Patents by Inventor Fang Cheng

Fang Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10982305
    Abstract: The present teaching is generally directed to soft magnetic alloys. In particular, the present teaching is directed to soft magnetic alloys including Samarium (“Sm”). In a non-limiting embodiment, an Sm-containing magnetic alloy is described including 15 wt % to 55 wt % of Cobalt (“Co”), less than 2.5 wt % of Sm, and 35 wt % to 75 wt % of Iron (“Fe”). The Sm-containing magnetic alloy may further include at least one element X, selected from a group including Vanadium (“V”), Boron (“B”), Carbon (“C”), Chromium (“Cr”), Manganese (“Mn”), Molybdenum (“Mo”), Niobium (“Nb”), Nickel (“Ni”), Titanium (“Ti”), Tungsten (“W”), and Silicon (“Si”). The Sm-containing magnetic alloy may further have a magnetic flux density of at least 2.5 Tesla.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: April 20, 2021
    Assignees: TAIWAN POWDER TECHNOLOGIES CO., LTD., CHINA POWDER TECHNOLOGIES CO., LTD., HPM LABS CO., LTD.
    Inventors: Kuen-Shyang Hwang, Guo-Jiun Shu, Fang-Cheng Chou
  • Patent number: 10983278
    Abstract: An apparatus comprises a substrate having a plateau region and a trench region, a metal layer over the plateau region, a semiconductor component over the trench region, wherein a gap is between the plateau region and the semiconductor component, an adhesion promoter layer over the plateau region, the semiconductor component and the gap, a dielectric layer over the adhesion promoter layer and a bonding interface formed between the adhesion promoter layer and the dielectric layer, wherein the bonding interface comprises a chemical structure comprising a first dielectric material of the adhesion promoter layer and a second dielectric material of the dielectric layer.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: April 20, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hao Tseng, Ying-Hao Kuo, Kai-Fang Cheng, Hai-Ching Chen, Tien-I Bao
  • Patent number: 10978496
    Abstract: A pixel array substrate and a driving method of a pixel array substrate are provided. The pixel array substrate includes a substrate, at least one pixel structure located on the substrate and a liquid crystal layer. The at least one pixel structure includes a micro light emitting diode (?LED), a supporting wall, a first bottom electrode located between the supporting wall and the ?LED, and a first top electrode disposed on the supporting wall and separated from the first bottom electrode. The ?LED includes a first electrode, a first semiconductor layer electrically connected to the first electrode, a second semiconductor layer, a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, and a second electrode electrically connected to the second semiconductor layer. The liquid crystal layer is disposed on the first bottom electrode and located between the supporting wall and the ?LED.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: April 13, 2021
    Assignee: Au Optronics Corporation
    Inventors: Fang-Cheng Yu, Chen-Chang Chen, Tzu-Yi Tsao, Pin-Miao Liu, Cheng-Yeh Tsai
  • Publication number: 20210082904
    Abstract: A semiconductor device includes a first fin, a first continuous fin and continuous gates. The first fin is formed on a substrate, and includes first and second portions that are spaced apart by a first recess. A side of the first portion and a side of the second portion are located at two sides of the first recess, respectively. The first continuous fin is formed on the substrate, and extends along the first portion, the first recess and the second portion. The continuous gates are formed on the substrate, and arranged to intersect the first continuous fin and the first fin in a layout view. A first number of the continuous gates are disposed across the first recess and each of the first number of the continuous gates is disposed between the two sides of the first recess in a layout view. A method is also disclosed herein.
    Type: Application
    Filed: November 30, 2020
    Publication date: March 18, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-I HUANG, Ting-Wei CHIANG, Shih-Chi FU, Sheng-Fang CHENG, Jung-Chan YANG
  • Patent number: 10933517
    Abstract: A knife that includes a blade, a handle affixed to an end of the blade and a screwdriver bit fixed to the handle and moveable between an extended position beyond the base of the handle and a retracted position in which the screwdriver bit is arranged completely within the opening of the handle.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: March 2, 2021
    Assignee: ALLWAY TOOLS, INC.
    Inventors: Donald Gringer, Yuan Fang Cheng
  • Patent number: 10930273
    Abstract: The present invention is an action agent architecture in a scalable multi-service virtual assistant platform that can construct a fluid and dynamic dialogue by assembling responses to end user utterances from two kinds of agents, information agents and action agents. The virtual assistant platform comprises a plurality of action agents to perform two or more actions in response to parsed user input, contextual data, and/or an information value obtained from an information agent. The plurality of action agents are interrelated via at least one follow-up connection which interrelates any two of the action agents such that a second action agent follows-up with a second action after a first action agent completes a first action based on a trigger condition. The second action agent utilizes at least one information value set by the first action agent or a system state change triggered by the first action agent.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: February 23, 2021
    Assignee: Line Global, Inc.
