Patents by Inventor Fang Lin

Fang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12254643
    Abstract: A method for registering a two-dimensional image data set with a three-dimensional image data set of a body of interest is discloses herein. The method includes the following steps: defining a first vector of a registered virtual camera in a coordinate system of the three-dimensional image data et; obtaining a first transformed vector of an unregistered virtual camera in the coordinate system of the three-dimensional image data set by transforming the first vector of the registered virtual camera through at least one transforming matrix; defining a focal point of the unregistered virtual camera at a reference point of the two-dimensional image data set in the coordinate system of the three-dimensional image data set; and repositioning the unregistered virtual camera according to the first transformed vector and the focal point of the unregistered virtual camera.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: March 18, 2025
    Assignee: REMEX MEDICAL CORP.
    Inventors: Sheng-Fang Lin, Ying-Yi Cheng, Chen-Tai Lin, Shan-Chien Cheng
  • Patent number: 12233451
    Abstract: A rotary cable arranging tool is disclosed. The rotary cable arranging tool is used for untwisting a first and a second cable. The rotary cable arranging tool includes a first annular structure, a first and a second assembly member, and a first and a second hole. The first and the second holes are assembled by the cooperation of the first and the second assemblies so as to be pressed to change a width of an inner diameter. When the first and second cables are in a twisted state, the first and second assemblies are counter-rotated together, so that the first and the second cables are untwisted and enter the first and second holes respectively. Then the first and second holes are tightly combined with the first and second cables, and the first and the second cable are pulled out to be straightened.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: February 25, 2025
    Assignee: Hanlong Industrial Co., Ltd.
    Inventors: Chien-Chou Liao, Mei-Fang Lin
  • Publication number: 20250043420
    Abstract: The thin film deposition system includes: a deposition chamber, a precursor source container containing a precursor source; and a precursor conduit. The precursor conduit is elongated and extends between a proximate end and a distal end, and the proximate end is coupled to an outlet of the precursor source container, and the distal end is coupled to an inlet of the deposition chamber.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 6, 2025
    Inventors: Chung Hsien Liao, Jui-Mu Cho, Chien-Fang Lin
  • Publication number: 20250046633
    Abstract: A semiconductor processing system is provided. The semiconductor processing system includes a first chamber arranged to perform a first semiconductor process; a second chamber arranged to perform a second semiconductor process; a cooling chamber having a pedestal; and a plurality of non-contact temperature sensors mounted in the cooling chamber, and arranged to measure a temperature of a wafer disposed on the pedestal. In one aspect, the first chamber is arranged to transfer the wafer to the cooling chamber upon completion of the first semiconductor process in the first chamber. In another aspect, the cooling chamber is arranged to measure the temperature of the wafer in the cooling chamber and arranged to transfer the wafer to the second chamber when the temperature of wafer is at a target temperature, or pause processing of the wafer when the temperature of the wafer is not at the target temperature.
    Type: Application
    Filed: August 1, 2023
    Publication date: February 6, 2025
    Inventors: Chung Hsien Liao, Po Wen Yang, Jui-Mu Cho, Chien-Fang Lin
  • Publication number: 20250047311
    Abstract: In some examples, the disclosure describes an electronic device with a processing resource and a memory resource storing computer-readable instructions executable by the processing resource to determine a wireless metric associated with a first wireless signal path utilizing concurrent dual wireless bands between an access point and the electronic device and alter the first wireless signal path to a second wireless signal path that utilizes a single band between the access point and the electronic device.
