Patents by Inventor Federico Giovanni Ziglioli

Federico Giovanni Ziglioli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140061892
    Abstract: A packaged device, wherein at least one sensitive portion of a chip is enclosed in a chamber formed by a package. The package has an air-permeable area having a plurality of holes and a liquid-repellent structure so as to enable passage of air between an external environment and the chamber and block the passage of liquids.
    Type: Application
    Filed: August 29, 2013
    Publication date: March 6, 2014
    Applicant: STMicroelectronics S.r.l.
    Inventors: Federico Giovanni Ziglioli, Fulvio Vittorio Fontana, Luca Maggi
  • Patent number: 8633583
    Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device and a package substrate core having an upper and a lower surface. At least one pair of metal layers coats the upper and lower surfaces of the package substrate core. One pair of solder mask layers coats the outer metal layers of the at least one pair of metal layers. A plurality of vias is formed across the package substrate core and the at least one pair of metal layers. Advantageously, the plurality of vias is substantially distributed according to a homogeneous pattern in an area that is to be covered by the damage-sensitive device. A method for the production of such semiconductor package substrate is also described.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: January 21, 2014
    Assignees: STMicroelectrics S.r.l., STMicroelectronics (Malta) Ltd.
    Inventors: Federico Giovanni Ziglioli, Giovanni Graziosi, Mark Andrew Shaw, Mario Francesco Cortese, Conrad Max Cachia
  • Publication number: 20130334675
    Abstract: An embodiment of a packaged semiconductor device includes a communication pad formed in a side surface, which is operatively coupled to a communication circuit so as to enable the establishing of a wireless communication channel to an adjacently positioned packaged semiconductor device. The communication pad may be formed upon cutting a block including the packaged semiconductor device and an appropriately positioned and dimensioned conductor. Thus, well-established techniques for incorporating a lead frame or any other conductive system in a package may be applied in order to impart wireless lateral connectivity to packaged semiconductor devices in an electronic system.
    Type: Application
    Filed: June 17, 2013
    Publication date: December 19, 2013
    Inventors: Federico Giovanni ZIGLIOLI, Alberto PAGANI
  • Publication number: 20130285056
    Abstract: A semiconductor structure includes at least a semiconductor body, a delimiting structure delimiting a cup-shaped recess in the body and a conductive region in the recess. The conductive region is made of a low-melting-temperature material, having a melting temperature lower than that of the materials forming the delimiting structure.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 31, 2013
    Applicant: STMicroelectronics S.r.I.
    Inventors: Alberto PAGANI, Federico Giovanni ZIGLIOLI
  • Publication number: 20130243143
    Abstract: An embodiment of an apparatus includes a reaction chamber, a reaction unit, and an energy regulator. The reaction chamber includes an energy port, and the reaction unit is disposed in the reaction chamber and is configured to allow an energy-releasing reaction between first and second materials. And the energy regulator is configured to control a rate at which reaction-released energy exits the reaction chamber via the energy port. The reaction chamber may include a thermally conductive wall that forms a portion of the energy port, and the energy regulator may include a thermally conductive member and a mechanism configured to control a distance between the thermally conductive wall and the thermally conductive member. Furthermore, the reaction unit may include a mechanism configured to facilitate the reaction between the first and second materials, and may also include a mechanism configured to control a rate at which the reaction releases energy.
    Type: Application
    Filed: February 25, 2013
    Publication date: September 19, 2013
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Ubaldo MASTROMATTEO, Federico Giovanni ZIGLIOLI
  • Patent number: 8499613
    Abstract: A cartridge-like chemical sensor is formed by a housing having a base and a cover fixed to the base and provided with an input opening, an output hole and a channel for a gas to be analyzed. The channel extends in the cover between the input opening and the output hole and faces a printed circuit board carrying an integrated circuit having a sensitive region open toward the channel and of a material capable to bind with target chemicals in the gas to be analyzed. A fan is arranged in the housing, downstream of the integrated device, for sucking the gas after being analyzed, and is part of a thermal control system for the integrated circuit.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: August 6, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventors: Federico Giovanni Ziglioli, Amedeo Maierna, Flavio Francesco Villa, Ubaldo Mastromatteo, Gabriele Barlocchi
  • Patent number: 8324007
    Abstract: A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: December 4, 2012
    Assignee: STMicroelectronics S.r.l.
    Inventors: Federico Giovanni Ziglioli, Mark Andrew Shaw
  • Publication number: 20120286381
    Abstract: An electronic MEMS device is formed by a chip having with a main face and bonded to a support via an adhesive layer. A cavity extends inside the chip from its main face and is closed by a flexible film covering the main face of the chip at least in the area of the cavity. The support has a depressed portion facing the cavity and delimited by a protruding portion facing the main face of the chip. Inside the depressed portion, the adhesive layer has a greater thickness than the projecting portion so as to be able to absorb any swelling of the flexible film as a result of the expansion of the gas contained inside the cavity during thermal processes.
    Type: Application
    Filed: May 9, 2012
    Publication date: November 15, 2012
    Applicant: STMICROELECTRONICS S.R.L.
    Inventor: Federico Giovanni Ziglioli
  • Publication number: 20120132817
    Abstract: An embodiment of a photomultiplier device is formed by a base substrate of insulating organic material forming a plurality of conductive paths and carrying a plurality of chips of semiconductor material. Each chip integrates a plurality of photon detecting elements, such as Geiger-mode avalanche diodes, and is bonded on a first side of the base substrate. Couplings for photon-counting and image-reconstruction units are formed on a second side of the base substrate. The first side of the base substrate is covered with a transparent encapsulating layer of silicone resin, which, together with the base substrate, bestows stiffness on the photomultiplier device, preventing warpage, and covers and protects the chips.
