Abstract: An embodiment of a photomultiplier device is formed by a base substrate of insulating organic material forming a plurality of conductive paths and carrying a plurality of chips of semiconductor material. Each chip integrates a plurality of photon detecting elements, such as Geiger-mode avalanche diodes, and is bonded on a first side of the base substrate. Couplings for photon-counting and image-reconstruction units are formed on a second side of the base substrate. The first side of the base substrate is covered with a transparent encapsulating layer of silicone resin, which, together with the base substrate, bestows stiffness on the photomultiplier device, preventing warpage, and covers and protects the chips.

Abstract: A wafer-level package for a MEMS integrated device, envisages: a first body integrating a micromechanical structure; a second body having an active region integrating an electronic circuit, coupled to the micromechanical structure; and a third body defining a covering structure for the first body. The second body defines a base portion of the package and has an inner surface coupled to which is the first body, and an outer surface provided on which are electrical contacts towards the electronic circuit; a routing layer has an inner surface set in contact with the outer surface of the second body and an outer surface that carries electrical contact elements towards the external environment. The third body defines a covering portion for covering the package and is directly coupled to the second body for closing a housing space for the first body.

Abstract: A fluidic cartridge for detecting chemicals, formed by a casing, hermetically housing an integrated device having a plurality of detecting regions to bind with target chemicals; part of a supporting element, bearing the integrated device; a reaction chamber, facing the detecting regions; a sample feeding hole and a washing feeding hole, self-sealingly closed; fluidic paths, which connect the sample feeding and washing feeding holes to the reaction chamber; and a waste reservoir, which may be fluidically connected to the reaction chamber by valve elements that may be controlled from outside. The integrated device is moreover connected to an interface unit carried by the supporting element, electrically connected to the integrated device and including at least one signal processing stage and external contact regions.

Abstract: A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50.

Abstract: A packaged semiconductor device includes a communication pad formed in a side surface, which is operatively coupled to a communication circuit so as to enable the establishing of a wireless communication channel to an adjacently positioned packaged semiconductor device. The communication pad may be formed upon cutting a block including the packaged semiconductor device and an appropriately positioned and dimensioned conductor.

Abstract: An assembly of a MEMS integrated device envisages: a package having a base substrate with a main surface in a horizontal plane, and a coating set on the base substrate; a first body including semiconductor material and integrating a micromechanical structure, housed within the package on the base substrate; at least one second body including semiconductor material and integrating at least one electronic component, designed to be functionally coupled to the micromechanical structure, the first body and the second body being arranged within the package stacked in a vertical direction transverse to the horizontal plane. In particular, at least one between the first body and the base substrate defines a first recess, in which the second body is housed, at least in part.

Abstract: A package for a device to be inserted into a solid structure may include a building material that includes particles of one of micrometric and sub-micrometric dimensions. The device may include an integrated detection module having at least one integrated sensor and the package arranged to coat at least one portion of the device including the integrated detection module. A method aspect includes a method of manufacturing the device. A system aspect is for monitoring parameters in a solid structure that includes the device.

Abstract: A packaged device, wherein at least one sensitive portion of a chip is enclosed in a chamber formed by a package. The package has an air-permeable area having a plurality of holes and a liquid-repellent structure so as to enable passage of air between an external environment and the chamber and block the passage of liquids.

Abstract: An electronic MEMS device is formed by a chip having with a main face and bonded to a support via an adhesive layer. A cavity extends inside the chip from its main face and is closed by a flexible film covering the main face of the chip at least in the area of the cavity. The support has a depressed portion facing the cavity and delimited by a protruding portion facing the main face of the chip. Inside the depressed portion, the adhesive layer has a greater thickness than the projecting portion so as to be able to absorb any swelling of the flexible film as a result of the expansion of the gas contained inside the cavity during thermal processes.

Abstract: The integrated electronic device is for detecting a local parameter related to a force experienced in a predetermined direction within a solid structure. The device includes a semiconductor substrate having a substantially planar region that defines a plane substantially perpendicular to the predetermined direction. At least one sensor detects the local parameter at least in the predetermined direction with a piezo-resistive effect. At least one substantially planar face is arranged in a portion of the integrated electronic device, the face belonging to a inclined plane by a predetermined angle relative to the plane perpendicular to the predetermined direction, which plane is defined by the substantially planar region of the substrate. The predetermined angle is defined such as to reduce forces acting in directions other than the predetermined direction at the portion of the device around the at least one sensor.

