Abstract: A resource allocation method comprises using resources with a used resource quantity of a machine learning system to execute a first experiment which has a first minimum resource demand, receiving an experiment request associated with a target dataset, deciding a second experiment according to the target dataset, deciding a second minimum resource demand of the second experiment, allocating resources with a quantity equal to the second minimum resource demand for an execution of the second experiment when a total resource quantity of the machine learning system meets a sum of the first minimum resource demand and the second minimum resource demand and a difference between the total resource quantity and the used resource quantity meets the second minimum resource demand, determining that the machine learning system has an idle resource, and selectively allocating said the idle resource for at least one of the first experiment and the second experiment.

Abstract: The present disclosure provides a semiconductor structure and a method for forming a semiconductor structure. The semiconductor structure includes a substrate, and a dielectric stack over the substrate. The dielectric stack includes a first layer over the substrate and a second layer over the first layer. The semiconductor structure further includes a gate layer including a first portion traversing the second layer and a second portion extending between the first layer and the second layer.

Abstract: A combination of probiotics for improving body compositions includes Lacticaseibacillus paracasei S38 and Bacillus coagulans BC198. The combination of probiotics can be a medicine composition, a nutrient supplement, healthy food or a combination thereof. The applications of the combination of probiotics include weight loss, reduction of fat, abatement of appetite, production of butyric acid within intestinal tracts and anf increased count of Akkermansia muciniphila or Ruminococcaceae inside intestines.

Abstract: A method of generating an accurate speaker representation for an audio sample includes receiving a first audio sample from a first speaker and a second audio sample from a second speaker. The method includes dividing a respective audio sample into a plurality of audio slices. The method also includes, based on the plurality of slices, generating a set of candidate acoustic embeddings where each candidate acoustic embedding includes a vector representation of acoustic features. The method further includes removing a subset of the candidate acoustic embeddings from the set of candidate acoustic embeddings. The method additionally includes generating an aggregate acoustic embedding from the remaining candidate acoustic embeddings in the set of candidate acoustic embeddings after removing the subset of the candidate acoustic embeddings.

Abstract: A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.

Abstract: A method of generating an accurate speaker representation for an audio sample includes receiving a first audio sample from a first speaker and a second audio sample from a second speaker. The method includes dividing a respective audio sample into a plurality of audio slices. The method also includes, based on the plurality of slices, generating a set of candidate acoustic embeddings where each candidate acoustic embedding includes a vector representation of acoustic features. The method further includes removing a subset of the candidate acoustic embeddings from the set of candidate acoustic embeddings. The method additionally includes generating an aggregate acoustic embedding from the remaining candidate acoustic embeddings in the set of candidate acoustic embeddings after removing the subset of the candidate acoustic embeddings.

Abstract: A method of generating an accurate speaker representation for an audio sample includes receiving a first audio sample from a first speaker and a second audio sample from a second speaker. The method includes dividing a respective audio sample into a plurality of audio slices. The method also includes, based on the plurality of slices, generating a set of candidate acoustic embeddings where each candidate acoustic embedding includes a vector representation of acoustic features. The method further includes removing a subset of the candidate acoustic embeddings from the set of candidate acoustic embeddings. The method additionally includes generating an aggregate acoustic embedding from the remaining candidate acoustic embeddings in the set of candidate acoustic embeddings after removing the subset of the candidate acoustic embeddings.

Abstract: A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.

Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.

Abstract: Provided is a scalable frame for fixing a zirconium oxidized disk used in producing a denture, wherein a material is used to mold a circular ring which defines a diameter and which includes a major circular section, a minor circular section and a resilient structure integrally formed the minor circular section. The minor circular section has a cross-section different from a cross section of the major circular section such that the circular ring is extendable and retractable along the diameter by virtue of the resilient structure so that the circular ring can be sleeved around the zirconium oxidized disk to facilitate fixing the zirconium oxidized disk in a denture carving machine for undergoing tooth carving process.

Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.

Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.

Abstract: A fast acting orally disintegrating film (ODF) for administration of local anesthetic for alleviating physical and psychological discomfort in the oral cavity during procedures such as dental procedures or for relieving pain generally such as toothaches. The ODF comprises an active pharmaceutical ingredient such as lidocaine free base or a pharmaceutically acceptable salt thereof in a therapeutically acceptable amount such as about 24 mg, at least one primary hydrophilic film forming polymer, at least one secondary hydrophilic film forming polymer, wherein the ratio of the primary hydrophilic film forming polymer to the secondary hydrophilic film forming polymer is about 1:1 to about 20:1 by weight. The ODF further comprises a plasticizer wherein the ratio of the total weight of primary and secondary hydrophilic film forming polymer to the weight of the plasticizer is about 4:1 to about 4:3.

Abstract: A method and device for coding interlaced video data. The method includes coding interlaced video data captured from a plurality of different positions, the interlaced video data including data for a top field and a bottom field for at least one interlaced video scan, the top field including every other line starting with a top line of a frame and the bottom field including interposed lines in the frame.

Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.

Abstract: A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.

Abstract: This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.

Abstract: A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.

Abstract: A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.

Abstract: This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.