    Inventors: Fang Cheng, Dennis Wu, Jian Da Chen
  • Patent number: 10914895
    Abstract: A package structure including a plurality of first dies and an insulating encapsulant is provided. The plurality of first dies each include a first waveguide layer having a first waveguide path of a bent pattern, wherein the first waveguide layers of the plurality of first dies are optically coupled to each other to form an optical route. The insulating encapsulant encapsulates the plurality of first dies.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: February 9, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Kuang Liao, Cheng-Chun Tsai, Chen-Hua Yu, Fang-Cheng Chen, Wen-Chih Chiou, Ping-Jung Wu
  • Publication number: 20210013389
    Abstract: A pixel array substrate has a plurality of sub-pixel regions, wherein a pixel structure of an individual sub-pixel region includes a first signal line, a second signal line, a first contact pad, a second contact pad, a light-emitting diode, a first conductive structure, and a flux structure layer. The first contact pad and the second contact pad are respectively electrically connected with the first signal line and the second signal line. The light-emitting diode is disposed on the first contact pad. A portion of the first conductive structure is disposed between the first contact pad and a first electrode of the light-emitting diode. The flux structure layer partially surrounds the first conductive structure and the light-emitting diode. A top portion of the flux structure layer is higher than a top surface of the first electrode and is lower than a bottom surface of a light-emitting layer of the light-emitting diode.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Applicant: Au Optronics Corporation
    Inventors: Fang-Cheng Yu, Cheng-Yeh Tsai
  • Publication number: 20210011013
    Abstract: The present disclosure discloses a novel biochip substrate, a preparation method and an application thereof. The surface of the novel biochip substrate contains active vinyl sulfone groups. The preparation method involves a one-step reaction of a compound containing vinyl sulfone groups on both ends with a silicon-hydroxyl group on the surface of a silicon-based biochip substrate material under catalytic conditions, to prepare the biochip substrate. The application immobilizes biomacromolecules by conducting Michael addition of amino or sulfydryl group in biomacromolecules and the vinyl sulfone group on the surface of the biochip substrate, realizing biological functionalization thereof. The biochip substrate has high-density active vinyl sulfone groups, which can be used for immobilization of various biomolecules with mild fixation conditions and simple operation.
    Type: Application
    Filed: May 18, 2018
    Publication date: January 14, 2021
    Inventors: Fang CHENG, Jicheng DONG, Bingbing SUN, Huanan WANG
  • Publication number: 20210005591
    Abstract: A semiconductor package includes a first optical transceiver, a second optical transceiver, a third optical transceiver, and a plasmonic waveguide. The first optical transceiver, the second optical transceiver, and the third optical transceiver are stacked in sequential order. The first optical transceiver and the third optical transceiver respectively at least one optical input/output portion for transmitting and receiving an optical signal. The plasmonic waveguide includes a first segment, a second segment, and a third segment optically coupled to one another. The first segment is embedded in the first optical transceiver. The second segment extends through the second optical transceiver. The third segment is embedded in the third optical transceiver. The first segment is optically coupled to the at least one optical input/output portion of the first optical transceiver and the third segment is optically coupled to the at least one optical input/output portion of the third optical transceiver.
    Type: Application
    Filed: September 23, 2020
    Publication date: January 7, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Kuang Liao, Cheng-Chun Tsai, Chen-Hua Yu, Fang-Cheng Chen, Wen-Chih Chiou, Ping-Jung Wu
  • Patent number: 10881204
    Abstract: A drawer and its furniture fittings are provided. The furniture fittings include a first wall, a second wall, and a mounting device. The second wall is provided with a first structure, and the mounting device is provided with a second structure. The second structure of the mounting device and the first structure of the second wall are detachably engaged with each other without using tools. The second wall is mounted on the first wall through the mounting device.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: January 5, 2021
    Assignees: King Slide Works Co., Ltd., Kins Slide Technology Co., Ltd.
    Inventors: Ken-Ching Chen, Fang-Cheng Su, Ci-Bin Huang, Yue-Hua Tang, Chun-Chiang Wang
  • Publication number: 20200395007
    Abstract: The present invention is an action agent architecture in a scalable multi-service virtual assistant platform that can construct a fluid and dynamic dialogue by assembling responses to end user utterances from two kinds of agents, information agents and action agents. The virtual assistant platform comprises a plurality of action agents to perform two or more actions in response to parsed user input, contextual data, and/or an information value obtained from an information agent. The plurality of action agents are interrelated via at least one follow-up connection which interrelates any two of the action agents such that a second action agent follows-up with a second action after a first action agent completes a first action based on a trigger condition. The second action agent utilizes at least one information value set by the first action agent or a system state change triggered by the first action agent.
    Type: Application
    Filed: April 20, 2020
    Publication date: December 17, 2020
    Inventors: Fang Cheng, Dennis Wu, Jian Da Chen
  • Patent number: 10864232
    Abstract: The present invention provides modified natural killer T (NKT) cells, pharmaceutical compositions comprising the modified NKT cells and at least one pharmaceutically acceptable carrier or excipient, and uses of the modified NKT cells. Also disclosed herein are methods for enriching NKT cells and generating the modified natural killer T cells.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: December 15, 2020
    Assignee: FULLHOPE BIOMEDICAL CO., LTD.