Abstract: A planar electric circuit board may include a planar support of a foldable material defining a base surface and wings coupled to the base surface along respective folding lines so that the wings, when folded along the folding lines, are erected with respect to the base surface and remain in that position. An auxiliary circuit is on the planar support and may include pairs of capacitive coupling plates defined on the wings and on the base surface, and electric communication lines coupled to corresponding ones of the pairs of capacitive coupling plates.

Abstract: In order to manufacture a packaged device, a die having a sensitive region is bonded to a support, and a packaging mass of moldable material is molded on the support so as to surround the die. During molding of the packaging mass, a chamber is formed, which faces the sensitive region and is connected to the outside environment. To this end, a sacrificial mass of material that may evaporate/sublimate is dispensed on the sensitive region; the packaging mass is molded on the sacrificial mass; a through hole is formed in the packaging mass to extend as far as the sacrificial mass; the sacrificial mass is evaporated/sublimated through the hole.

Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.

Abstract: An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips.

Abstract: An assembly of a MEMS integrated device envisages: a package having a base substrate with a main surface in a horizontal plane, and a coating set on the base substrate; a first body including semiconductor material and integrating a micromechanical structure, housed within the package on the base substrate; at least one second body including semiconductor material and integrating at least one electronic component, designed to be functionally coupled to the micromechanical structure, the first body and the second body being arranged within the package stacked in a vertical direction transverse to the horizontal plane. In particular, at least one between the first body and the base substrate defines a first recess, in which the second body is housed, at least in part.

Abstract: A force sensor to measure a force from a load includes a plunger, a flexible disc-shaped membrane, a support plate and a silicon die. The plunger is configured to receive the force from the load, and has a ring-shaped groove at the lower surface. The membrane has a ring-shaped upper bump at the upper surface configured to complementarily fit into the groove at the lower surface of plunger and a ring-shaped lower bump at lower upper surface. The support plate has a ring-shaped groove for complementary fit into the lower bump on the lower surface of the membrane. The silicon die is centrally mounted on the membrane and comprises piezo-resistors with resistance that varies when deformed by the force. Force received by the plunger is transmitted to the membrane, causing the membrane to flex and bending or compressing of the silicon die, resulting in the measurement of the force.

Abstract: The integrated electronic device is for detecting a local parameter related to a force experienced in a predetermined direction within a solid structure. The device includes a semiconductor substrate having a substantially planar region that defines a plane substantially perpendicular to the predetermined direction. At least one sensor detects the local parameter at least in the predetermined direction with a piezo-resistive effect. At least one substantially planar face is arranged in a portion of the integrated electronic device, the face belonging to a inclined plane by a predetermined angle relative to the plane perpendicular to the predetermined direction, which plane is defined by the substantially planar region of the substrate. The predetermined angle is defined such as to reduce forces acting in directions other than the predetermined direction at the portion of the device around the at least one sensor.

Abstract: The integrated electronic device is for detecting a local parameter related to a force observed in a given direction, within a solid structure. The device includes at least one sensor configured to detect the above-mentioned local parameter at least in the given direction through piezo-resistive effect. At least one damping element, integrated in the device, is arranged within a frame-shaped region that is disposed around the at least one sensor and belongs to a substantially planar region comprising a plane passing through the sensor and perpendicular to the given direction. Such at least one damping element is configured to damp forces acting in the planar region and substantially perpendicular to the given direction.

Abstract: A planar electric circuit board may include a planar support of a foldable material defining a base surface and wings coupled to the base surface along respective folding lines so that the wings, when folded along the folding lines, are erected with respect to the base surface and remain in that position. An auxiliary circuit is on the planar support and may include pairs of capacitive coupling plates defined on the wings and on the base surface, and electric communication lines coupled to corresponding ones of the pairs of capacitive coupling plates.

Abstract: A wafer-level package for a MEMS integrated device, envisages: a first body integrating a micromechanical structure; a second body having an active region integrating an electronic circuit, coupled to the micromechanical structure; and a third body defining a covering structure for the first body. The second body defines a base portion of the package and has an inner surface coupled to which is the first body, and an outer surface provided on which are electrical contacts towards the electronic circuit; a routing layer has an inner surface set in contact with the outer surface of the second body and an outer surface that carries electrical contact elements towards the external environment. The third body defines a covering portion for covering the package and is directly coupled to the second body for closing a housing space for the first body.