Patents by Inventor Fang Yu

Fang Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11272440
    Abstract: A network slice selection method and apparatus are disclosed. The method includes: receiving, by a first SSF device of a VPLMN, a first service request message; obtaining, by the first SSF device, roaming information of UE according to the first service request message; selecting, by the first SSF device, a first network slice instance in the VPLMN for the UE based on the roaming information of the UE.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: March 8, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Hui Ni, Fang Yu, Yan Li, Xiaoqiang Qiao
  • Patent number: 11271193
    Abstract: A method of manufacturing an electrode by disposing a three-dimensional substrate in a metal nitrate solution, drying, and thermally phosphatizing with a phosphorus source under inert gas to form a metal based phosphate catalyst on the substrate. An electrocatalyst and electrode produced via the method are also provided.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: March 8, 2022
    Assignee: UNIVERSITY OF HOUSTON SYSTEM
    Inventors: Zhifeng Ren, Shuo Chen, Fang Yu, Haiqing Zhou
  • Patent number: 11239154
    Abstract: In some embodiments, a fishbone structure in a power network includes a first conductive segment in a first conductive layer running in a first direction, a plurality of second conductive segments in a second conductive layer running in a second direction and a plurality of interlayer vias between the first conductive layer and the second conductive layer. The second direction is substantially vertical to the first direction. The plurality of second conductive segments overlap with the first conductive segment. The plurality of interlayer vias are formed at where the plurality of second conductive segments overlap with the first conductive segment. Each of the plurality of second conductive segments has a width such that the first conductive segment has a first unit spacing with a first adjacent conductive line or one of the plurality of second conductive segments has a second unit spacing with a second adjacent conductive line.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: February 1, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chien-Ju Chao, Fang-Yu Fan, Yi-Chuin Tsai, Kuo-Nan Yang, Chung-Hsing Wang
  • Patent number: 11232364
    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for rule generation and interaction. A rules engine is provided that does not require manual effort to generate or maintain high-quality rules over time for detecting malicious accounts or events. Rules no longer need to be manually added, tuned, or removed from the system. The system is able to determine the health of each rule and automatically add, tune, and remove rules to maintain a consistent, effective rule set.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: January 25, 2022
    Assignee: DataVisor, Inc.
    Inventors: Catherine Lu, Patrick Glenn Murray, Ming Qi, Shuo Shan, Yinglian Xie, Fang Yu, Yuhao Zheng
  • Patent number: 11233019
    Abstract: A method including followings is provided. An encapsulated device including a semiconductor die and an insulating encapsulation laterally encapsulating the semiconductor die is provided. An insulating layer is formed over a surface of the encapsulated device. A groove pattern is formed on the insulating layer. A conductive paste is filled in the groove pattern and the conductive paste filled in the groove pattern is cured.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: January 25, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fang-Yu Liang, Ching-Feng Yang, Kai-Chiang Wu
  • Publication number: 20220013062
    Abstract: An adjusting device for adjusting a driving voltage of a light-emitting element is provided. The adjusting device includes a driving circuit and a control circuit. The control circuit is configured to generate a voltage difference. A control signal indicates that brightness of a display is adjusted from first brightness of the display to second brightness of the display, and the driving circuit adjusts the driving voltage according to the voltage difference. The control circuit queries a look-up table to obtain a first voltage corresponding to the first brightness of the display and a second voltage corresponding to the second brightness of the display. The voltage difference is obtained from the difference between the first voltage and the second voltage. The first voltage and second voltage respectively indicate the minimum cross-voltages required by the light-emitting element under the first brightness of the display and the second brightness of the display.
