Abstract: A resin composition is provided.

Abstract: A prepreg is provided. The prepreg is prepared by impregnating a liquid crystal polymer non-woven fabric with a thermal-curable resin composition or by coating a thermal-curable resin composition onto a liquid crystal polymer non-woven fabric and drying the impregnated or coated liquid crystal polymer non-woven fabric, wherein the thermal-curable resin composition includes: (A) an unsaturated monomer; and (B) a cyclic olefin copolymer including the following repeating units: (B-1) a repeating unit of formula (I), (B-2) a repeating unit of formula (II), and (B-3) a repeating unit of formula (III), R1 to R22, m, n, o, and p in formulas (I) to (III) are as defined in the specification, wherein based on the total moles of the repeating units (B-1) to (B-3), the content of the repeating unit (B-2) is 19 mol % to 36 mol %, and wherein the weight ratio of the cyclic olefin copolymer (B) to the unsaturated monomer (A) is 0.5 to 7.

Abstract: A fluororesin composition is provided. The fluororesin composition comprises the following constituents: (A) a first fluororesin, which is polytetrafluoroethylene (PTFE) resin; (B) a first filler, which is a flat glass fiber; and (C) particles of a second fluororesin, which are coated with polysiloxane, wherein, the particle size of the polysiloxane-coated particles of second fluororesin ranges from 0.2 ?m to 80 ?m, and the melting point of the second fluororesin is lower than the melting point of the first fluororesin.

Abstract: A method and system for constructing a transverse topological relationship and a memory are provided. In the method, lane group data in a high-definition map is acquired; for each lane group, a shared boundary line group of two adjacent lanes is sequentially extracted, and the number of parallel boundary line elements is determined; if the number is 1, a transverse topological relationship between the two adjacent lanes is not generated, otherwise the number and types of boundary line units on the parallel boundary line elements are determined; and if the number of the boundary line units is 1, the transverse topological relationship between the two adjacent lanes is generated, otherwise segmentation processing is performed on the lane group along a lane direction, and the transverse topological relationship between two adjacent lanes in each of segments, which are obtained by the segmentation processing on the lane group, is sequentially generated.

Abstract: A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), wherein R1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.

Abstract: This application discloses methods and compositions for use in treating cancer, including breast cancer (such as metastatic triple negative breast cancer, mTNBC), urothelial carcinoma, renal cell carcinoma, and liver cancer (hepatocellular carcinoma, HCC) with the combination of a PD-1 axis binding antagonist (e.g., a PD-L1 binding antibody such as atezolizumab) and an IL6 antagonist (e.g. an anti-IL6 receptor antibody such as tocilizumab), optionally further comprising a VEGF antagonist (e.g. an anti-VEGF antibody such as bevacizumab). Optionally, the patient has C-reactive protein (CRP) and/or IL-6 level(s) above the upper limit of normal. Optionally, the cancer is PD-L1 positive.

Abstract: Provided is a recombinant KOD polymerase, which is the following A) or B): the polymerase shown in A) is a protein having DNA polymerase activity that is obtained by modifying amino acid residues in at least one of the following 18 positions in a wild-type KOD DNA polymerase amino acid sequence: 675th, 385th, 710th, 674th, 735th, 736th, 606th, 709th, 347th, 349th, 590th, 676th, 389th, 589th, 680th, 384th, 496th and 383rd; the polymerase described by B) is a protein having DNA polymerase activity that is derived from A) by adding a tag sequence to an end of the amino acid sequence of the protein shown in A).

Abstract: A halogen-free low dielectric resin composition is provided.

Abstract: A resin composition and uses of the same are provided. The resin composition includes the following components: (A) a cross-linking agent of the following formula (I): (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, R1 in formula (I) is a C6 to C16 alkyl or a C6 to C16 alkenyl, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.

Abstract: A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I): in formula (I), t is an integer ranging from 2 to 6, wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.

Abstract: A metal-clad laminate, a printed circuit board using the same and a method for manufacturing the metal-clad laminate. The metal-clad laminate comprises: a first dielectric layer, comprising a first dielectric material and not comprising a reinforcing fabric, the first dielectric material comprising 20 wt % to 60 wt % of a first fluoropolymer and 40 wt % to 80 wt % of a first filler; a second dielectric layer disposed on one side of the first dielectric layer and comprising a reinforcing fabric and a second dielectric material formed on the surface of the reinforcing fabric, wherein the thickness of the reinforcing fabric is not higher than 65 ?m and the second dielectric material comprises 55 wt % to 100 wt % of a second fluoropolymer and 0 to 45 wt % of a second filler; and a metal foil disposed on the other side of the second dielectric layer that is opposite to the first dielectric layer.

Abstract: Disclosed in the present disclosure is a recombinant DNA polymerase. The recombinant DNA polymerase is any one selected from: A) a protein, having amino acid modifications at positions 408, 409 and 485, and at least one of amino acid modification(s) at positions 53, 59, 199, 243, 526, 558, 613, 641, 671, 673, 674, 692 and 709 compared to the amino acid sequence of a wild-type KOD DNA polymerase; B) a protein derived from the protein in A), formed by deleting amino acids 1 to 29 from a C-terminus of the protein in A) and keeping the remaining amino acids unchanged; and C) a protein derived from the protein in A) or B), formed by connecting a tag to the N-terminus or C-terminus of the amino acid sequence of the protein in A) or B), wherein the protein in A), B) and C) has DNA polymerase activity.

Abstract: A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.

Abstract: A resin composition and uses of the same are provided. The resin composition includes the following components: (A) a cross-linking agent of the following formula (I): (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, R1 in formula (I) is a C6 to C16 alkyl or a C6 to C16 alkenyl, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.

Abstract: A solvent-free resin composition is provided. The solvent-free resin composition includes: (A) an epoxy resin component, including at least two multi-functional epoxy resins, each of which has at least three epoxy groups in a molecule; (B) an epoxy resin hardener; and (C) inorganic fillers, including a hollow filler and a non-hollow spherical filler, wherein the weight ratio of the hollow filler to the non-hollow spherical filler is from 1:5 to 6:1.