Patents by Inventor FEN LIU

FEN LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145685
    Abstract: This application provides an electrode sheet and an electrochemical device. The electrode sheet includes a current collector and a functional coating located on at least one surface of the current collector. The functional coating includes a first coating, a second coating and an active material layer that are sequentially stacked on a surface of the current collector. The first coating includes a conductive agent, a binder and a first functional filler, and the second coating includes a conductive agent, a binder and a second functional filler. A mass ratio of the binder in the first coating to the first coating is a1, a mass ratio of the binder in the second coating to the second coating is a2, and a mass ratio of the binder in the active material layer to the active material layer is a3, and a1>a2>a3.
    Type: Application
    Filed: December 28, 2023
    Publication date: May 2, 2024
    Inventors: Fan YANG, Yanyun ZHAI, Jian ZHANG, Kongyan XIE, Fen LIU, Jinshuai YANG, Chong PENG
  • Publication number: 20240133890
    Abstract: The present disclosure provides the use of BAZ1B_K426hy in the preparation of a product for tumor detection and belongs to the field of biotechnology. The present disclosure further provides a group of immunogenic polypeptides, including polypeptide A and polypeptide B. An anti-BAZ1B_K426hy polyclonal antibody is prepared by conducting mixed immunization on an animal with the immunogenic polypeptide. The polyclonal antibody can specifically recognize an endogenous protein BAZ1B_K426hy by enzyme-linked immunosorbent assay (ELISA)/Dot blot/Western blot, which is used for preparation of detection products for tumors and Williams syndrome.
    Type: Application
    Filed: April 13, 2023
    Publication date: April 25, 2024
    Applicants: Tangshan People's Hospital, North China University of Science and Technology, Tangshan Maternal And Child Health Hospital
    Inventors: Jingwu LI, Yufeng Li, Shuqing Wang, Jinghua Zhang, Jinghua Wu, Fen Hu, Yuan Yu, Yan Liu, Yuhui Li, Xuan Zheng
  • Patent number: 11966241
    Abstract: A circuit includes a voltage divider circuit configured to generate a feedback voltage according to an output voltage, an operational amplifier configured to output a driving signal according to the feedback voltage and a reference voltage and a pass gate circuit including multiple current paths. The current paths are controlled by the driving signal and connected in parallel between the voltage divider circuit and a power reference node.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huan-Neng Chen, Yen-Lin Liu, Chia-Wei Hsu, Jo-Yu Wu, Chang-Fen Hu, Shao-Yu Li, Bo-Ting Chen
  • Patent number: 11968427
    Abstract: This application provides a video message generation method and apparatus, an electronic device, and a storage medium. The video message generation method includes: receiving a comment instruction for a video; determining a target frame corresponding to the comment instruction in the video; obtaining input comment content of the target frame; and generating a video message based on the video, the target frame, and the comment content of the target frame.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: April 23, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Fen He, Xuejun Sun, Han Liu, Liqiang Liu, Yujun Liu
  • Patent number: 11945893
    Abstract: A curable composition can comprise a polymerizable material including a monomer of Formula (1), with R being H or alkyl or alkylaryl, n being 1-4, m being 0-6, X1 being C1-C6 substituted or unsubstituted alkyl, X2 being CH3 or H, After forming a cured layer of the curable composition, the cured layer can have an excellent etch resistance.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: April 2, 2024
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Fen Wan, Weijun Liu, Gary F. Doyle
  • Patent number: 11945966
    Abstract: A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material may comprise at least one first polymerizable monomer having a structure of Formula (1): (R1)x—Ar—(R2)y (1), with Ar being one or more substituted or unsubstituted aromatic rings; R1 being a structure covalently bonded to Ar including at least one acrylate group; x being 1-4; and R2 being —CH?CH2 or —CCH3=CH2 covalently bonded to Ar; y being 1-4.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: April 2, 2024
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Fen Wan, Weijun Liu
  • Publication number: 20240092197
    Abstract: A distributor includes: an outer housing; a direct current charging interface, an electronic control terminal interface, and a battery terminal interface disposed in the outer housing. A first contactor and a second contactor are connected between the electronic control terminal interface and the battery terminal interface. A third contactor and a pre-charge resistor form a pre-charge branch. A fourth contactor is connected between the direct current charging interface and the battery terminal interface; a fifth contactor is connected between a negative terminal of the direct current charging interface and a negative terminal of the battery terminal interface; and the five contactors and a pre-charge resistor are disposed in the outer housing.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Tuodi HUANG, Penghui XUE, Zunjie LI, Fen LIU, Chao LIU
  • Publication number: 20240084063
    Abstract: A solvent-free resin composition and uses thereof are provided. The resin composition includes: (A) a maleic acid-modified liquid hydrocarbon resin; (B) a first filler having a D50 particle size of 1 ?m to 4 ?m; and (C) a second filler having a D50 particle size of 5 ?m to 10 ?m. The solvent-free resin composition can be used to fill the holes of printed circuit boards.
