Patents by Inventor Fang Yu

Fang Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11476277
    Abstract: A method for forming a gate structure of a 3D memory device is provided. The method comprises: forming, on a substrate, an alternating dielectric stack including a plurality of dielectric layer pairs, each of the plurality of dielectric layer pairs comprising a first dielectric layer and a second dielectric layer different from the first dielectric layer; forming a slit penetrating vertically through the alternating dielectric stack and extending in a horizontal direction; removing the plurality of second dielectric layers in the alternating dielectric stack through the slit to form a plurality of horizontal trenches; forming a gate structure in each of the plurality of horizontal trenches; forming a spacer layer on sidewalls of the slit to cover the gate structures, wherein the spacer layer has a laminated structure; and forming a conductive wall in the slit, wherein the conductive wall is insulated from the gate structures by the spacer layer.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: October 18, 2022
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Lei Ding, Jing Gao, Chuan Yang, Lan Fang Yu, Ping Yan, Sen Zhang, Bo Xu
  • Patent number: 11469248
    Abstract: A three-dimensional (3D) NAND memory device is provided. The device comprises an alternating stack including a plurality of dielectric/conductive layer pairs each comprising a dielectric layer and a conductive layer. The device further comprises a conductive wall vertically penetrating through the alternating stack and extending in a horizontal direction, and a spacer layer on sidewalls of the conductive wall configured to insulate the conductive wall from the conductive layers of the alternating stack. The spacer layer comprises a first spacer sublayer having a first dielectric material, a second spacer sublayer having a second dielectric material, and a third spacer sublayer having a third dielectric material. The second spacer is sandwiched between the first spacer sublayer and the third spacer sublayer. A second k-value of the second dielectric material is higher than a first k-value of the first dielectric material and higher than a third k-value of the third dielectric material.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: October 11, 2022
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Lei Ding, Jing Gao, Chuan Yang, Lan Fang Yu, Ping Yan, Sen Zhang, Bo Xu
  • Publication number: 20220303824
    Abstract: A quality of service (QoS) parameter processing method and a system, where the method includes obtaining, by a control plane device, a core network (CN) packet delay budget (PDB) between a first access network device and a first user plane function device, sending, by the control plane device, the CN PDB to the first access network device, determining, by the first access network device, an access network (AN) PDB between a terminal device and the first access network device based on the CN PDB and an end-to-end PDB between the terminal device and the first user plane function device, and scheduling, by the first access network device, an air interface resource between the terminal device and the first access network device based on the AN PDB.
    Type: Application
    Filed: June 2, 2022
    Publication date: September 22, 2022
    Inventors: Yexing Li, Yan Wang, Qi Su, Zhongping Chen, Fang Yu
  • Patent number: 11447882
    Abstract: A method of manufacturing a bifunctional electrocatalyst for overall water splitting comprising oxygen evolution reaction (OER) and hydrogen evolution reaction (HER) by growing electrocatalyst comprising primarily metallic phosphides on a three-dimensional substrate by: immersing the substrate in an iron nitrate solution to form a once disposed substrate; subjecting the once disposed substrate to thermal phosphidation with phosphorus powder under inert gas to grow metal phosphides thereupon and form a once subjected substrate; cooling the once subjected substrate to form a cooled, once subjected substrate; immersing the cooled, once subjected substrate in an iron nitrate solution to form a twice disposed substrate; and subjecting the twice disposed substrate to thermal phosphidation with phosphorus powder under inert gas to provide an electrode comprising the bifunctional electrocatalyst on the three-dimensional substrate.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: September 20, 2022
    Assignee: UNIVERSITY OF HOUSTON SYSTEM
    Inventors: Zhifeng Ren, Fang Yu, Haiqing Zhou, Shuo Chen
  • Publication number: 20220294858
    Abstract: Embodiments of this application provide a packet transmission method, a communication apparatus, and a communication system. A target transport layer proxy network element establishes a fourth transport layer connection based on a first context of a source transport layer proxy network element, where the first context is a context about packet transmission of the source transport layer proxy network element on a first path. If the target transport layer proxy network element receives first indication information, and the first indication information indicates that application context migration between a first application server and a second application server is completed, the target transport layer proxy network element performs transport layer processing on a packet on a second path based on a second context of the target transport layer proxy network element, and transmits, on the second path, a packet obtained through the transport layer processing. Hence, a packet loss can be avoided.