    Type: Application
    Filed: May 5, 2021
    Publication date: January 13, 2022
    Applicant: Coretronic Corporation
    Inventors: Fang Yu Hsieh, Ho-Yi Yeh, Kuo Tsung Chen
  • Patent number: 11217637
    Abstract: The present disclosure is related to a display substrate. The display substrate having a display area comprises a first electrode layer on a base substrate; a second electrode layer on a side of the first electrode layer far away from the base substrate; a light emitting layer between the first electrode layer and the second electrode layer; a pixel definition layer defining a plurality of sub-pixel regions with each of the plurality of sub-pixel regions containing the light emitting layer and the first electrode layer; and a signal line coupled to the second electrode layer. The signal line is substantially within the display area and at a different layer from the second electrode layer.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: January 4, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shengji Yang, Xue Dong, Xiaochuan Chen, Hui Wang, Yanming Wang, Fang Yu, Wei Li
  • Patent number: 11218423
    Abstract: Embodiments provide a method, which can implement establishment of a network function virtualization (NFV) network service chain. The method includes obtaining, by a first communications unit, a service chain rule, where the service chain rule is used to indicate service processing that needs to be performed. The method also includes obtaining, according to the service chain rule, information about a service chain through which a service route passes, where the information about the service chain is used to indicate information about a virtualized network function (VNF) through which the service route passes, and the VNF is configured for the service processing; and sending a route and resource configuration request message, where the route and resource configuration request message carries the information about the service chain, to request to perform, according to the information about the service chain, route and resource configuration for the VNF included in the service chain.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: January 4, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Lei Zhu, Anni Wei, Fang Yu
  • Publication number: 20210407904
    Abstract: A package component, a semiconductor package and a manufacturing method thereof are provided. The package component for electrically coupling a semiconductor die includes an insulating layer, a functional circuit structure embedded in the insulating layer within a functional circuit region, and a seal ring structure embedded in the insulating layer within the seal ring region surrounding the functional circuit region. The semiconductor die disposed on the package component is electrically coupled to the functional circuit structure. The seal ring structure is electrically isolated from the functional circuit structure. The seal ring structure includes a stack of alternating interconnect layers and via patterns, and the via pattern at each level of the stack includes first features spaced apart from one another and arranged at neighboring corners of the seal ring region.
    Type: Application
    Filed: June 29, 2020
    Publication date: December 30, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fang-Yu Liang, Kai-Chiang Wu
  • Patent number: 11195737
    Abstract: An apparatus for storing and transporting semiconductor elements includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pin holder integrally extending from the first rear side wall. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pivotal pin structure integrally coupled with and extending from the second rear side wall. The at least one pivotal pin structure comprises a shaft, and a head connected with the shaft. The at least one pin holder defines a cavity sized and shaped to accept the head of the at least one pivotal pin structure. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: December 7, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Sung Kuo, Jhih-Yuan Yang, Po-Wei Chen, Fang-yu Liu, Ping-Cheng Ko, Chung-Cheng Chen
  • Publication number: 20210375809
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a semiconductor die laterally covered by an insulating encapsulation, a first redistribution structure disposed on the semiconductor die and the insulating encapsulation, a second redistribution structure disposed opposite to the first redistribution structure, and a through insulating via (TIV) penetrating through the insulating encapsulation. The semiconductor die is electrically coupled to the first redistribution structure through the second redistribution structure and the TIV. The first redistribution structure includes a patterned conductive layer covered by a patterned dielectric layer, and under-ball metallurgy (UBM) pattern partially covered by the patterned dielectric layer.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 2, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fang-Yu Liang, Hsiu-Jen Lin, Kai-Chiang Wu, Chih-Chiang Tsao
  • Publication number: 20210375774
    Abstract: A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.