    Type: Application
    Filed: October 24, 2022
    Publication date: March 14, 2024
    Inventors: Jui-Hsiang TANG, Shur-Fen LIU
  • Publication number: 20240084135
    Abstract: A resin composition and uses thereof are provided. The resin composition includes: (A) an epoxy resin; (B) a bismaleimide resin; and (C) a first flame retardant having a structure of formula (I): Wherein Ar is a C3 to C18 heteroaryl or a C6 to C18 aryl; R1 is H or a C1 to C18 alkyl; and R2 and R3 are independently H, a C1 to C18 alkyl, a C3 to C18 heteroaryl, or a C6 to C18 aryl.
    Type: Application
    Filed: December 7, 2022
    Publication date: March 14, 2024
    Inventors: Tsung-Hsien LIN, Shur-Fen LIU, Pin CHIEN, Kai-Cheng YANG
  • Patent number: 11923429
    Abstract: A semiconductor device and method for forming the semiconductor device are provided. In some embodiments, a semiconductor substrate comprises a device region. An isolation structure extends laterally in a closed path to demarcate the device region. A first source/drain region and a second source/drain region are in the device region and laterally spaced. A sidewall of the first source/drain region directly contacts the isolation structure at a first isolation structure sidewall, and remaining sidewalls of the first source/drain region are spaced from the isolation structure. A selectively-conductive channel is in the device region, and extends laterally from the first source/drain region to the second source/drain region. A plate comprises a central portion and a first peripheral portion. The central portion overlies the selectively-conductive channel, and the first peripheral portion protrudes from the central portion towards the first isolation structure sidewall.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chang Cheng, Fu-Yu Chu, Ming-Ta Lei, Ruey-Hsin Liu, Shih-Fen Huang
  • Patent number: 11916855
    Abstract: A file commenting method includes displaying file content in an instant messaging client, displaying comment content entered via a commenting operation performed on a portion of the file content, and displaying a session page when the commenting operation is completed, the session page including the portion of the file content, the comment content, and a file identifier corresponding to the file content.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: February 27, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Fen He, Xuejun Sun, Liqiang Liu, Dan He, Jinhui Chen
  • Publication number: 20240060135
    Abstract: The present invention provides therapeutic and diagnostic methods and compositions for cancer (e.g., bladder cancer (e.g., UC) or kidney cancer (e.g., RCC)). The invention provides methods of identifying an individual having a cancer who is likely to respond to treatment with an anti-cancer therapy comprising a PD-L1 axis binding antagonist, methods for selecting a therapy for an individual having a cancer, methods of identifying an individual having a cancer who is less likely to respond to treatment with an anti-cancer therapy comprising a PD-L1 axis binding antagonist monotherapy, methods of monitoring the response of an individual having a cancer to treatment with an anti-cancer therapy comprising a PD-L1 axis binding antagonist, and methods of treating an individual having cancer, based on expression levels of a biomarker of the invention (e.g., one or more genes set forth in any one of Tables 1-7, e.g., IL8).
