Abstract: An apparatus and a method for in-situ testing impact strength of a micro-structure are provided. In one embodiment, the apparatus includes: a flexible beam, one end of which being fixed; an impact mass block disposed at the other end of the flexible beam and being for exerting an impact on the micro-structure; and a locking member including a beam arm and a plurality of locking teeth. The beam arm is perpendicular to the flexible beam and one end of the beam arm is fixed, and the plurality of locking teeth are distributed at intervals along the beam arm, such that the other end of the flexible beam is engaged to one of the plurality of locking teeth when the flexible beam is loaded.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for identifying broken network connections. In one aspect, a system includes front-end server(s) that receive data specifying, for multiple different user interactions with one or more application links that link to a given application, presentation durations specifying how long application content linked to by the application link was presented following the multiple different user interactions with the application link(s). Back-end server(s) that communicate with the front end server(s) can classify each application link as broken or working based on application of a machine learning model to the presentation durations for the application link. The machine learning model can be generated using labeled training data. The back-end server(s) can generate and output an alert identifying an application link as a broken link based on the application link being classified as broken by the machine learning model.

Abstract: Systems and methods for integrating demand response with service restoration in an electric distribution system. The electric distribution system may include a plurality of regions, zones, and/or areas including at least an outage area that includes a fault and is not receiving electric current from the electric distribution system and a restoration area that is receiving electric current from the electric distribution system and that may be selectively configured to provide electric current to a selected portion of the outage area. The electric distribution system also includes a plurality of demand responsive loads configured to be selectively isolated from the electric distribution system responsive to a load shed signal. The demand responsive loads may be selectively utilized during service restoration, such as to provide additional excess capacity within the restoration area and/or decrease a magnitude of the electric load applied by the selected portion of the outage area.

Abstract: A micro-grid system blending utility power with power from multiple renewable sources including energy storage devices provides power factor correction using the renewable sources and energy storage devices by adjustment of associated converters. A controller maximizes power factor correction by utility source subject to a cost weighting of penalties for exceeding a power factor threshold.

Abstract: CMOS sensors and methods of forming the same are disclosed. The CMOS sensor includes a semiconductor substrate, a dielectric layer, an interconnect, a bonding pad and a dummy pattern. The semiconductor substrate has a pixel region and a circuit region. The dielectric layer is surrounded by the semiconductor substrate in the circuit region. The interconnect is disposed over the dielectric layer in the circuit region. The bonding pad is disposed in the dielectric layer and electrically connects the interconnect in the circuit region. The dummy pattern is disposed in the dielectric layer and surrounds the bonding pad in the circuit region.

Abstract: CMOS sensors and methods of forming the same are disclosed. The CMOS sensor includes a semiconductor substrate, a dielectric layer, an interconnect, a bonding pad and a dummy pattern. The semiconductor substrate has a pixel region and a circuit region. The dielectric layer is surrounded by the semiconductor substrate in the circuit region. The interconnect is disposed over the dielectric layer in the circuit region. The bonding pad is disposed in the dielectric layer and electrically connects the interconnect in the circuit region. The dummy pattern is disposed in the dielectric layer and surrounds the bonding pad in the circuit region.

Abstract: The present invention relates to a method for synthesizing tetrahydroisoquinoline thiazolidine, which can be conducted under a relatively mild reaction condition and can rapidly synthesize tetrahydroisoquinoline thiazolidine.

Abstract: A semiconductor device having a protection layer wrapping around a conductive structure is provided. The semiconductor device comprises an image sensor device layer, an interconnect layer over the image sensor device layer, a first bonding layer over the interconnect layer, a second bonding layer bonded with the first bonding layer, a substrate over the second bonding layer, and a conductive via passing through the substrate, the second bonding layer, and the first bonding layer. The conductive via comprises a protection layer and a conductive material. The protection layer is peripherally enclosed by the substrate, the second bonding layer, and the first bonding layer. The protection layer covers a sidewall cut formed at an interface of the second bonding layer and the first bonding layer. The conductive material is peripherally enclosed by the protection layer.

Abstract: A semiconductor device having a protection layer wrapping around a conductive structure is provided. The semiconductor device comprises an image sensor device layer, an interconnect layer over the image sensor device layer, a first bonding layer over the interconnect layer, a second bonding layer bonded with the first bonding layer, a substrate over the second bonding layer, and a conductive via passing through the substrate, the second bonding layer, and the first bonding layer. The conductive via comprises a protection layer and a conductive material. The protection layer is peripherally enclosed by the substrate, the second bonding layer, and the first bonding layer. The protection layer covers a sidewall cut formed at an interface of the second bonding layer and the first bonding layer. The conductive material is peripherally enclosed by the protection layer.

Abstract: A virtual service is instantiated from a service model that is operable to receive requests intended for a particular one of a plurality of software components in a system and generate simulated responses of the particular software component based on a service model modeling responses of the particular software component. A particular request is identified that has been redirected to the virtual service. A size of a data set for inclusion in a simulated response of the virtual service to the particular request is determined based on a size value in the particular request. The data set is generated using the virtual service according to the size value and the simulated response that includes the data set is sent to the other software component in response to the particular request.

