Abstract: Among other things, one or more semiconductor arrangements and techniques for forming such semiconductor arrangements are provided. A semiconductor arrangement comprises a first guard ring surrounding at least a portion of a device, and a first poly layer formed over the first guard ring.

Abstract: A method of selection and/or handover for multi radio access technologies in a 5G cellular network. The method includes: 1) collecting, by a user terminal, load information of a candidate Access Point (AP) or an Evolved Node (H)eNB via a local entity of Access Network Discovery and Selection Function (L-ANDSF); 2) checking, by the user terminal, a Received Signal Strength (RSS) value of the candidate AP or (H)eNB, a Reference Signal Received Quality (RSRQ) and a Service Sensitivity to Latency; 3) based on the above information, evaluating suitability of an available radio access technology; 4) triggering, by a specific triggering event, a fuzzy logic controller, to select a most appropriate radio access technology for each session; and 5) establishing a new session to perform admission control or handover.

Abstract: The present disclosure provides a peptide for promoting cell migration and/or skin wound healing, including an IL-6-derived peptide, which is designed within the region of the sequence of SEQ ID NO. 1 and of which the sequence includes the sequence of SEQ ID NO. 2, in which the IL-6-derived peptide has about 6-50 amino acids.

Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.

Abstract: A mounting mechanism adapted for mounting at least one first component to a second component includes a base, a movable member, and a transmission device. The base is mounted on the second component. The movable member is movably mounted on the base and includes a holding portion to which the at least one first component can be mounted. The transmission device is configured to displace the movable member from a first position to a second position in response to the least one first component being mounted to the holding portion of the movable member.

Abstract: A display device having a display region and a peripheral region surrounding the display region is provided. The display device includes a first adhesion layer sandwiched between a display unit and a protective structure. The protective structure includes a first protective layer having a first length in a first direction. The protective structure also includes a second adhesion layer disposed on the first protective layer. The protective structure further includes a second protective layer disposed on the second adhesion layer, and the second protective layer has a second length in the first direction, wherein the difference between the first length and the second length is between 0 and 1 mm, and wherein the second protective layer is on the outermost side of the display device.

Abstract: Among other things, one or more semiconductor arrangements and techniques for forming such semiconductor arrangements are provided. A semiconductor arrangement comprises a first guard ring surrounding at least a portion of a device, and a first poly layer formed over the first guard ring.

Abstract: A display method and a display device are disclosed herein. The display method includes the following steps: analyzing an input image to obtain a plurality of first backlight control signals and a plurality of first liquid crystal control signals; generating image edge information associated with the input image; generating, according to the image edge information, at least one second backlight control signal and at least one target liquid crystal control signal that are associated with the image edge information; and displaying, according to the at least one second backlight control signal and the at least one target liquid crystal control signal, at least one multi-color sub-frame.

Abstract: The present disclosure provides a method that includes providing a substrate having a first dielectric material layer and first conductive features that are laterally separated from each other by segments of the first dielectric material layer; depositing a first etch stop layer on the first dielectric material layer and the first conductive features, thereby forming the first etch stop layer having oxygen-rich portions self-aligned with the segments of the first dielectric material layer and oxygen-poor portions self-aligned with the first conductive features; performing a selective removal process to selectively remove the oxygen-poor portions of the first etch stop layer; forming a second etch stop layer on the first conductive features and the oxygen-rich portions of the first etch stop layer; forming a second dielectric material layer on the second etch stop layer; and forming a conductive structure in the second dielectric material layer.

Abstract: A paint container that includes a bracket that is rotatably fixed to the container and is configured to allow an object (e.g., paint brush) to be releasably fixed thereto. The bracket can include a first bracket member and a second bracket member that extends at an angle from the first bracket member. The bracket is fixed to the container such that the bracket is rotatable to at least partially extending within the interior of the container and to fully extend above the container. At least one magnet can fixed to the bracket to secure the object thereto.

