Patents by Inventor Fang Yu

Fang Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240234329
    Abstract: A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.
    Type: Application
    Filed: March 26, 2024
    Publication date: July 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fang-Yu Liang, Kai-Chiang Wu
  • Publication number: 20240216281
    Abstract: A manufacturing method of medication includes the following steps. Firstly, an effective dosage of an API is dissolved in a dissolved agent to form a first solution, wherein the API includes triamcinolone acetonide or YC-1 compound. Next, the first solution is filtered through a filter membrane at a room temperature to obtain a second solution. Then, a precipitating agent is added into the second solution to obtain a third solution, followed by continuously stirring the third solution to precipitate crystals. The third solution is further stirred under the room temperature, a low pressure to sequentially remove the dissolved agent and the precipitating agent.
    Type: Application
    Filed: March 27, 2023
    Publication date: July 4, 2024
    Applicant: YUNG SHIN PHARM. IND. CO., LTD.
    Inventors: Fang-Yu Lee, Yu-Shyang Yu
  • Publication number: 20240172052
    Abstract: This application provides a method for controlling disorder of downlink data and an apparatus thereof. The method includes: A control plane network element determines to switch from a first user plane device to a second user plane device, and sends indication information to the second user plane device. The second user plane device buffers, according to the received indication information, downlink data received from a session anchor, and sends the buffered downlink data after reception of an end marker from the first user plane device.
    Type: Application
    Filed: January 25, 2024
    Publication date: May 23, 2024
    Inventors: Yongcui Li, Fang Yu, Yan Li, Hui Ni, Yizhuang Wu
  • Patent number: 11983321
    Abstract: A display device is configured to display a virtual world. A hand-mounted device is adapted to be worn on a hand of a user and includes an ultrasound transducer and a contact sensor. The ultrasound transducer is configured to emit an ultrasound haptic. The contact sensor is configured to detect a sensor value. A processor is configured to obtain a real position of the hand-mounted device to determine a virtual position of a virtual hand in the virtual world and to determine a virtual distance between the virtual hand and a virtual object in the virtual world based on the virtual position. The processor is configured to determine the hand of the user is open based on the sensor value and in response to the virtual distance being smaller than a contact distance and the hand being open, enable the ultrasound transducer to emit the ultrasound haptic to the finger.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: May 14, 2024
    Assignee: HTC Corporation
    Inventor: Fang Yu Cheng
  • Patent number: 11973038
    Abstract: A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.
    Type: Grant
    Filed: August 15, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fang-Yu Liang, Kai-Chiang Wu
  • Publication number: 20240121201
    Abstract: A communication method includes determining that content of a to-be-sent second data packet is the same as content of a first data packet, and sending repetition indication information. The second data packet follows the first data packet. The repetition indication information is useable to indicate that the second data packet repeats a previous data packet.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Haiyang SUN, Fang YU, Feng YU
  • Publication number: 20240098035
    Abstract: Disclosed herein are related to devices and methods for communication. In one aspect, a device includes a first processor and a second processor. The first processor may be configured to generate a first set of packets associated with an application data unit in a first layer corresponding to content data. Each packet of the first set of packets may include a flag indicative of an association with the application data unit. The second processor may be configured to generate a second set of one or more packets in a second layer for transmission, in response to determining that the first set of packets is associated with the application data unit according to flags of the first set of packets. The second processor may be configured to schedule to transmit the second set of one or more packets in the second layer within a defined time period.
    Type: Application
    Filed: August 31, 2022
    Publication date: March 21, 2024
    Applicant: Meta Platforms Technologies, LLC
    Inventors: Yee Sin Chan, Jiansong Wang, Fang Yu, Xiaodi Zhang, Yi Lu, Chunyu Hu
  • Patent number: 11937128
    Abstract: An SMF network element determines, according to a PCC rule of a flow, a third latency of transmitting the flow from a UPF network element to UE, so that a second latency of transmitting the flow from a flow service provider in a TSN to the UE can be determined based on the third latency and a first latency of transmitting the flow from the flow service provider in the TSN to the UPF network element.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: March 19, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Fang Yu, Yan Li
  • Publication number: 20240087932
    Abstract: An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Chung TSAI, Ping-Cheng KO, Fang-yu LIU, Jhih-Yuan YANG
  • Publication number: 20240087945
    Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Tsai-Hao HUNG, Ping-Cheng KO, Tzu-Yang LIN, Fang-Yu LIU, Cheng-Han WU
  • Patent number: 11910244
    Abstract: This application provides a method for controlling disorder of downlink data and an apparatus thereof. The method includes: A control plane network element determines to switch from a first user plane device to a second user plane device, and sends indication information to the second user plane device. The second user plane device buffers, according to the received indication information, downlink data received from a session anchor, and sends the buffered downlink data after reception of an end marker from the first user plane device.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: February 20, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yongcui Li, Fang Yu, Yan Li, Hui Ni, Yizhuang Wu
  • Patent number: 11892625
    Abstract: The disclosure provides a method for determining a posture of a user, a host, and a computer readable medium. The method includes: detecting a relative position between a first wearable device and a second wearable device; and in response to determining that the relative position between the first wearable device and the second wearable device satisfies a predetermined relative position, determining the posture of the user at least based on the relative position between the first wearable device and the second wearable device.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: February 6, 2024
    Assignee: HTC Corporation
    Inventors: Chiao-Chien Huang, Fang Yu Cheng
  • Patent number: 11886597
    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for detecting suspicious accounts. One of the methods includes identifying one or more potential clusters of malicious accounts; for each cluster, processing a collection of content associated with each account of the cluster, the processing comprising applying a plurality of models in series to determine whether the collection of content indicates a common pattern; and based on the respective determinations, classifying the accounts of each cluster as ordinary or suspicious.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: January 30, 2024
    Assignee: Data Visor, Inc.
