Abstract: The present disclosure is directed to transducer assemblies or device in which one or more buried cavities are present within a substrate and define or form one or more membranes along a surface of the substrate. One or more piezoelectric actuators are formed on the one or more membranes and the one or more piezoelectric actuators drive the membranes at an operating frequency with an operating bandwidth of the transducer assemblies. Each of the one or more membranes is anchored at respective portions to a main body portion of the substrate to provide robust and strong anchoring of each of the one or more membranes to push unwanted flexure modes outside the operating bandwidth of the transducer assemblies.

Abstract: A piezoelectric microelectromechanical structure is provided with a piezoelectric stack having a main extension in a horizontal plane and a variable section in a plane transverse to the horizontal plane. The stack is formed by a bottom-electrode region, a piezoelectric material region arranged on the bottom-electrode region, and a top-electrode region arranged on the piezoelectric material region. The piezoelectric material region has, as a result of the variable section, a first thickness along a vertical axis transverse to the horizontal plane at a first area, and a second thickness along the same vertical axis at a second area. The second thickness is smaller than the first thickness. The structure at the first and second areas can form piezoelectric detector and a piezoelectric actuator, respectively.

Abstract: A PMUT device includes a membrane element extending perpendicularly to a first direction and configured to generate and receive ultrasonic waves by oscillating about an equilibrium position. At least two piezoelectric elements are included, with each one located over the membrane element along the first direction and configured to cause the membrane element to oscillate when electric signals are applied to the piezoelectric element, and generate electric signals in response to oscillations of the membrane element. The membrane element has a lobed shape along a plane perpendicular to the first direction, with the lobed shape including at least two lobes. The membrane element includes for each piezoelectric member a corresponding membrane portion including a corresponding lobe, with each piezoelectric member being located over its corresponding membrane portion.

Abstract: A piezoelectric microelectromechanical structure is provided with a piezoelectric stack having a main extension in a horizontal plane and a variable section in a plane transverse to the horizontal plane. The stack is formed by a bottom-electrode region, a piezoelectric material region arranged on the bottom-electrode region, and a top-electrode region arranged on the piezoelectric material region. The piezoelectric material region has, as a result of the variable section, a first thickness along a vertical axis transverse to the horizontal plane at a first area, and a second thickness along the same vertical axis at a second area. The second thickness is smaller than the first thickness. The structure at the first and second areas can form piezoelectric detector and a piezoelectric actuator, respectively.

Abstract: A PMUT device includes a membrane element adapted to generate and receive ultrasonic waves by oscillating, about an equilibrium position, at a corresponding resonance frequency. A piezoelectric element is located over the membrane element along a first direction and configured to cause the membrane element to oscillate when electric signals are applied to the piezoelectric element, and generate electric signals in response to oscillations of the membrane element. A damper is configured to reduce free oscillations of the membrane element, and the damper includes a damper cavity surrounding the membrane element, and a polymeric member having at least a portion over the damper cavity along the first direction.

Abstract: A method for manufacturing a MEMS device includes forming a first solid body by forming, on a substrate, a layered structure having a thickness of a value comprised between 4 and 10 ?m, with the layered structure having a first surface that is uniformly flat or planar throughout the extension thereof that faces the substrate. The method further includes forming, on a second surface of the layered structure opposite to the first surface in a direction, multiple transducer devices. The method then proceeds with coupling the first solid body to a supporting structure, and completely removing the substrate to expose said uniformly flat or planar surface.

Abstract: Disclosed herein is an array of ultrasound devices. Each ultrasound device includes a first piezoelectric stack carried by a membrane and forming, together with the membrane, a first piezoelectric micromachined ultrasonic transducer (PMUT), and a plurality of second piezoelectric stacks carried by the membrane and positioned about a periphery thereof, each second piezoelectric stack forming, together with the membrane, a second PMUT. During operation, the first piezoelectric stack is configured to vibrate the membrane in response to application of an alternating voltage to the first piezoelectric stack to thereby generate at least one outgoing ultrasonic pulse toward a target, and during operation, the plurality of second piezoelectric stacks are configured to generate sense voltages in response to bending thereof induced by vibration of the membrane by incoming ultrasonic reflections off the target.