Abstract: A semiconductor device includes a substrate, a conductive layer, a transparent layer, a transparent hard mask layer, a carrier, and a device layer. The substrate has a first surface and a second surface opposite to each other. The conductive layer is disposed on the first surface of the substrate. The transparent layer is disposed on the conductive layer. The transparent hard mask layer is disposed on the transparent layer, in which the substrate has an etch selectivity with respect to the transparent hard mask layer. The device layer is disposed between the carrier and the second surface of the substrate, in which various portions of the device layer are respectively exposed by various through holes which pass through the transparent hard mask layer, the transparent layer, the conductive layer, and the substrate.

Abstract: The invention relates to a method for synthesizing tetrahydroisoquinoline oxazolidine. The method is carried out at a room temperature between 20° C. and 35° C.

Abstract: Methods and network devices are disclosed for multicast traffic steering in a communications network. In one embodiment, a method includes generating a first tree connecting a source node for a multicast flow through a communications network to each of multiple destination nodes for the multicast flow. The communications network is configured to forward a multicast message based on bit values in a message bit array carried by the message, and the first tree comprises a first set of unicast paths from the source node to the destination nodes. The method further includes allocating a first tree identifier to the first tree and communicating the first tree identifier and associated forwarding information to each of multiple forwarding nodes within the communications network. An embodiment of a network device includes a processor operably coupled to one or more network interfaces and adapted to perform steps of the method.

Abstract: Methods and network devices are disclosed for internet protocol (IP) based encapsulation in bit indexed explicit replication (BIER) forwarding. In one embodiment, a method includes receiving a multicast message comprising an inner IP header, an intervening header, and an outer IP header. The embodiment further includes accessing a message bit array stored in the intervening header, retrieving an IP address from an entry in a bit indexed forwarding table, replacing an IP destination address in the outer IP header of a copy of the multicast message with the retrieved IP address, and sending the copy of the multicast message toward a second node in the network, where the retrieved IP address is assigned to the second node. An embodiment of a network device includes a processor operably coupled to a plurality of storage locations and to one or more network interfaces and adapted to perform steps of the method.

Abstract: Disclosed is an apparatus for in-situ testing impact strength of a micro-structure, comprising: a flexible beam, one end of which being fixed; an impact mass block disposed at the other end of the flexible beam and configured to exert an impact on the micro-structure; and a locking member comprising a beam arm and a plurality of locking teeth, wherein the beam arm is perpendicular to the flexible beam and one end of the beam arm is fixed, and wherein the plurality of locking teeth are distributed at intervals along the beam arm, such that the other end of the flexible beam is engaged to one of the plurality of locking teeth when the flexible beam is loaded. A method for testing an impact strength of a micro-structure is also disclosed.

Abstract: A semiconductor device and a method for fabricating thereof are provided. In the method for fabricating the semiconductor device, at first, a first semiconductor wafer including a first oxide layer and a second semiconductor wafer including a second oxide layer are provided. Next, the second oxide layer is bonded with the first oxide layer. Then, a through via is formed to through the second oxide layer and the first oxide layer, so as to form a sidewall cut on a sidewall of the through via at an interface of the first oxide layer and the second oxide layer. Then, an ashing operation is performed on the sidewall of the through via to form a protection layer on the sidewall of the through via. After the ashing operation is performed, a conductive material is deposited on the through via.

Abstract: A virtual service is instantiated from a service model that is operable to receive requests intended for a particular software component in a system and generate simulated responses of the particular software component based on a service model modeling responses of the particular software component. A particular request intended for the particular software component is identified that has been redirected to the virtual service and content of a simulated response to the particular request is generated using the virtual service in a first language. A second language to be applied to the simulated response is determined based on the request, and a translation of the content from the first language into the second language is determined. A modified version of the simulated response is sent to the other software component in response to the particular request that includes the content in the second language.

Abstract: A receptacle connector is provided which has an insulating body, a plurality of conductive terminals, two grounding latches and a metal shell. The body has a housing and a tongue. Each terminal has a mating portion, a soldering portion and a connecting portion. The mating portion is exposed on the tongue. The soldering portion extends outwardly from the housing. The terminals are divided into upper and lower rows. Each row has at least two grounding terminals and at least two power terminals. The latches are embedded in the body and are partly exposed to two sides of the tongue, and each have a ground soldering leg extending outwardly from the housing. The shell is fixed on the body and surrounds an outer periphery of the tongue to form a mating cavity. The latches are each interposed between the grounding terminals of the upper and lower rows.

Abstract: Embodiments of the disclosure pertain to providing, via a graphical user interface, a set of user-selectable resources available for defining a resource architecture for an application in development; receiving, via the graphical user interface, a selection of a first resource for the application; receiving, via the graphical user interface, a selection of a second resource for the application; functionally connecting the first resource with the second resource, wherein the first resource, the second resource, and the logical relationship between the first resource and the second resource define the resource architecture for the application; verifying the resource architecture, wherein verifying the resource architecture comprises communicating over a network with the first resource and with the second resource and verifying that the first resource can communicate over a network with the second resource; and providing a graphical indication of a result of the verification of the resource architecture.

Abstract: The present invention provides a low tack bubble free advertisement film, comprising an advertisement film layer, a dot glue layer and a release layer; a adhesion promoter layer is disposed between the back face of the advertisement film layer and the dot glue layer; the dot glue layer consists of over four independent, separable glue dots; and the area of the dot glue layer is 30-80% of the adhesion promoter layer. The present invention can provide a special advertisement film in the field of advertising consumables. The advertisement film has many advantages, such as low tack, totally bubble free, removable, and can be pasted for a long time. The present invention provides a convenient, efficient, feasible solution for advertising consumables.