Patents by Inventor Fang Yu

Fang Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978781
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate containing a first active region in a first region of the substrate and a second active region in a second region of the substrate, a plurality of first gate structures over the first active region each including a first gate stack having a first high-k gate dielectric and a first gate electrode and first gate spacers surrounding the first gate stack, and a plurality of second gate structures over the second active region each including a second gate stack having a second high-k gate dielectric and a second gate electrode and second gate spacers surrounding the second gate stack. At least a portion of the second gate electrode comprises dopants.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Anhao Cheng, Fang-Ting Kuo, Yen-Yu Chen
  • Patent number: 11973129
    Abstract: A method for forming a semiconductor device structure is provided. The semiconductor device includes forming nanowire structures stacked over a substrate and spaced apart from one another, and forming a dielectric material surrounding the nanowire structures. The dielectric material has a first nitrogen concentration. The method also includes treating the dielectric material to form a treated portion. The treated portion of the dielectric material has a second nitrogen concentration that is greater than the first nitrogen concentration. The method also includes removing the treating portion of the dielectric material, thereby remaining an untreated portion of the dielectric material as inner spacer layers; and forming the gate stack surrounding nanowire structures and between the inner spacer layers.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: April 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Han-Yu Lin, Chansyun David Yang, Fang-Wei Lee, Tze-Chung Lin, Li-Te Lin, Pinyen Lin
  • Patent number: 11973038
    Abstract: A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.
    Type: Grant
    Filed: August 15, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fang-Yu Liang, Kai-Chiang Wu
  • Publication number: 20240121201
    Abstract: A communication method includes determining that content of a to-be-sent second data packet is the same as content of a first data packet, and sending repetition indication information. The second data packet follows the first data packet. The repetition indication information is useable to indicate that the second data packet repeats a previous data packet.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Haiyang SUN, Fang YU, Feng YU
  • Publication number: 20240121369
    Abstract: The present disclosure provides a screen detection method, an apparatus and a device, a computer program and a readable medium, and belongs to the technical field of screens. The method includes: receiving a cylindrical lens detection instruction for a target screen, wherein the cylindrical lens detection instruction at least includes target viewpoints; acquiring browsing images shot from the target screen under the target viewpoints in response to the detection instruction, wherein the target screen is a screen of which the light emission side is provided with cylindrical lenses; using the browsing images as viewpoint images under the condition that the browsing images include target contents; and outputting detection parameters of the cylindrical lenses on the target screen based on image parameters of the viewpoint images.
    Type: Application
    Filed: May 28, 2021
    Publication date: April 11, 2024
    Inventors: Jian GAO, Sen MA, Fang CHENG, Tao HONG, Jinye ZHU, Pengxia LIANG, Jing YU
  • Patent number: 11955026
    Abstract: A method, computer program product, and computer system for public speaking guidance is provided. A processor retrieves speaker data regarding a speech made by a user. A processor separates the speaker data into one or more speaker modalities. A processor extracts one or more speaker features from the speaker data for the one or more speaker modalities. A processor generates a performance classification based on the one or more speaker features. A processor sends to the user guidance regarding the speech based on the performance classification.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: April 9, 2024
    Assignee: International Business Machines Corporation
    Inventors: Cheng-Fang Lin, Ching-Chun Liu, Ting-Chieh Yu, Yu-Siang Chen, Ryan Young
  • Publication number: 20240111337
    Abstract: An electronic device including a body and a receptacle connector is provided. The body has a side wall surface, a receptacle slot located at the side wall surface, a waterproof protrusion protruding from the side wall surface, and two gutters located at the side wall surface, where the waterproof protrusion is located above the receptacle slot, and the two gutters are respectively located at two opposite sides of the receptacle slot. The receptacle connector is disposed in the receptacle slot.
    Type: Application
    Filed: May 8, 2023
    Publication date: April 4, 2024
    Applicant: Acer Incorporated
    Inventors: Wei-Chih Wang, Chen-Min Hsiu, Chien-Yu Lee, Szu-Wei Yang, Fang-Ying Huang
  • Publication number: 20240097011
    Abstract: A method includes forming a fin structure over a substrate, wherein the fin structure comprises first semiconductor layers and second semiconductor layers alternately stacked over a substrate; forming a dummy gate structure over the fin structure; removing a portion of the fin structure uncovered by the dummy gate structure; performing a selective etching process to laterally recess the first semiconductor layers, including injecting a hydrogen-containing gas from a first gas source of a processing tool to the first semiconductor layers and the second semiconductor layers; and injecting an F2 gas from a second gas source of the processing tool to the first semiconductor layers and the second semiconductor layers; forming inner spacers on opposite end surfaces of the laterally recessed first semiconductor layers of the fin structure; and replacing the dummy gate structure and the first semiconductor layers with a metal gate structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Han-Yu LIN, Fang-Wei LEE, Kai-Tak LAM, Raghunath PUTIKAM, Tzer-Min SHEN, Li-Te LIN, Pinyen LIN, Cheng-Tzu YANG, Tzu-Li LEE, Tze-Chung LIN
  • Publication number: 20240098035
    Abstract: Disclosed herein are related to devices and methods for communication. In one aspect, a device includes a first processor and a second processor. The first processor may be configured to generate a first set of packets associated with an application data unit in a first layer corresponding to content data. Each packet of the first set of packets may include a flag indicative of an association with the application data unit. The second processor may be configured to generate a second set of one or more packets in a second layer for transmission, in response to determining that the first set of packets is associated with the application data unit according to flags of the first set of packets. The second processor may be configured to schedule to transmit the second set of one or more packets in the second layer within a defined time period.
