Abstract: A method of conformally coating a capacitor with an epoxy layer of the present invention is used to coat the capacitor using fluidized bed techniques. The method includes the use of a chiller bar which is placed against the cathode surface of a capacitor slug which has been heated to 150.degree. C. The capacitor slug and chiller bar are then dipped into the fluidized bed of epoxy powder. The epoxy powder will melt to the capacitor slug on all surfaces except the surface in contact with the chiller bar. After removing the capacitor slug and chiller bar from the fluidized bed and separating the chiller bar from the capacitor, the capacitor will be coated with a layer of epoxy coating on all surfaces except the cathode surface.

Abstract: A bulk metal chip resistor includes an elongated resistor element having terminals at its opposite ends. The terminals are formed by coating the opposite ends of the resistor element with a conductive material. Insulative material may be molded around the center portion of the resistor to provide structural support, and the ends of the resistor can be bent downwardly so as to cause the central portion to be raised when the resistor is mounted on a circuit board. A modified form of the invention includes wrapping the resistance element around the ends of a rectangular substrate so that the substrate provides structural support. Another modified form includes placing four terminals at the four corners of the resistor element.

Abstract: A precision resistor exhibiting a temperature coefficient of resistance which is very low and which is virtually independent of time, and capable of accepting high power, comprises a resistive foil applied to a substrate by means of an appropriate cement, wherein the coefficient of thermal expansion of the substrate is either at zero or as close to zero as is possible, and wherein the resistivity versus temperature characteristic of the foil selected is adjusted so as to compensate for the thermal strain induced change in resistance which results when the temperature of the assembly changes, and the device is reacting to the application of power virtually without creating a transient phenomenon due to the flow of heat. Also a method for producing such a precision resistor.

Abstract: A precision resistor of the type formed by defining a resistive path in a thin foil of resistance material attached to a substrate. Metallic interface layers are deposited on terminal pads between which the resistive path extends, so that when solder-coated copper leads are spot-welded to the terminal pads, the junction between the copper leads and the terminal pads is both a spot-weld and a solder connection.

Abstract: A precision resistor using a resistance metal film etched into a long serpentine strip cemented to a substrate. This substrate is a composite of rigid materials and plastics. The composite thermal coefficient of expansion of the substrate is given a non-linearity which in turn induces a stress related non-linear resistance change in the cemented film when the temperature changes. This stress-induced non-linear change is of approximately the same shape as the inherent non-linearity of the resistance versus temperature of the metal film, but opposite in polarity, over a wide range of resistor operating temperatures. Over the range, a much closer approximation to complete temperature compensation is obtained than previously.

Abstract: A precision resistor using a resistance metal film etched into a long serpentine strip cemented to a substrate. This substrate is a composite of rigid materials and plastics. The composite thermal coefficient of expansion of the substrate is given a non-linearity which in turn induces a stress related non-linear resistance change in the cemented film when the temperature changes. This stress-induced non-linear change is of approximately the same shape as the inherent non-linearity of the resistance versus temperature of the metal film, but opposite in polarity, over a wide range of resistor operating temperatures. Over that range, a much closer approximation to complete temperature compensation is obtained than previously.