Abstract: An array of piezoelectric micromachined ultrasound transducers (PMUTs) includes a substrate having first and second cavities buried therein. A first piezoelectric stack is carried by the substrate and at least partially overlays the first cavity. A second piezoelectric stack is carried by the substrate and at least partially overlays the second cavity. A thickness of the substrate between the second cavity and the second piezoelectric stack forms a membrane. Circuitry operates the second piezoelectric stack so as to vibrate the membrane to generate a pulse of ultrasound and to immediately subsequently operate the first piezoelectric stack to cause deformation of the second cavity which results in an increase in a resonant frequency of the membrane.

Abstract: An integrated electronic system is provided with a package formed by a support base and a coating region arranged on the support base and having at least a first system die, including semiconductor material, coupled to the support base and arranged in the coating region. The integrated electronic system also has, within the package, a monitoring system configured to determine the onset of defects within the coating region, through the emission of acoustic detection waves and the acquisition of corresponding received acoustic waves, whose characteristics are affected by, and therefore are indicative of, the aforementioned defects.

Abstract: The present disclosure is directed to transducer assemblies or device in which one or more buried cavities are present within a substrate and define or form one or more membranes along a surface of the substrate. One or more piezoelectric actuators are formed on the one or more membranes and the one or more piezoelectric actuators drive the membranes at an operating frequency with an operating bandwidth of the transducer assemblies. Each of the one or more membranes is anchored at respective portions to a main body portion of the substrate to provide robust and strong anchoring of each of the one or more membranes to push unwanted flexure modes outside the operating bandwidth of the transducer assemblies.

Abstract: MEMS device comprising: a signal processing assembly; a transduction module comprising a plurality of transducer devices; a stiffening structure at least partially surrounding each transducer device; one or more coupling pillars for each transducer device, extending on the stiffening structure and configured to physically and electrically couple the transduction module to the signal processing assembly, to carry control signals of the transducer devices. Each conductive coupling element has a section having a shape such as to maximize the overlapping surface with the stiffening structure around the respective transducer device. This shape includes hypocycloid with a number of cusps equal to or greater than three; triangular; quadrangular.

Abstract: An integrated electronic system is provided with a package formed by a support base and a coating region arranged on the support base and having at least a first system die, including semiconductor material, coupled to the support base and arranged in the coating region. The integrated electronic system also has, within the package, a monitoring system configured to determine the onset of defects within the coating region, through the emission of acoustic detection waves and the acquisition of corresponding received acoustic waves, whose characteristics are affected by, and therefore are indicative of, the aforementioned defects.

Abstract: A device for emitting an ultrasound acoustic wave in a propagation medium, comprising: a package including a base substrate and a cap coupled to the base substrate and defining therewith a chamber in the package; a semiconductor die, coupled to the base substrate in the chamber, comprising a semiconductor body; a micromachined ultrasonic transducer (MUT) integrated at least in part in the semiconductor body and including a cavity in the semiconductor body and a membrane suspended over the cavity; and an actuator, operatively coupled to the membrane, which can be operated for generating a deflection of the membrane. The membrane is designed in such a way that a resonance frequency thereof matches an acoustic resonance frequency that, during operation of the MUT, develops in said chamber of the package.

Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.

Abstract: A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.

Abstract: Micromachined pressure transducer including: a fixed body of semiconductor material, which laterally delimits a main cavity; a transduction structure, which is suspended on the main cavity and includes at least a pair of deformable structures and a movable region, which is formed by semiconductor material and is mechanically coupled to the fixed body through the deformable structures. Each deformable structure includes: a support structure of semiconductor material, which includes a first and a second beam, each of which has ends fixed respectively to the fixed body and to the movable region, the first beam being superimposed, at a distance, on the second beam; and at least one piezoelectric transduction structure, mechanically coupled to the first beam. The piezoelectric transduction structures are electrically controllable so that they cause corresponding deformations of the respective support structures and a consequent translation of the movable region along a translation direction.

Abstract: A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.

Abstract: PMUT acoustic transducer formed in a body of semiconductor material having a face and accommodating a plurality of first buried cavities, having an annular shape, arranged concentrically with each other and extending at a distance from the face of the body. The first buried cavities delimit from below a plurality of first membranes formed by the body so that each first membrane extends between a respective first buried cavity of the plurality of first buried cavities and the face of the body. A plurality of piezoelectric elements extend on the face of the body, each piezoelectric element extending above a respective first membrane of the plurality of first membranes. The first membranes have different widths, variable between a minimum value and a maximum value.

Abstract: The MEMS actuator is formed by a substrate, which surrounds a cavity; by a deformable structure suspended on the cavity; by an actuation structure formed by a first piezoelectric region of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure formed by a second piezoelectric region of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.

Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.