    Type: Application
    Filed: December 17, 2021
    Publication date: February 6, 2025
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Cheng-Fang Lin, Huai-Yung Yen, Ruei-Ting Lin, Ren-Hao Chen, Lo-Chun Tung, Yao-Cheng Yang
  • Publication number: 20250038744
    Abstract: A device including a first circuit, a second circuit, and a third circuit. The first circuit to receive a first signal and a second signal, and the first circuit to provide a third signal. The second circuit to receive a fourth signal and a fifth signal, and the second circuit to provide a sixth signal. The third circuit to receive the third signal and the sixth signal, and the third circuit to provide a seventh signal to indicate whether to track a difference between an amount of voltage provide to a driver and an amount of voltage provided by the driver or track a difference between an amount of voltage provided by a source and the amount of voltage provided to the driver.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 30, 2025
    Applicant: Avago Technologies International Sales Pte. Limited
    Inventors: Feng Su, Yue HU, Tom W. Kwan, Guo Wen Wei, Fang Lin, Iuri Mehr
  • Publication number: 20250038710
    Abstract: A device including a first circuit, a second circuit. The first circuit to receive a first signal, a second signal, and a third signal, and the first circuit to provide a fourth signal and a fifth signal. The second circuit to receive the fourth signal and the fifth signal, and the second circuit to control a first set of components to maintain a difference between a first amount of power provided to a first terminal of a driver and a second amount of power provided to a second terminal of the driver or to control a second set of components to maintain the difference between the first amount of power provided to the first terminal of the driver and the second amount of power provided to the second terminal of the driver.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 30, 2025
    Applicant: Avago Technologies International Sales Pte. Limited
    Inventors: Feng Su, Tom W. Kwan, Iuri Mehr, Fang Lin, Guo Wen Wei, Kevin Yuhang Li, Yue HU
  • Patent number: 12180359
    Abstract: A electrically conductive hydrogel composition includes: a polar polymer selected from the group consisting of polyvinyl alcohol, polyacrylic acid, polyethylene oxide, poly(2-acrylamido-2-methyl-1-propane sulfonic acid), and combinations thereof; a gelatin; a binding agent including tannic acid and dopamine; a hygroscopic agent including ethylene glycol; a strong electrolyte; and water. A self-healing electrically conductive hydrogel prepared from the electrically conductive hydrogel composition is also provided. A hydrogel-based triboelectric nanogenerator including a self-healing electrically conductive hydrogel film that is made from the self-healing electrically conductive hydrogel is also provided.
    Type: Grant
    Filed: October 2, 2023
    Date of Patent: December 31, 2024
    Assignee: Ming Chi University of Technology
    Inventors: Meng-Fang Lin, Feng-Xiang Yeh, Jun-Jie Zhang, Priyanka Chaudhary
  • Publication number: 20240413666
    Abstract: An example computing device includes a wireless communication device, such as a wireless wide area network (WWAN) communication device, that communicates in a first band of electromagnetic radiation, and a wireless charging system that wirelessly charges a peripheral device using a second band of electromagnetic radiation. The wireless charging system operating in the first band may introduce harmonic noise that negatively impacts communication in the second band. Accordingly, in various examples, the system operates to adjust the charge rate used by the wireless charging system based on a function of the charge state of the peripheral device and a received signal strength indicator (RSSI) value of a signal received by the wireless communication device. In some instances, the wireless charging rate of the peripheral device may be disabled or reduced when the RSSI value of the signal received by the wireless communication device is below a threshold value.
    Type: Application
    Filed: November 30, 2021
    Publication date: December 12, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: HUAI-YUNG YEN, RUEI-TING LIN, CHENG-FANG LIN, REN-HAO CHEN, LO-CHUN TUNG
  • Patent number: 12119887
    Abstract: The present disclosure provides intelligent radio frequency interference mitigation in a computing platform. The computing platform includes a processor, a memory, a system clock and a wireless network interface. The system clock can be controlled so that the processor and/or the memory may operate at a slow frequency or a fast frequency. The wireless network may operate on a radio channel that experiences radio frequency interference at the fast frequency. The system clock may be intelligently controlled to select the slow frequency to reduce radio frequency interference to prioritize execution of a network application, or to select the fast frequency to increase processor speed and prioritize execution of a local application.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: October 15, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ruei-Ting Lin, Cheng-Fang Lin, Huai-yung Yen, Ren-Hao Chen, Lo-Chun Tung
  • Patent number: 12115518
    Abstract: The present invention relates to the technical field of catalyst preparation, disclosing a preparation method and application of a coated vanadium-tungsten-titanium oxide monolithic SCR catalyst. The method includes the steps of mixing a vanadium oxide precursor, a tungsten oxide precursor, titanium dioxide, an inorganic adhesive, an organic adhesive and a macromolecular surfactant with deionized water and stirring them to obtain a thick liquid; adding a pH adjuster to the thick liquid to make its pH 1.5-4.5; impregnating a cordierite honeycomb carrier in the thick liquid to obtain a preliminarily-impregnated catalyst and dried and calcined the preliminarily-impregnated catalyst to obtain a finished catalyst. The method has advantages such as simple operation, easy repetition and short time-consuming, so it can be applied to exhaust gas post-treatment of a marine diesel engine, and provide a good choice for catalysts used to denitrify medium and high temperature exhausted gas from marine engines.
    Type: Grant
    Filed: December 14, 2023
    Date of Patent: October 15, 2024
    Assignee: TIANJIN RESEARCH INSTITUTE FOR WATER TRANSPORT ENGINEERING, M.O.T.