    Type: Application
    Filed: May 27, 2022
    Publication date: September 15, 2022
    Inventors: Fang YU, Yan LI, Ao LEI
  • Publication number: 20220267496
    Abstract: A polypropylene modifier and a preparation method therefor, polypropylene composition, and polypropylene material comprising the polypropylene modifier and a preparation method therefor are provided. The preparation method for the polypropylene modifier comprises: bringing a polar monomer grafted polypropylene into contact with a component A to carry out reactive extrusion and granulation, and then carrying out drying, wherein a polar monomer in the polar monomer grafted polypropylene is capable of chemically reacting with the component A; in formula (1), the polar monomer is selected from maleic anhydride, acrylic acid, and acrylate, etc; and the component A is selected from polyisocyanate, etc; and in formula (2), the polar monomer is selected from ditnethylaminoethyl methacrylate and epoxy acrylate, etc; and the component A is selected from polyisocyanate and polyethylene oxide, etc.
    Type: Application
    Filed: April 9, 2020
    Publication date: August 25, 2022
    Inventors: Fang YU, WenBin LIANG, Yi MA, GuoGang LIU, ChunBo ZHANG
  • Publication number: 20220256392
    Abstract: Embodiments of the present invention disclose a communication method and a device. The method includes: determining a first CU-UP and a UPF network element that correspond to a QoS flow, where an access network device to which the first CU-UP belongs supports at least two CU-UPs; determining a first PDB for transmitting the QoS flow between the first CU-UP and the UPF network element; and sending the first PDB to the access network device, where the first PDB is used by the access network device to schedule an air interface resource. In the embodiments of the present invention, after the CU-UP corresponding to the QoS flow is determined, the PDB of the CU-UP corresponding to the QoS flow may be sent to the RAN device.
    Type: Application
    Filed: April 28, 2022
    Publication date: August 11, 2022
    Inventors: Fang YU, Yan LI, Hui NI
  • Publication number: 20220246521
    Abstract: A package component, a semiconductor package and a manufacturing method thereof are provided. The package component for electrically coupling a semiconductor die includes a functional circuit structure and a seal ring structure embedded in an insulating layer. The semiconductor die disposed on the package component is electrically coupled to the functional circuit structure. The seal ring structure is electrically isolated from the functional circuit structure, the seal ring structure includes a stack of alternating interconnect layers and via patterns, the via pattern at each level of the stack includes first features spaced apart from one another and arranged at neighboring corners of the insulating layer, and the first features are offset lengthwise relative to each other to overlap therewith, and the first features are spaced apart widthwise relative to each other.
    Type: Application
    Filed: April 11, 2022
    Publication date: August 4, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fang-Yu Liang, Kai-Chiang Wu
  • Publication number: 20220230107
    Abstract: The present disclosure discloses a regional gridding cumulative environmental risk evaluation system and method based on a risk field, and belongs to the fields of environmental sciences and environmental risks. The cumulative environmental risk evaluation system comprises a data acquisition unit, a data storage unit, an evaluation analysis unit, and a risk visualization unit. The evaluation method includes: establishing a cumulative environmental risk index evaluation model based on a cumulative environmental risk field intensity index, a cumulative environmental risk control mechanism index, and a cumulative environmental risk receptor index, evaluating a cumulative environmental risk through the established model, and determining a grade of the cumulative environmental risk of the evaluation region.
    Type: Application
    Filed: January 11, 2021
    Publication date: July 21, 2022
    Inventors: Jun BI, Guozhi CAO, Xiafei ZHOU, Zongwei MA, Fang YU, Miaomiao LIU, Kunpeng WANG, Riyang LIU, Zesheng XU, Wenying ZHU
  • Publication number: 20220225211
    Abstract: This application provides example path switching methods, example communication apparatuses, and example communication systems. One example method includes obtaining, by a session management network element, a context of a first transport layer connection, where the first transport layer connection is between a source transport layer proxy network element and a terminal device. In response to determining that a protocol data unit (PDU) session anchor for the terminal device needs to be changed, the session management network element can send the context of the first transport layer connection to a target transport layer proxy network element, where the context is used to establish a third transport layer connection between the target transport layer proxy network element and the terminal device.
    Type: Application
    Filed: March 4, 2022
    Publication date: July 14, 2022
    Inventors: Fang YU, Yan LI
  • Publication number: 20220224566
    Abstract: An apparatus and method for terminating a virtual network function (VNF) instance according to termination requirements of the VNF instance. The termination requirements may be defined in a VNF descriptor corresponding to the VNF instance. A network function virtualization (NFV) management entity may obtain the termination requirements and initiate termination of the VNF instance based on the obtained termination requirements.