Abstract: A processing apparatus includes a spin coating chamber, an ultraviolet curing chamber, a transfer module and an enclosure. The transfer module is assigned with a plurality transfer destinations, in which two of the transfer destinations are respectively located within the spin coating chamber and the ultraviolet curing chamber. The transfer module, the spin coating chamber and the ultraviolet curing chamber are enclosed by the enclosure.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a first conductive structure over the substrate. The semiconductor device structure includes a first dielectric layer over the substrate and the first conductive structure. The semiconductor device structure includes a second conductive structure over the first conductive structure and extending into the first dielectric layer. The second conductive structure is electrically connected to the first conductive structure. The semiconductor device structure includes a cover layer between the second conductive structure and the first dielectric layer. The cover layer surrounds the second conductive structure, the second conductive structure passes through the cover layer and is partially between the cover layer and the first conductive structure, and the cover layer includes a metal oxide.

Abstract: A processing apparatus includes a spin coating chamber, an ultraviolet curing chamber, a transfer module and an enclosure. The transfer module is assigned with a plurality transfer destinations, in which two of the transfer destinations are respectively located within the spin coating chamber and the ultraviolet curing chamber. The transfer module, the spin coating chamber and the ultraviolet curing chamber are enclosed by the enclosure.

Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.

Abstract: The present disclosure provides a method that includes providing a substrate having a first dielectric material layer and first conductive features that are laterally separated from each other by segments of the first dielectric material layer; depositing a first etch stop layer on the first dielectric material layer and the first conductive features, thereby forming the first etch stop layer having oxygen-rich portions self-aligned with the segments of the first dielectric material layer and oxygen-poor portions self-aligned with the first conductive features; performing a selective removal process to selectively remove the oxygen-poor portions of the first etch stop layer; forming a second etch stop layer on the first conductive features and the oxygen-rich portions of the first etch stop layer; forming a second dielectric material layer on the second etch stop layer; and forming a conductive structure in the second dielectric material layer.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a first conductive structure over the substrate. The semiconductor device structure includes a first dielectric layer over the substrate. The first dielectric layer has a first opening exposing the first conductive structure. The semiconductor device structure includes a cover layer covering a first inner wall of the first opening. The cover layer has a second opening exposing the first conductive structure. The cover layer includes a metal oxide. The semiconductor device structure includes a second conductive structure filled in the first opening and surrounded by the cover layer. The second conductive structure is electrically connected to the first conductive structure.

Abstract: A drawer slide rail includes a longitudinal body and a base. The longitudinal body includes a pair of first sidewalls extending respectively from two sides of a front end portion of the longitudinal body and a pair of second sidewalls respectively connected to the first sidewalls and extending respectively from two sides of the longitudinal body. The base is mounted on the front end portion of the longitudinal body and includes first to third supporting arms. The first supporting arm is pressed against a bottom portion of one of the first sidewalls. The second supporting arm is pressed against a bottom portion of one of the second sidewalls. The third supporting arm is pressed against a lateral portion of one of the second sidewalls.

Abstract: A compound of Formula 1 wherein, X represents an alkyl, alkylene, alkenyl, alkenylene, alkynyl or alkynylene group, optionally having at least one substituent selected from the group of —OR1 and —NR1R2, or Y represents —OTBS, —OR1, —NR1R2; Z represents —OR3 or ?O; and R1, R2 and R3 each independently stand for H, alkyl, alkenyl, alkynyl, aryl, heteroaryl, or heterocyclyl, optionally in the form of enantiomers racemic mixtures, or pharmaceutically acceptable salts thereof, for use as a medicament, in particular for use in anti-viral cancer treatment in mammals and for use in treatment of benign or neoplastic genital Human Papilloma Virus associated diseases and for use in treatment of non-genital warts.

Abstract: A display device includes a first substrate, a second substrate, a first liquid crystal display medium, and a first electric field applying component. The first electric field applying component is configured to apply a first electric field to a first portion of the first liquid crystal display medium and apply a second electric field to a second portion of the first liquid crystal display medium. The intensity of the first electrical field is operatively different from that of the second electrical field.