Abstract: A socket, for electrically connecting an IC package and a printed circuit board, comprises an insulative housing and a plurality of contacts received in the insulative housing. The insulative housing has an opening in a center thereof, a solder pad is received in the opening and has a soldering board which is soldered to the printed circuit board to enhance a mechanical connection between the socket and the printed circuit board.

Abstract: The present invention discloses a method for preparing an aromatic boron reagent through Barbier-type reaction, comprising reacting an aromatic halogen compound with a boron compound in the presence of a metal to obtain an aromatic boron reagent, wherein the metal may be or may not be activated by an activator. The method according to the present invention can avoid using expensive and complicated procedures of prior art and hence is efficient and economic.

Abstract: The present invention discloses a method for preparing an aromatic boron reagent through Barbier-type reaction, comprising reacting an aromatic halogen compound with a boron compound in the presence of a metal to obtain an aromatic boron reagent, wherein the metal may be or may not be activated by an activator. The method according to the present invention can avoid using expensive and complicated procedures of prior art and hence is efficient and economic.

Abstract: A land grid array (LGA) connector, for electrically connecting an IC (Integrated Circuit) package to a printed circuit board, comprises a retaining frame, a plurality of sections mounted on the retaining frame and a plurality of contacts received in the sections. Each contact having a contacting portion extending beyond the top surface of the section to contact with the IC package, and the contacting portions of the contacts received in a same section have two opposed extending direction to evenly and elastically support the IC package when the IC package is pressed toward the contacts.

Abstract: A system for receiving a digital broadcast includes an input terminal that receives the digital broadcast containing scalable data, and a controller for controlling an operation mode of the system. In addition, the system may also include a processor that decodes the data, and a power management device that varies the amount of data to be decoded according to the operation mode.

Abstract: A socket connector (1) is provided with a pair of clips (13) on perimeter sidewalls (12) for providing sustain retention force to a packaged processor (2) independent from retention force applied to the heat sink so that forces applied to the heat sink are counteracted to reduce the risk of inadvertent processor removal or damage. While pressing portions (133) of the clips (13) are exerted a substantially downward vertical force by a user, the clips (13) are opened for receiving the packaged processor (2). After the user stop pressing the pressing portions (133), the resilient force of the clips (31) push the latching portions (131) fixing on the side edge of the packaged processor (2) for performing the aforementioned purpose.

Abstract: An electrical contact (10) using for electrically connecting a chip module to a printed circuit board includes a base portion (101), an arm portion (102) extending from side of the base portion (101), a retaining device (104) extending downwardly from the base portion (101) for retaining a soldering ball (20). The retaining device further comprises a plurality of clipping portions, said clipping portions forming a retaining space (1044) for receiving the soldering ball jointly, and at least one of said clipping portions defining a guiding surface (1046) and a recess (1045). By above way, steady attachment between the soldering ball and the contact is achieved.

Abstract: An electrical connector (100) for electrically connecting with a chip module and a printed circuit board comprises a plurality of insulative housings (1), a plurality of contacts received in the insulative housing, and a frame (2) defining an accommodating space (26) to accommodate the insulative housings. The frame defines continuous lateral walls (23) and a plurality of enhancing ribs (24) extending from the lateral walls into the accommodating space. A plurality of first rivet sections (231) are disposed on at least one of the lateral walls of the frame and the insulative housings and a plurality of first mounting holes (16) are defined in at least one of the insulative housings and the lateral walls of the frame to receive the first rivet sections.

Abstract: An electrical connector comprises an insulative housing (1) comprising a bottom wall (11) and a locking member (131) extending downwardly from the bottom wall (11), a plurality of contacts (4) received in the insulative housing (1) and a fastening device (3) locked with the insulative housing (1) for fastening the electronic package (2) on the insulative housing (1). Thus even if exert an upwardly force on the electronic package (2), the electronic package (2) can also securely located on the insulative housing (1).

Abstract: An electrical connector assembly comprises an insulative housing having a base, with a mating interface, and a mounting interface corresponding to the mating face. The base has peripheral walls extending upwardly from the mating face. A plurality of contacts arranged in the base of the insulative housing. At least a pair of cantilevered push fingers formed on two adjacent walls for pushing the integrated circuit module toward opposing walls. At least a support device formed on the bottom of the push finger.

Abstract: An IC socket connector comprises a base and perimeter walls with corresponding inner sidewalls and outer sidewalls to form an inner cavity therebetween for receiving an IC package. An inner sidewall of the perimeter walls has a push arm at least which has an interfacing part between an inclined lead-in surface and a flat surface at the terminal end of the push arm. The distance from the interfacing part to the contact area is larger than the one from the corresponding inner sidewall to the contact area.

Abstract: A socket connector is provided for securely mounting an electronic device (1000) on a printed circuit board, said socket connector comprises an insulatve base (60) and heightened perimeter walls (606) upward extending therefrom to define an inner cavity. The top surface (602) of the inner cavity comprises a plural of passageways (608) in which a plural of contacts (70) hold. Furthermore, there are a plural of standoffs (610) between the adjacent passageways (608) co-worked with the heightened perimeter walls (606) for effectively preventing a cover (90) from deformation.