    Inventors: Alexandros Vlissidis, Nicola Corradi, Fang Yu, Olivia Wang
  • Patent number: 11881421
    Abstract: An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: January 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Chung Tsai, Ping-Cheng Ko, Fang-yu Liu, Jhih-Yuan Yang
  • Publication number: 20240020698
    Abstract: Systems and methods for rule optimization are disclosed. In accordance with aspects, a method may include providing a segment rule, where the segment rule uses a machine learning model score associated with a data record and a scaler value to evaluate data records and the segment rule is configured to evaluate data records categorized into a corresponding segment of the segment rule by attributes of the data records; receiving, at the segment rule, a categorized set of data records, wherein each data record in the categorized set of data records is categorized in the corresponding segment of the segment rule based on attributes of the data records; iteratively evaluating, by the segment rule, each received data record with a range of scaler values, where the iteratively evaluating produces a plurality of outputs of the segment rule; and determining an optimal output from the plurality of outputs.
    Type: Application
    Filed: May 27, 2022
    Publication date: January 18, 2024
    Inventors: Mike HUGHES, Yea Kang YOON, Fang-Yu LIN, Ramana NALLAJARLA, Sambasiva R VADLAMUDI, Josh X JIANG, Hari SIVAPRASAD, Benedict HALL, Lifeng WANG
  • Publication number: 20240019904
    Abstract: An edge surface includes a first peripheral surface extending between a first major surface and an outer peripheral surface of a substrate. The first peripheral surface includes a first depth and a first width. In aspects, the first depth is from about 4 micrometers to about 12 micrometers, and the first width is from about 30 micrometers to about 50 micrometers. In aspects, the first depth is from about 14 micrometers to about 24 micrometers, and the first width is from about 40 micrometers to about 60 micrometers. In aspects, a ratio of the first depth to a substrate thickness is from about 0.2 to about 0.4, a ratio of the first width to the substrate thickness is from about 1 to about 1.55, and a ratio of the first width to the first depth is from about 2 to about 8.
    Type: Application
    Filed: July 14, 2023
    Publication date: January 18, 2024
    Inventors: YU CHENG, FANG-YU HSU, WEIRONG JIANG, PETER JOSEPH LEZZI, SAMUEL ODEI OWUSU
  • Patent number: 11870296
    Abstract: An uninterruptible power system and an operation method thereof are provided. The uninterruptible power system comprises a DC-AC conversion circuit, a plurality of switches, a plurality of sensing units, a plurality of output ports and a control unit. Each output port is electrically coupled to an output terminal of the DC-AC conversion circuit sequentially through one of the sensing units and one of the switches. The control unit is configured to define members of at least one group from the output ports according to a system setting, and define which members of each group are non-critical output ports according to the system setting. The control unit is further configured to set, according to the system setting, at least one condition for all non-critical output ports in each group to simultaneously stop supplying power, and to accordingly control the operations of the corresponding switches.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: January 9, 2024
    Assignee: CYBER POWER SYSTEMS, INC.
    Inventors: Kai-Tsung Yang, Jui-Hung Chou, Fang-Yu Hsu, Shou-Ting Yeh
  • Patent number: 11870680
    Abstract: A communication method and apparatus are provided for transmitting packets of a data stream between user equipment. After receiving a first packet from a first user equipment, a user plane function (UPF) forwards the first packet to a second user equipment at a first moment, so that the first packet that arrives at the UPF before the first moment is not forwarded to the second user equipment until the first moment, to support deterministic sending and ensure that a time sensitive communication (TSC) packet is sent at a determined moment, so as to provide deterministic delay assurance for applications such as industrial control and telemedicine.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: January 9, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Li Qiang, Fang Yu, Xiangdong Zhang
  • Patent number: D1023230
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: April 16, 2024
    Assignee: Ye Siang Enterprise Co., Ltd.
    Inventors: Ting-Fang Yu, Shih-Chieh Chuang, Shih-Hsien Chuang, Wei-Kuo Kong
  • Patent number: D1034897
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: July 9, 2024
    Assignee: Ye Siang Enterprise Co., Ltd.
    Inventors: Ting-Fang Yu, Shih-Chieh Chuang, Shih-Hsien Chuang, Wei-Kuo Kong