    Type: Application
    Filed: November 23, 2011
    Publication date: May 31, 2012
    Applicant: STMicroelectronics S.r.I.
    Inventors: Mark Andrew SHAW, Federico Giovanni ZIGLIOLI
  • Publication number: 20110318840
    Abstract: A fluidic cartridge for detecting chemicals, formed by a casing, hermetically housing an integrated device having a plurality of detecting regions to bind with target chemicals; part of a supporting element, bearing the integrated device; a reaction chamber, facing the detecting regions; a sample feeding hole and a washing feeding hole, self-sealingly closed; fluidic paths, which connect the sample feeding and washing feeding holes to the reaction chamber; and a waste reservoir, which may be fluidically connected to the reaction chamber by valve elements that may be controlled from outside. The integrated device is moreover connected to an interface unit carried by the supporting element, electrically connected to the integrated device and including at least one signal processing stage and external contact regions.
    Type: Application
    Filed: June 27, 2011
    Publication date: December 29, 2011
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Federico Giovanni Ziglioli, Amedeo Maierna, Ubaldo Mastromatteo, Gabriele Barlocchi, Flavio Francesco Villa
  • Patent number: 8049287
    Abstract: A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: November 1, 2011
    Assignee: STMicroelectronics S.r.l.
    Inventors: Chantal Combi, Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra, Caterina Riva
  • Publication number: 20110209524
    Abstract: A cartridge-like chemical sensor is formed by a housing having a base and a cover fixed to the base and provided with an input opening, an output hole and a channel for a gas to be analyzed. The channel extends in the cover between the input opening and the output hole and faces a printed circuit board carrying an integrated circuit having a sensitive region open toward the channel and of a material capable to bind with target chemicals in the gas to be analyzed. A fan is arranged in the housing, downstream of the integrated device, for sucking the gas after being analyzed, and is part of a thermal control system for the integrated circuit.
    Type: Application
    Filed: January 28, 2011
    Publication date: September 1, 2011
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Federico Giovanni Ziglioli, Amedeo Maierna, Flavio Francesco Villa, Ubaldo Mastromatteo, Gabriele Barlocchi
  • Patent number: 7998774
    Abstract: A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated sensitive to the chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the passing opening. A protective package incorporates the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device exposed through the passing opening of the substrate.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: August 16, 2011
    Assignee: STMicroelectronics S.r.l.
    Inventors: Federico Giovanni Ziglioli, Fulvio Vittorio Fontana, Mark Shaw
  • Publication number: 20110092009
    Abstract: A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated sensitive to the chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the passing opening. A protective package incorporates the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device exposed through the passing opening of the substrate.
    Type: Application
    Filed: December 30, 2010
    Publication date: April 21, 2011
    Applicant: STMicroelectronics S.r.I.
    Inventors: Federico Giovanni Ziglioli, Fulvio Vittorio Fontana, Mark Shaw
  • Patent number: 7898043
    Abstract: A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated sensitive to the chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the passing opening. A protective package incorporates the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device exposed through the passing opening of the substrate.
    Type: Grant
    Filed: January 4, 2008
    Date of Patent: March 1, 2011
    Assignee: STMicroelectronics, S.r.l.
    Inventors: Federico Giovanni Ziglioli, Fulvio Vittorio Fontana, Mark Shaw
  • Publication number: 20100297797
    Abstract: A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing.
    Type: Application
    Filed: August 2, 2010
    Publication date: November 25, 2010
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Federico Giovanni Ziglioli, Mark Andrew Shaw
  • Publication number: 20100165581
    Abstract: An embodiment of a package for Micro-Electro-Mechanical Systems of the MEMS type comprising a base for the assembly of said MEMS and a protective envelope, for containing the MEMS. The base is a multi-layer structure with at least one layer of composite material to make a substrate and at least one flexible wing projecting from the substrate, such base being a monolithic element suitable for being connected to external connection tracks.
    Type: Application
    Filed: December 22, 2009
    Publication date: July 1, 2010
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Federico Giovanni ZIGLIOLI, Mark Andrew SHAW
  • Publication number: 20090115008
    Abstract: A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing.
    Type: Application
    Filed: October 29, 2008
    Publication date: May 7, 2009
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Federico Giovanni Ziglioli, Mark Andrew Shaw
  • Publication number: 20080315333
    Abstract: A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidically isolated from the first empty space, is provided over the respective membrane of the further integrated device.
    Type: Application
    Filed: April 14, 2008
    Publication date: December 25, 2008
    Applicant: STMicroelectronics S.r.l.
    Inventors: Chantal Combi, Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra, Caterina Riva
  • Patent number: 7421904
    Abstract: Described herein is an assembly of an integrated device and of a cap coupled to the integrated device; the integrated device is provided with at least a first and a second region to be fluidically accessed from outside, and the cap has an outer portion provided with at least a first and a second inlet port in fluid communication with the first and second regions. In particular, the first and second regions are arranged on a first outer face, or on respective adjacent outer faces, of the integrated device, and an interface structure is set between the integrated device and the outer portion of the cap, and is provided with a channel arrangement for routing the first and second regions towards the first and second inlets.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: September 9, 2008
    Assignee: STMicroelectronics S.r.l.
    Inventors: Federico Giovanni Ziglioli, Chantal Combi, Lorenzo Baldo, Caterina Riva, Mark Andrew Shaw