    Inventors: Mingyu Guo, Yidan Huang, Boqun Liu, Shaoping Cui, Shipei Dong, Siqi Chen, Bin Liu, Yingjie Zhao, Fang Lin, Zhonghua Tian, Junjie Zhao, Wei Ye, Yanjie Wei, Zhipeng Zhang
  • Patent number: 12106497
    Abstract: A method for registering a two-dimensional image data set with a three-dimensional image data set of a body of interest is discloses herein. The method includes the following steps: adjusting a first virtual camera according to a distance parameter calculated corresponding to the two-dimensional image data set and the body of interest; rotating the first virtual camera according to an angle difference between a first vector and a second vector; and rotating the first virtual camera according to an angle which is corresponding to a maximum similarity value of a plurality of similarity values calculated in accordance with reconstructed images of the three-dimensional image data set which includes one generated by the first virtual camera and the others generated by other virtual cameras with different angles or different pixels from the one generated by the first virtual camera and the two-dimensional image data set.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: October 1, 2024
    Assignee: REMEX MEDICAL CORP.
    Inventors: Sheng-Fang Lin, Ying-Yi Cheng, Chen-Tai Lin, Shan-Chien Cheng
  • Publication number: 20240310419
    Abstract: A circuit includes a driver to provide a voltage at a node of a load and a first circuit to facilitate determining a load current at the node. The load is a capacitive load and the first circuit facilitates determining the load current by measuring a replica current and determining a capacitance of the load using values of the voltage and the replica current.
    Type: Application
    Filed: March 15, 2023
    Publication date: September 19, 2024
    Inventors: Tom W. KWAN, Yue HU, Feng SU, Guowen WEI, Fang LIN, Iuri MEHR
  • Publication number: 20240312889
    Abstract: An electronic package and a circuit structure thereof are provided, in which a circuit layer and an electrical function part are formed on a dielectric layer of the circuit structure, and the dielectric layer has at least one corner at a right angle, where a shape of the electrical function part at the corner and corresponding to the right angle is of a non-right angle shape and/or a routing path of the circuit layer at the corner and corresponding to the right angle is of a non-right angle shape, so that stress concentration can be reduced, thereby preventing the electronic package from warping.
    Type: Application
    Filed: June 30, 2023
    Publication date: September 19, 2024
    Inventors: Fang-Lin TSAI, Wei-Son TSAI, Kun-Yuan LUO, Pei-Geng WENG, Ching-Hung TSENG
  • Publication number: 20240295128
    Abstract: A composite tile structure for the rapid laying of multiple tiles on the floor or walls, and includes a surface layer, a substrate layer connected to a bottom of the surface layer, a connecting portion formed to one of two sides of the substrate layer, and an overlapping portion formed to another one of the two sides of the substrate layer. The overlapping portion corresponds in shape to the connecting portion. Multiple of the composite tiles can be assembled with each other by engaging the connecting portion of one tile with the overlapping portion of another composite tile.
    Type: Application
    Filed: May 13, 2024
    Publication date: September 5, 2024
    Inventors: CHENG YEN CHEN, YEN FANG LIN, CHIA HSIN CHEN, CHIA TE CHEN, CHUN PAO CHEN
  • Publication number: 20240282655
    Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element is pasted on a routing layer that is configured with a plurality of conductive pillars, then the electronic element, the conductive pillars and the routing layer are covered with a cladding layer, and a circuit structure electrically connected to the electronic element and the conductive pillars is formed on the cladding layer. Therefore, the conductive pillars can be directly formed on the routing layer and the dielectric layer is omitted, so there is no need to consider the thickness of the dielectric layer, so as to facilitate the thinning of the electronic package.
    Type: Application
    Filed: June 1, 2023
    Publication date: August 22, 2024
    Inventors: Fang-Lin TSAI, Wei-Son TSAI, Kun-Yuan LUO, Pei-Geng WENG, Sheng-Hua YANG
  • Patent number: D1062296
    Type: Grant
    Filed: May 1, 2023
    Date of Patent: February 18, 2025
    Assignee: Crestron Electronics, Inc.
    Inventor: Fang Lin
  • Patent number: D1062297
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: February 18, 2025
    Assignee: Crestron Electronics, Inc.
    Inventor: Fang Lin
  • Patent number: D1073362
    Type: Grant
    Filed: September 8, 2023
    Date of Patent: May 6, 2025
    Assignee: Crestron Electronics, Inc.
    Inventor: Fang Lin
  • Patent number: D1073451
    Type: Grant
    Filed: June 26, 2023
    Date of Patent: May 6, 2025
    Assignee: Crestron Electronics, Inc.
    Inventors: Fang Lin, Hanna Bondarik Mosolygo