    Type: Application
    Filed: March 29, 2022
    Publication date: July 14, 2022
    Inventors: Fang YU, Zhixian Xiang
  • Patent number: 11374303
    Abstract: A package structure includes a semiconductor die, an insulating encapsulant, a redistribution layer and a plurality of antenna patterns. The semiconductor die has an active surface and a backside surface opposite to the active surface. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer is located on the active surface of the semiconductor die and over the insulating encapsulant. The plurality of antenna patterns is located over the semiconductor die, wherein the plurality of antenna patterns comprises a plurality of trenches located on a surface of the plurality of antenna patterns.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: June 28, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fang-Yu Liang, Chih-Chiang Tsao
  • Publication number: 20220182304
    Abstract: This application provides a communication method, wherein a user plane path between a terminal and a user plane gateway includes a first link and a second link, the first link is a link between the terminal and an access network device, and the second link is a link between the access network device and the user plane gateway. the method comprises: obtaining packet loss statuses of a service flow on the first link and the second link; determining a quantity of consecutive lost packets of the service flow on the user plane path based on the packet loss statuses of the service flow on the first link and the second link; and when the quantity of consecutive lost packets of the service flow on the user plane path reaches a first threshold, triggers enabling of a high-reliability transmission mechanism for the service flow.
    Type: Application
    Filed: February 25, 2022
    Publication date: June 9, 2022
    Inventors: Fang YU, Feng YU, Yan LI
  • Patent number: 11356889
    Abstract: A quality of service (QoS) parameter processing method and a system, where the method includes obtaining, by a control plane device, a core network (CN) packet delay budget (PDB) between a first access network device and a first user plane function device, sending, by the control plane device, the CN PDB to the first access network device, determining, by the first access network device, an access network (AN) PDB between a terminal device and the first access network device based on the CN PDB and an end-to-end PDB between the terminal device and the first user plane function device, and scheduling, by the first access network device, an air interface resource between the terminal device and the first access network device based on the AN PDB.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: June 7, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yexing Li, Yan Wang, Qi Su, Zhongping Chen, Fang Yu
  • Patent number: 11356888
    Abstract: A quality of service (QoS) parameter processing method and a system, where the method includes a session management function device obtaining a core network (CN) packet delay budget (PDB) between a first access network device and a first user plane function device, and sending the CN PDB to the first access network device via a context update response message, where the first access network device is a target access network device serving a terminal device after a handover. After receiving the CN PDB, the first access network device determines an access network (AN) PDB between the terminal device and the first access network device based on the CN PDB and an end-to-end PDB between the terminal device and the first user plane function device, and then schedules an air interface resource between the terminal device and the first access network device based on the AN PDB.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: June 7, 2022
    Assignee: HUAWEI TECHNOLGOIES CO., LTD.
    Inventors: Yexing Li, Yan Wang, Qi Su, Zhongping Chen, Fang Yu
  • Patent number: 11328677
    Abstract: A method and a device for driving a pixel circuit, and a storage medium are provided. When a current data voltage of a pixel circuit is within a first voltage range and a target data voltage of the pixel circuit is within a second voltage range, the driving method comprises: refreshing a data voltage stored in the pixel circuit with a boundary value between the first voltage range and the second voltage range using a gate signal reference voltage corresponding to the first voltage range; and refreshing the data voltage stored in the pixel circuit with the target data voltage using a gate signal reference voltage corresponding to the second voltage range.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: May 10, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shengji Yang, Xue Dong, Xiaochuan Chen, Hui Wang, Pengcheng Lu, Fang Yu, Wei Liu
  • Patent number: D958934
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: July 26, 2022
    Assignee: YE SIANG ENTERPRISE CO., LTD.
    Inventors: Ting-Fang Yu, Shih-Chieh Chuang, Shih-Hsien Chuang, Wei-Kuo Kong
  • Patent number: D958935
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: July 26, 2022
    Assignee: YE SIANG ENTERPRISE CO., LTD.
    Inventors: Ting-Fang Yu, Shih-Chieh Chuang, Shih-Hsien Chuang, Wei-Kuo Kong
  • Patent number: D959602
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: August 2, 2022
    Assignee: YE SIANG ENTERPRISE CO., LTD.
    Inventors: Ting-Fang Yu, Shih-Chieh Chuang, Shih-Hsien Chuang, Wei-Kuo Kong
  • Patent number: D963792
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: September 13, 2022
    Assignee: YE SIANG ENTERPRISE CO., LTD.
    Inventors: Ting-Fang Yu, Shih-Chieh Chuang, Shih-Hsien Chuang, Wei-Kuo Kong