    Type: Application
    Filed: September 30, 2022
    Publication date: February 22, 2024
    Inventors: Li-Fen LIU, Sanjeev MARIATHASAN, Chi Yung YUEN, Mahrukh HUSENI
  • Publication number: 20240000952
    Abstract: Disclosed herein are methods and kits for identifying responsiveness or non-responsiveness of a cancer subject to arginine deprivation therapy. The method includes determining the presence of a G/G genotype of rs13338697 of the target nucleic acid in a biological sample derived from the subject by use of a polymerase chain reaction (PCR)-based method, in which the presence of the G/G genotype of rs13338697 of the target nucleic acid is an indication that the subject is responsive to the arginine deprivation therapy.
    Type: Application
    Filed: April 14, 2022
    Publication date: January 4, 2024
    Inventors: Hung-Wen CHEN, Hui-Fen LIU, Chau-Ting YEH, Yu-De CHU, Chun-Hung CHOU
  • Publication number: 20240006618
    Abstract: A method for making a bi-metallic electrocatalyst produces a non-platinum group metal (non-PGM), bimetallic oxide crystalline catalyst showing low overpotential in both oxygen evolution reactions (OER) and oxygen reduction reactions (ORR) in a metal-air battery and/or fuel cell applications. The bimetallic oxide is formed to be in electrical communication with a catalyst support particle, and with the catalyst support particle, in turn, in electrical communication with an air-permeable electrode. A metal-air storage cell, optionally configured as part of a battery, includes a bi-metallic electrocatalyst. An electrical management system includes a metal-air storage cell.
    Type: Application
    Filed: July 13, 2023
    Publication date: January 4, 2024
    Inventor: Ru-Fen LIU
  • Patent number: 11856971
    Abstract: The invention discloses a method for improving immunity in shrimps, by administering an extract of cocoa rind to a shrimp body to improve immunity of the shrimp body. The extract of cocoa rind is obtained by extracting a dried sample of cocoa rind by an aqueous ethanol solution with a concentration of ethanol being 90-98%. The dried sample of cocoa rind has a water content of 2-5%.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: January 2, 2024
    Assignee: NATIONAL PINGTUNG UNIVERSITY OF SCIENCE & TECHNOLOGY
    Inventors: Wen-Teng Cheng, Wan-Lin Tsai, Hsin-Wei Kuo, Yu-Fen Liu, Chin-Chyuan Chang, Yu-Hung Lin
  • Patent number: 11840047
    Abstract: A metal-clad laminate, a printed circuit board using the same and a method for manufacturing the metal-clad laminate. The metal-clad laminate comprises: a first dielectric layer, comprising a first dielectric material and not comprising a reinforcing fabric, the first dielectric material comprising 20 wt % to 60 wt % of a first fluoropolymer and 40 wt % to 80 wt % of a first filler; a second dielectric layer disposed on one side of the first dielectric layer and comprising a reinforcing fabric and a second dielectric material formed on the surface of the reinforcing fabric, wherein the thickness of the reinforcing fabric is not higher than 65 ?m and the second dielectric material comprises 55 wt % to 100 wt % of a second fluoropolymer and 0 to 45 wt % of a second filler; and a metal foil disposed on the other side of the second dielectric layer that is opposite to the first dielectric layer.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: December 12, 2023
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Shi-Ing Huang, Shur-Fen Liu, Kai-Hsiang Lin
  • Patent number: 11818838
    Abstract: A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: November 14, 2023
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Wen-Ren Chen, Shi-Ing Huang, Shur-Fen Liu
  • Patent number: D1011483
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: January 16, 2024
    Assignee: AS America, Inc.
    Inventors: Emilie Williams, Jian Zhang, Fen Liu
  • Patent number: D1018787
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: March 19, 2024
    Assignee: AS America, Inc.
    Inventors: Emilie Williams, Jian Zhang, Fen Liu
  • Patent number: D1018790
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: March 19, 2024
    Assignee: AS America, Inc.
    Inventors: Emilie Williams, Jian Zhang, Fen Liu