Abstract: A laminate can comprise a substrate, an adhesion promoter layer, and a coating layer, wherein the adhesion promoter layer may include a silane compound of formula (1): Xm—Si—Yn (1), wherein X is at least one of OR, NR2, or SR, or a combination thereof, with R being substituted or unsubstituted alkyl or aryl; Y is CH?CH2 or L-CH?CH2, with L being phenyl or C1-C5 alkyl; m is 1-3, n is 1-3, with m+n=4. The adhesion promoter layer can provide strong adhesion of the coating layer to the substrate by forming covalent bonds with the substrate and covalent bonds with the coating layer.

Abstract: A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material may comprise at least one silicon-containing monomer having a structure of formula (1) with R1, R2: —O—Si(CH3)3, alkyl, aryl, or alkylaryl; R3, R4: —O—Si(CH3)3, alkyl, aryl, or alkylaryl; R5: C1-C5-alkyl, aryl, alkylaryl; R6: —R5-X, or X, or —O—Si(CH3)3, or alkyl, or aryl, or alkylaryl; X: acrylate or methacrylate; and n: 0-4. The amount of silicon (Si) in the photocurable composition can be at least 15 wt % based on the total weight of the photocurable composition.

Abstract: A laminate can comprise a substrate, an adhesion promoter layer, and a coating layer, wherein the adhesion promoter layer may include a silane compound of formula (1): Xm—Si—Yn (1), wherein X is at least one of OR, NR2, or SR, or a combination thereof, with R being substituted or unsubstituted alkyl or aryl; Y is CH?CH2 or L-CH?CH2, with L being phenyl or C1-C5alkyl; m is 1-3, n is 1-3, with m+n=4. The adhesion promoter layer can provide strong adhesion of the coating layer to the substrate by forming covalent bonds with the substrate and covalent bonds with the coating layer.

Abstract: A curable composition can comprise a first a reactive acrylate polymer being essentially free of fluorine, a reactive polysilsesquioxane, and a solvent, wherein the reactive polysilsesquioxane comprises hydroxyl groups and structure-units of formula (1) wherein X is alkyl, or aryl, or arylalkyl, or fluorine-containing alkyl, or any combination thereof. The viscosity of the curable composition can be not greater than 50 mPa·s; a ratio of acrylate polymer to the polysilsesquioxane is at least 2:1 and not greater than 20:1; and a cured layer of the curable composition may have a water contact angle of least 75 degrees. The curable composition is suitable for making a coated superstrate, wherein the coated superstrate has excellent hydrophobic and oleophobic properties.

Abstract: A photocurable composition can comprise a polymerizable material, a non-fluorine-containing release agent, and a photoinitiator, wherein the polymerizable material may comprise at least one silicon-containing monomer having a structure of formula (1) with R1, R2: —O—Si(CH3)3, or alkyl, or aryl, or alkylaryl; R3, R4: —O—Si(CH3)3, alkyl, or aryl, or alkylaryl; R5: C1-C5-alkyl, or aryl, or alkylaryl; R6: —R5-X, or X, or —O—Si(CH3)3, or alkyl, or aryl, or alkylaryl; X: acrylate or methacrylate; and n: 0-4. The amount of silicon (Si) in the photocurable composition can be at least 15 wt % based on the total weight of the polymerizable material, and the non-fluorine-containing release agent may be an acetylenic diol. The photocurable composition can have a high stability with a stability factor of at least 14.

Abstract: A photocurable composition can comprising a polymerizable material and at least one photoinitiator, wherein the polymerizable material can comprise at least one first monomer and at least one second monomer, the at least one first monomer including a multi-functional fluorine-containing monomer and the at least one second monomer being essentially free of fluorine; the polymerizable material comprises fluorine in an amount of at least 30 wt % based on the total weight of the polymerizable material; and a viscosity of the photocurable composition is not greater than 30 mPa·s at 23° C. The photocurable composition is suitable for forming an imprint lithography template comprising a backing layer and a patterned layer, wherein that patterned layer may have a reduced modulus of at least 1 GPa and a water contact angle of at least 70°.

Abstract: A photocurable composition can comprise a polymerizable material, an anti-blocking agent, and a photoinitiator, wherein the polymerizable material can consist essentially of at least one multi-functional aromatic vinyl monomer; the anti-blocking agent may have a structure of formula (1) or formula (2): wherein m is 8-15, n is 7-15, o is 8-20; X is aryl or CH2, and R1 is H or C1-C10-alkyl; and a viscosity of the photocurable composition is not greater than 50 mPa·s at 23° C. The photocurable composition can have a low contact angle to a silicon substrate of not greater than 25 degrees; and a low release force may be required to remove a superstrate after subjecting the photocurable composition to photo-curing.

Abstract: A photocurable composition can comprise a polymerizable material, at least one non-reactive polymer, and a photoinitiator, wherein the non-reactive polymer can have a carbon content of at least 80% based on the total weight of the non-reactive polymer; a molecular weight of the at least one non-reactive polymer can be at least 750 g/mol and not greater than 20,000 g/mol; an amount of the non-reactive polymer may be at least 10 wt % and not greater than 30 wt %; and a viscosity of the photocurable composition may be not greater than 110 mPa·s. The photocurable composition may have a low linear shrinkage after curing, a high carbon content and high etch resistance and being suitable for AIP or NIL processing.

