first electrode structure and the body defining between them a first buried cavity; and a first piezoelectric element superimposed to the first electrode structure, wherein the body, the first electrode structure, and the buried cavity form a first capacitive ultrasonic transducer, and the first electrode structure and the first piezoelectric element form a first piezoelectric ultrasonic transducer.Type: ApplicationFiled: November 30, 2021Publication date: June 2, 2022Applicant: STMICROELECTRONICS S.r.l.Inventors: Alessandro Stuart SAVOIA, Domenico GIUSTI, Marco FERRERA, Fabio QUAGLIA
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Publication number: 20220118480Abstract: A PMUT device includes a membrane element extending perpendicularly to a first direction and configured to generate and receive ultrasonic waves by oscillating about an equilibrium position. At least two piezoelectric elements are included, with each one located over the membrane element along the first direction and configured to cause the membrane element to oscillate when electric signals are applied to the piezoelectric element, and generate electric signals in response to oscillations of the membrane element. The membrane element has a lobed shape along a plane perpendicular to the first direction, with the lobed shape including at least two lobes. The membrane element includes for each piezoelectric member a corresponding membrane portion including a corresponding lobe, with each piezoelectric member being located over its corresponding membrane portion.Type: ApplicationFiled: October 8, 2021Publication date: April 21, 2022Applicant: STMicroelectronics S.r.l.Inventors: Domenico GIUSTI, Fabio QUAGLIA, Marco FERRERA
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Publication number: 20220119246Abstract: A PMUT device includes a membrane element adapted to generate and receive ultrasonic waves by oscillating, about an equilibrium position, at a corresponding resonance frequency. A piezoelectric element is located over the membrane element along a first direction and configured to cause the membrane element to oscillate when electric signals are applied to the piezoelectric element, and generate electric signals in response to oscillations of the membrane element. A damper is configured to reduce free oscillations of the membrane element, and the damper includes a damper cavity surrounding the membrane element, and a polymeric member having at least a portion over the damper cavity along the first direction.Type: ApplicationFiled: October 8, 2021Publication date: April 21, 2022Applicant: STMicroelectronics S.r.l.Inventors: Domenico GIUSTI, Marco FERRERA, Fabio QUAGLIA
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Publication number: 20220102618Abstract: A piezoelectric microelectromechanical structure is provided with a piezoelectric stack having a main extension in a horizontal plane and a variable section in a plane transverse to the horizontal plane. The stack is formed by a bottom-electrode region, a piezoelectric material region arranged on the bottom-electrode region, and a top-electrode region arranged on the piezoelectric material region. The piezoelectric material region has, as a result of the variable section, a first thickness along a vertical axis transverse to the horizontal plane at a first area, and a second thickness along the same vertical axis at a second area. The second thickness is smaller than the first thickness. The structure at the first and second areas can form piezoelectric detector and a piezoelectric actuator, respectively.Type: ApplicationFiled: September 27, 2021Publication date: March 31, 2022Applicant: STMicroelectronics S.r.l.Inventors: Domenico GIUSTI, Irene MARTINI, Davide ASSANELLI, Paolo FERRARINI, Carlo Luigi PRELINI, Fabio QUAGLIA
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Publication number: 20210395075Abstract: A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.Type: ApplicationFiled: June 2, 2021Publication date: December 23, 2021Applicant: STMICROELECTRONICS S.r.l.Inventors: Domenico GIUSTI, Fabio QUAGLIA
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Publication number: 20210351338Abstract: The MEMS actuator is formed by a substrate, which surrounds a cavity; by a deformable structure suspended on the cavity; by an actuation structure formed by a first piezoelectric region of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure formed by a second piezoelectric region of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.Type: ApplicationFiled: December 29, 2020Publication date: November 11, 2021Applicant: STMICROELECTRONICS S.r.l.Inventors: Domenico GIUSTI, Carlo Luigi PRELINI, Marco FERRERA, Carla Maria LAZZARI, Luca SEGHIZZI, Nicolo' BONI, Roberto CARMINATI, Fabio QUAGLIA
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Publication number: 20200024131Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.Type: ApplicationFiled: July 22, 2019Publication date: January 23, 2020Inventors: Fabio QUAGLIA, Marco FERRERA, Marco DEL SARTO
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Publication number: 20190259932Abstract: A device for emitting an ultrasound acoustic wave in a propagation medium, comprising: a package including a base substrate and a cap coupled to the base substrate and defining therewith a chamber in the package; a semiconductor die, coupled to the base substrate in the chamber, comprising a semiconductor body; a micromachined ultrasonic transducer (MUT) integrated at least in part in the semiconductor body and including a cavity in the semiconductor body and a membrane suspended over the cavity; and an actuator, operatively coupled to the membrane, which can be operated for generating a deflection of the membrane. The membrane is designed in such a way that a resonance frequency thereof matches an acoustic resonance frequency that, during operation of the MUT, develops in said chamber of the package.Type: ApplicationFiled: February 15, 2019Publication date: August 22, 2019Inventors: Francesco PROCOPIO, Fabio QUAGLIA
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Patent number: 10145728Abstract: Described herein is a transceiver circuit for a capacitive micromachined ultrasonic transducer (CMUT), provided with: a transmitter stage, which generates excitation pulses for a first node of the CMUT transducer during a transmitting phase, a second node of the CMUT transducer being coupled to a biasing voltage; a receiver stage that is selectively coupled to the first node during a receiving phase and has an amplification stage; a switching stage that couples the receiver stage to the first node during the receiving phase and decouples the receiver stage from the first node during the transmitting phase. The amplification stage is provided with a charge amplifier that has an input terminal and is biased as a function of a biasing voltage; and the switching stage is coupled to the same biasing voltage thereby minimizing an injection of charge into the input terminal upon switching from the transmitting phase to the receiving phase.Type: GrantFiled: June 25, 2015Date of Patent: December 4, 2018Assignee: STMICROELECTRONICS S.R.L.Inventors: Antonio Davide Leone, Davide Ugo Ghisu, Fabio Quaglia
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Patent number: 10114114Abstract: An ultrasonic probe includes: an ultrasonic transducer; an amplification stage; a bias circuit, which determines a bias voltage on an input terminal of the amplification stage; and a selector having an intermediate node, a high-voltage switch between the intermediate node and the transducer, and a first low-voltage switch between the intermediate node and the input terminal. A control unit controls the high-voltage switch and the first low-voltage switch so as to alternately couple and decouple the amplification stage and the transducer. A precharge circuit determines a precharge voltage on the intermediate node as a function of the bias voltage, before the amplification stage and the transducer are coupled.Type: GrantFiled: March 26, 2015Date of Patent: October 30, 2018Assignee: STMICROELECTRONICS S.R.L.Inventors: Antonio Davide Leone, Davide Ugo Ghisu, Fabio Quaglia