    Type: Application
    Filed: August 15, 2021
    Publication date: December 2, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fang-Yu Liang, Kai-Chiang Wu
  • Patent number: 11162179
    Abstract: A hybrid three dimensional (3D) hydrogen evolution reaction (HER) catalyst that is formed from a porous Ni foam support, a NiSe2 scaffold positioned on the support; and layered transition metal dichalcogenide (LTMDC) or first-row transition metal dichalcogenide particles positioned on the NiSe2 scaffold. The catalyst provides a low onset potential, large cathode current density, small Tafel slopes, and large exchange current densities, similar in catalytic power to Pt HER catalysts.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: November 2, 2021
    Assignee: UNIVERSITY OF HOUSTON SYSTEM
    Inventors: Zhifeng Ren, Haiqing Zhou, Fang Yu, Shuo Chen
  • Patent number: 11160805
    Abstract: The present invention relates to kinase inhibitor C8-C16 aliphatic sulfate salts, compositions containing kinase inhibitor C8-C16 aliphatic sulfate salts and uses thereof.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: November 2, 2021
    Assignee: HANDA ONOCOLOGY, LLC
    Inventors: Fang-Yu Liu, K. C. Sung, Chin-Yao Yang, Chi-Cheng Lin, Yi-Hsin Lin, Li Qiao
  • Patent number: 11150269
    Abstract: A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: October 19, 2021
    Assignee: MPI CORPORATION
    Inventors: Hui-Pin Yang, Shang-Jung Hsieh, Yu-Wen Chou, Ching-Fang Yu, Huo-Kang Hsu, Chin-Tien Yang
  • Publication number: 20210283133
    Abstract: The present invention relates to capsules comprising dasatinib lauryl sulfate salt.
    Type: Application
    Filed: May 17, 2021
    Publication date: September 16, 2021
    Applicant: HANDA ONCOLOGY, LLC
    Inventors: FANG-YU LIU, K.C. SUNG, CHIN-YAO YANG, CHI-CHENG LIN, YI-HSIN LIN, LI QIAO
  • Publication number: 20210274585
    Abstract: A communication method, device, and medium are provided, the method including determining, by a terminal device, whether the terminal device supports at least one of a time sensitive networking (TSN) service, a packet data unit (PDU) session corresponding to a TSN service needs to be established, a currently established PDU session needs to carry a TSN stream, or an established PDU session needs to carry a TSN stream, and sending, by the terminal device, port information of the terminal device to a session management network element, where the port information of the terminal device includes a port identifier of the terminal device, and further includes information about a transmission delay between a port of the terminal device and an external neighbor node.
    Type: Application
    Filed: May 18, 2021
    Publication date: September 2, 2021
    Inventors: Fang Yu, Hui Ni, Yan Li
  • Publication number: 20210268558
    Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.
    Type: Application
    Filed: December 23, 2020
    Publication date: September 2, 2021
    Inventors: M.H. WU, Fang-Yu KUO, Kai-Yu LIU, Yu-Chun WU, Jao Sheng HUANG, W.Y. CHEN
  • Patent number: 11106872
    Abstract: A computer-implemented system for improving computerized analysis and grading for one or more populated sentence structure diagrams is shown. The system includes a sentence diagramming interface which in turn includes a natural language input for receiving a natural language sentence to be diagrammed, a sentence construction toolbox including a plurality of sentence construction components used in generating a constructed sentence structure, and a sentence construction workspace configured to receive and allow manipulation of at least one selected sentence construction component to generate the constructed sentence structure and receive and allow manipulation of each word in the natural language sentence such that each word is assigned to a position in the constructed sentence structure to generate a constructed and populated sentence structure.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: August 31, 2021
    Inventor: Jyu-fang Yu
  • Publication number: 20210266797
    Abstract: This application provides a method for controlling disorder of downlink data and an apparatus thereof. The method includes: A control plane network element determines to switch from a first user plane device to a second user plane device, and sends indication information to the second user plane device. The second user plane device buffers, according to the received indication information, downlink data received from a session anchor, and sends the buffered downlink data after reception of an end marker from the first user plane device.
    Type: Application
    Filed: May 12, 2021
    Publication date: August 26, 2021
    Inventors: Yongcui LI, Fang YU, Yan LI, Hui NI, Yizhuang WU