Abstract: A socket (100) adapted for electrically connecting a semiconductor package (200) and a PCB (300), comprises an insulating body (10) and a plurality of terminals (20) each having an elastic arm. The insulating body has a mating face (101), a mounting face (102) opposite to the mating face and a plurality of passageways (103) passing through the mating face and the mounting face. The insulating body is formed with a first and a second areas (1011, 1012) separated by a beeline (L1), the passageways are distributed on both of the areas. The terminals are received in the passageways, and extending directions of the terminals in a same area are uniform but opposite with that of the terminals in the other area. And the extending directions of all the terminals are parallel to the beeline.

Abstract: An electrical connector assembly (1) includes an electrical connector (5) and a pick up cap (2) fixed on the electrical connector (5). The electrical connector (5) comprises an insulative housing (3) and a plurality of contacts (4) received therein. The insulative housing (3) comprises a bottom wall (31) and sidewalls (32) extending upwardly from the bottom wall (31). The sidewall (32) includes a spring arm (33) extending along the sidewall (32) and the spring arm (33) is provided with a locking portion (331). The pick up cap (2) comprises a body portion (21) and a retention portion (22) extending downwardly from the body portion (21). The retention portion (22) is interlocked with the locking portion (331) for securely positioning the pick up cap (2) on the electrical connector (5).

Abstract: A manufacturing method for a semiconductor-device isolation structure comprises providing a substrate with at least one shallow trench isolation structure, performing a salicide process that forms a recess on the surface of the shallow trench isolation structure, forming a cap film covering the substrate and filling the recess, performing an etching process to remove the cap film outside the recess, and forming a contact etch stop layer covering the substrate and filling the recess. Due to the filling recess with the cap film first, the contact etch stop layer covering the substrate and filling the recess does not have seams or voids.

Abstract: A socket (100) adapted for electrically connecting a semiconductor package (200) and a PCB (300), comprises an insulating body (10) and a plurality of terminals (20) each having an elastic arm. The insulating body has a mating face (101), a mounting face (102) opposite to the mating face and a plurality of passageways (103) passing through the mating face and the mounting face. The insulating body is formed with a first and a second areas (1011, 1012) separated by a beeline (L1), the passageways are distributed on both of the areas. The terminals are received in the passageways, and extending directions of the terminals in a same area are uniform but opposite with that of the terminals in the other area. And the extending directions of all the terminals are parallel to the beeline.

Abstract: One embodiment of the present invention provides a method coding audio signals in a base layer and an enhancement layer comprising the steps of quantizing the audio signals in spectral lines into quantized data in a plurality of sub-bands in an order of most significant bits (MSBs) to least significant bits (LSBs), determining a plurality of scale factors corresponding to each of the sub-bands according to respective noise tolerance of each of the sub-bands, bit shifting the quantized data in the sub-bands by the respective scale factor if they exceed a threshold value, coding the quantized data in the base layer, coding the quantized data in the enhancement layer, truncating the quantized data in the enhancement layer up to respective layer size limits, de-shifting the coded data wit the respective scale factors, de-quantizing the coded data, and decoding the coded data.

Abstract: A socket connector is provided for securely mounting an IC package (20) on a printed circuit board, said socket connector comprises an insulative housing (30) configured by a base (301) and four perimeter walls (302) to define a inner cavity adapted for receiving said IC package (20). Said four perimeter walls (302) include a first sidewall (3021) with a push finger (3025), a second sidewall (3022), a third sidewall (3023) and a fourth sidewall (3024). Said second sidewall (3022) and said fourth sidewall (3024) further include a plurality of retaining tab (3027) adapted for biasing guiding notches (2011) of said IC package (20) relative to said retaining tab (3027) by a elastic force generated from a push finger (3025) after said IC package (20) is fully mounted in said insulative housing (30) of said socket connector.

Abstract: A contact, adapted for electrically connecting IC package and a printed circuit board, comprises a base, an upper spring arm and a lower spring arm. The upper spring arm is formed with an upper waist portion extending from a top edge of the base and a top end for electrically contacting with the IC package; and the lower spring arm is formed with a lower waist portion extending from a bottom edge of the base and a bottom end for electrically contacting with the printed circuit board. The bottom end has a width larger than that of the top end, and the lower waist portion has a width larger than that of the upper waist and defines a slot in a middle thereof.

Abstract: An electronic assembly includes: a circuit substrate with a first mounting surface that has a plurality of spaced apart first mounting regions and at least one second mounting region spaced apart from the first mounting regions; a plurality of first electronic components mounted on the first mounting regions, respectively; and at least one dummy of a non-electronic component mounted on the second mounting region and having dimensions simulating those of the first electronic components. A method for making electronic devices is also disclosed.