Abstract: A photocurable composition can comprise comprising a polymerizable material, a photoinitiator, and a photoacid generator, wherein the polymerizable material comprises at least one multi-functional vinylbenzene monomer in an amount of at least 10 wt % based on the total weight of the polymerizable material and the photoinitiator includes an oxime ester compound. The photocurable composition can be suitable for inkjet adaptive planarization (IAP) processing and the forming of photo-cured layers having a high thermal stability and low thermal shrinkage.

Abstract: A curable composition can comprise a first alkyl-acrylate polymer (AAP1) consisting essentially of the elements carbon, hydrogen, and oxygen; a second alkyl-acrylate polymer (AAP2) consisting essentially of the elements carbon, hydrogen, oxygen, and fluorine; a thermal acid generator; and a solvent, wherein a weight percent ratio of AAP1 to AAP2 is at least 2:1. The curable composition can be used for coating a superstrate blank to form a coated superstrate having excellent hydrophobic surface properties.

Abstract: A curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c), wherein the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C., a content of the solvent (d) with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent (d) at normal pressure is less than 250° C., and the polymerizable compound (a) contains a compound (a-1) containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.

Abstract: A phthalonitrile monomer can have a structure of formula (1): (R2)n—X—(R1)m (1), wherein X is a substituted or unsubstituted aryl or aryl-alkyl; R1 R2 is —CH?CH2; n is 1 to 4; and m is 1-4. A curable composition can comprise a polymerizable material, wherein the polymerizable material may include the phthalonitrile monomer of formula (1).

Abstract: A photocurable composition can comprise a polymerizable material, and a photoinitiator, wherein the polymerizable material can comprise at least one polymerizable monomer and at least one reactive polymer. The reactive polymer can have a carbon content of at least 75% based on the total weight of the reactive polymer; a molecular weight of the at least one reactive polymer can be at least 400 g/mol and not greater than 50,000 g/mol; an amount of the reactive polymer may be at least 5 wt %; and a viscosity of the photocurable composition may be not greater than 100 mPa s. The photocurable composition may have a low linear shrinkage after curing, a high carbon content and high etch resistance and being suitable for AIP or NIL processing.

Abstract: A curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c), wherein the curable composition has viscosity of not less than 2 mPas and not more than 60 mPa·s at 23° C., a content of the solvent (d) with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent (d) at normal pressure is less than 250° C., and the polymerizable compound (a) contains a compound (a-1) containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.

Abstract: An object is to provide a photo-curable composition having high dry etching resistance and high thermal stability. A photo-curable composition includes at least a polymerizable compound and a photopolymerization initiator, and further includes at least one of a flame retarder and a flame-retardant polymerizable compound.

Abstract: A system can include a heating means for heating a photocurable composition over a substrate; an actinic radiation source configured to emit actinic radiation at a wavelength less than 700 nm; and a controller configured to determine a targeted temperature to be produced by the first heating means to achieve a photocuring temperature of the photocurable composition when the photocurable composition is exposed by the actinic radiation source, wherein the photocuring temperature is greater than an ambient temperature. A method can include dispensing the photocurable composition over a substrate; photocuring a layer of the photocurable composition at a photocuring temperature higher than ambient temperature to form a cured layer; and baking the cured layer to form a baked layer. The system and method can allow a thickness change of layer to be 0% or closer to 0%.

Abstract: A photocurable composition can comprise a polymerizable material, an organic ionic compound and a photoinitiator, wherein an amount of the organic ionic compound may be not greater than 1.5 wt %, the organic ionic compound comprises an organic cation, and a conductivity of the photocurable composition can be at least 20 ?S/cm. The photocurable composition can have an improved drop spreading and merging of drops in comparison to the same composition but not including the organic ionic compound.

Abstract: A photocurable composition can comprising a polymerizable material, a hindered stabilizer, and a photoinitiator, wherein the polymerizable material comprises at least one multi-functional aromatic vinyl monomer; and the hindered stabilizer is a hindered amine of formula (1) or a hindered phenol of formula (2) wherein X is H, CH3, or Y—Z; Y is CH2, O, S, or N; Z is an organic substituent; R1 is H, CH3, OH, OR5, CO—CH3, or C(?O)R5; R2, R3, R4, R5 is an organic substituent.

Abstract: A superstrate can comprise a superstrate blank and a coating overlying an outer surface of the superstrate blank. The superstrate blank can comprises a central region and a tapered edge region, wherein the tapered edge region has an average taper angle of not greater than 20 degrees relative to a length direction of the superstrate blank. In one embodiment, the coating of the superstrate can be applied by spin coating and may have an edge bead below a plane of the coating surface within the central region.

Abstract: A photocurable composition can comprise a polymerizable material, an evaporative diluent, and a photoinitiator, wherein the polymerizable material can comprise at least one first polymerizable monomer having a boiling point at 1 atm of at least 250° C. in an amount of at least 80 wt %; the evaporative diluent can have a boiling point at 1 atm of not greater than 200° C.; an amount of the evaporative diluent can be at least 5 wt % and not greater than 40 wt %; a vapor pressure of the evaporative diluent can be at least five times greater than a vapor pressure of the at least one polymerizable monomer; a difference in a surface tension of the evaporative diluent to a surface tension of the photocurable composition can be not greater than 5 mN/m; and a viscosity of the photocurable composition may be not greater than 20 mPa·s.