    Inventors: Jan-Mou Lee, Chih-Hao Fang, Ya-Fang Cheng, Da-Tsen Wei, Kai-Yuan Jhou
  • Patent number: 10867847
    Abstract: A semiconductor device includes a first metal wiring layer, an interlayer insulating layer formed over the first metal layer, a second metal wiring structure embedded in the interlayer dielectric layer and connected to the first metal wiring layer, and an etch-stop layer disposed between the first metal wiring and the first interlayer dielectric layer. The etch-stop layer includes one or more sub-layers. The etch-stop layer includes a first sub-layer made of an aluminum-based insulating material, hafnium oxide, zirconium oxide or titanium oxide.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsin-Yen Huang, Kai-Fang Cheng, Chi-Lin Teng, Shao-Kuan Lee, Hai-Ching Chen
  • Publication number: 20200381586
    Abstract: An LED panel including a substrate, multiple first pixels, multiple second pixels, multiple first protrusion structures and second protrusion structures is provided. The first pixels and second pixels each disposed in a display area of the substrate has at least one light emitting element. The second pixels are positioned on at least one display edge of the display area and positioned between the first pixels and a substrate edge. Each first protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding first pixel. Each second protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding second pixel. The orthogonal projection contour of each first protrusion structure on the substrate is different from that of each second protrusion structure on the substrate. A tiling display apparatus adopting the light emitting diode panel is also provided.
    Type: Application
    Filed: November 18, 2019
    Publication date: December 3, 2020
    Applicant: Au Optronics Corporation
    Inventors: Fang-Cheng Yu, Wen-Wei Yang, Pin-Miao Liu
  • Publication number: 20200380740
    Abstract: Disclosed are a system, method, and computer program product for generating pruned tractograms of neural fiber bundles. The method includes receiving scan data produced by diffusion imaging of at least a portion of a brain from a magnetic-resonance imaging (MRI) device. The method also includes generating an initial tractogram by mapping neuronal fiber pathways of a target fiber bundle of the scan data. The method further includes generating a density map using a set of tracts from the initial tractogram, identifying each tract that passes through a segment of the density map more than once, and setting a contribution of said tract to a unique tract count of the segment equal to a threshold pruning value. The method further includes generating a pruned tractogram by identifying a segment having a unique tract count less than or equal to the threshold pruning value and excluding the segment from the pruned tractogram.
    Type: Application
    Filed: June 3, 2020
    Publication date: December 3, 2020
    Inventors: Fang-Cheng Yeh, Jessica Valentina Barrios Martinez
  • Patent number: 10854593
    Abstract: A method includes the operations below. A first and second layout patterns corresponding to a first and second area are placed. Third layout patterns corresponding to a first continuous fin over the first area and second area, and corresponding to a second fin including separate portions spaced apart by a first recess over the first area are placed. A fourth layout pattern, corresponding to a dummy gate, at the recess portion and between the first layout pattern and the second layout pattern, is placed to generate a layout design of a semiconductor device. A side of the second area facing the first recess is substantially flat, and the semiconductor device is fabricated by a tool based on the layout design. A first length of the first continuous fin is equal to a sum of a second length of the second fin and a third length of the first recess.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: December 1, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-I Huang, Ting-Wei Chiang, Shih-Chi Fu, Sheng-Fang Cheng, Jung-Chan Yang
  • Publication number: 20200359791
    Abstract: A drawer and its furniture fittings are provided. The furniture fittings include a first wall, a second wall, and a mounting device. The second wall is provided with a first structure, and the mounting device is provided with a second structure. The second structure of the mounting device and the first structure of the second wall are detachably engaged with each other without using tools. The second wall is mounted on the first wall through the mounting device.
    Type: Application
    Filed: September 11, 2019
    Publication date: November 19, 2020
    Inventors: Ken-Ching CHEN, Fang-Cheng SU, Ci-Bin HUANG, Yue-Hua TANG, Chun-Chiang WANG
  • Patent number: 10820696
    Abstract: A drawer part assembly includes first and second walls and a mounting fitting. The first wall includes a longitudinal section and a transverse section transversely connected to the longitudinal section. These two sections define a recess. The mounting fitting is attached to the first wall and includes first and second mounting portions, which are perpendicularly connected. The second mounting portion divides the first mounting portion into first and second portions. The second mounting portion is mounted in the recess. The longitudinal section of the first wall is allowed to press against the second portion of the first mounting portion. The second wall has an end portion mounted between the first portion and the second mounting portion of the mounting fitting.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: November 3, 2020
    Assignees: King Slide Works Co., Ltd., King Slide Technology Co., Ltd.
    Inventors: Ken-Ching Chen, Fang-Cheng Su, Shih-Lung Huang, Ci-Bin Huang, Chun-Chiang Wang
  • Patent number: D915808
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: April 13, 2021
    Assignees: King Slide Works Co., Ltd., King Slide Technology Co., Ltd.
    Inventors: Fang-Cheng Su, Ci-Bin Huang, Ching-Fu Chiu, Shu-Chen Lin