    Type: Application
    Filed: August 31, 2022
    Publication date: March 21, 2024
    Applicant: Meta Platforms Technologies, LLC
    Inventors: Yee Sin Chan, Jiansong Wang, Fang Yu, Xiaodi Zhang, Yi Lu, Chunyu Hu
  • Patent number: 11937128
    Abstract: An SMF network element determines, according to a PCC rule of a flow, a third latency of transmitting the flow from a UPF network element to UE, so that a second latency of transmitting the flow from a flow service provider in a TSN to the UE can be determined based on the third latency and a first latency of transmitting the flow from the flow service provider in the TSN to the UPF network element.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: March 19, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Fang Yu, Yan Li
  • Publication number: 20240087945
    Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Tsai-Hao HUNG, Ping-Cheng KO, Tzu-Yang LIN, Fang-Yu LIU, Cheng-Han WU
  • Publication number: 20240087932
    Abstract: An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Chung TSAI, Ping-Cheng KO, Fang-yu LIU, Jhih-Yuan YANG
  • Publication number: 20240067583
    Abstract: The present disclosure relates to a thermal coupling method for preparing ethylene by ethanol dehydration and device thereof. The device includes an ethanol dehydration reaction system, a quenching compression system, an alkaline washing system, a molecular sieve drying system and an ethylene purification and propylene refrigeration cycle system; ethanol dehydration reaction products in the ethanol dehydration reaction system serve as a heat source for preheating, vaporization and superheating of a raw material of ethanol; tower bottoms of an evaporation tower in the quenching compression system serve as a heat source for preheating of a feed stream of the evaporation tower and heating of an overhead gas of a quenching tower; products of ethylene in the alkaline washing system serve as a cold source for cooling of crude ethylene.
    Type: Application
    Filed: June 19, 2023
    Publication date: February 29, 2024
    Inventors: Minhua ZHANG, Hao GONG, He DONG, Feng SHI, Fang MENG, Yingzhe YU, Haoxi JIANG
  • Patent number: 11910244
    Abstract: This application provides a method for controlling disorder of downlink data and an apparatus thereof. The method includes: A control plane network element determines to switch from a first user plane device to a second user plane device, and sends indication information to the second user plane device. The second user plane device buffers, according to the received indication information, downlink data received from a session anchor, and sends the buffered downlink data after reception of an end marker from the first user plane device.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: February 20, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yongcui Li, Fang Yu, Yan Li, Hui Ni, Yizhuang Wu
  • Patent number: 11892625
    Abstract: The disclosure provides a method for determining a posture of a user, a host, and a computer readable medium. The method includes: detecting a relative position between a first wearable device and a second wearable device; and in response to determining that the relative position between the first wearable device and the second wearable device satisfies a predetermined relative position, determining the posture of the user at least based on the relative position between the first wearable device and the second wearable device.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: February 6, 2024
    Assignee: HTC Corporation
    Inventors: Chiao-Chien Huang, Fang Yu Cheng
  • Patent number: 11886597
    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for detecting suspicious accounts. One of the methods includes identifying one or more potential clusters of malicious accounts; for each cluster, processing a collection of content associated with each account of the cluster, the processing comprising applying a plurality of models in series to determine whether the collection of content indicates a common pattern; and based on the respective determinations, classifying the accounts of each cluster as ordinary or suspicious.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: January 30, 2024
    Assignee: Data Visor, Inc.
    Inventors: Alexandros Vlissidis, Nicola Corradi, Fang Yu, Olivia Wang
  • Patent number: 11881421
    Abstract: An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: January 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Chung Tsai, Ping-Cheng Ko, Fang-yu Liu, Jhih-Yuan Yang
  • Publication number: 20240019904
    Abstract: An edge surface includes a first peripheral surface extending between a first major surface and an outer peripheral surface of a substrate. The first peripheral surface includes a first depth and a first width. In aspects, the first depth is from about 4 micrometers to about 12 micrometers, and the first width is from about 30 micrometers to about 50 micrometers. In aspects, the first depth is from about 14 micrometers to about 24 micrometers, and the first width is from about 40 micrometers to about 60 micrometers. In aspects, a ratio of the first depth to a substrate thickness is from about 0.2 to about 0.4, a ratio of the first width to the substrate thickness is from about 1 to about 1.55, and a ratio of the first width to the first depth is from about 2 to about 8.
    Type: Application
    Filed: July 14, 2023
    Publication date: January 18, 2024
    Inventors: YU CHENG, FANG-YU HSU, WEIRONG JIANG, PETER JOSEPH LEZZI, SAMUEL ODEI OWUSU
  • Publication number: 20240020698
    Abstract: Systems and methods for rule optimization are disclosed. In accordance with aspects, a method may include providing a segment rule, where the segment rule uses a machine learning model score associated with a data record and a scaler value to evaluate data records and the segment rule is configured to evaluate data records categorized into a corresponding segment of the segment rule by attributes of the data records; receiving, at the segment rule, a categorized set of data records, wherein each data record in the categorized set of data records is categorized in the corresponding segment of the segment rule based on attributes of the data records; iteratively evaluating, by the segment rule, each received data record with a range of scaler values, where the iteratively evaluating produces a plurality of outputs of the segment rule; and determining an optimal output from the plurality of outputs.
    Type: Application
    Filed: May 27, 2022
    Publication date: January 18, 2024
    Inventors: Mike HUGHES, Yea Kang YOON, Fang-Yu LIN, Ramana NALLAJARLA, Sambasiva R VADLAMUDI, Josh X JIANG, Hari SIVAPRASAD, Benedict HALL, Lifeng WANG
  • Patent number: D1023230
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: April 16, 2024
    Assignee: Ye Siang Enterprise Co., Ltd.
    Inventors: Ting-Fang Yu, Shih-Chieh Chuang, Shih-Hsien Chuang, Wei-Kuo Kong