Abstract: A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material may comprise at least one first polymerizable monomer having a structure of Formula (1): (R1)x—Ar—(R2)y (1), with Ar being one or more substituted or unsubstituted aromatic rings; R1 being a structure covalently bonded to Ar including at least one acrylate group; x being 1-4; and R2 being —CH?CH2 or —CCH3=CH2 covalently bonded to Ar; y being 1-4.

Abstract: A curable composition can comprise a polymerizable material including a monomer of Formula (1), with R being H or alkyl or alkylaryl, n being 1-4, m being 0-6, X1 being C1-C6 substituted or unsubstituted alkyl, X2 being CH3 or H, After forming a cured layer of the curable composition, the cured layer can have an excellent etch resistance.

Abstract: An object is to provide a photo-curable composition having high dry etching resistance and high thermal stability. A photo-curable composition includes at least a polymerizable compound and a photopolymerization initiator, and further includes at least one of a flame retarder and a flame-retardant polymerizable compound.

Abstract: A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material can comprise at least one multi-functional acrylate monomer in an amount of at least 75 wt % based on the total weight of the polymerizable material and at least one mono-functional monomer in an amount of at least 5 wt % based on the total weight of the polymerizable material. The at least one mono-functional monomer can have a ring parameter of at least 0.5, and a total carbon content of the photocurable composition after curing may be at least 69%. The photocurable composition may have a low thermal shrinkage after curing, a high etch resistance and be suitable for AIP or NIL processing.

Abstract: An object is to provide a photo-curable composition having high dry etching resistance and high thermal stability. A photo-curable composition includes at least a polymerizable compound (A) and a photopolymerization initiator (B), and further includes at least one of a flame retarder (E) and a flame-retardant polymerizable compound (F).

Abstract: A photocurable composition can comprise a polymerizable material and at least one photoinitiator, wherein the polymerizable material comprises a multi-functional vinylbenzene monomer in an amount of at least 30 wt % based on the total weight of the polymerizable material and the at least one photoinitiator includes an oxime ester compound. The photocurable composition can be adapted that a UV shrinkage after forming a photo-cured layer at 23° C. is not greater than 4.0%; and that a thermal shrinkage after conducting a baking treatment of the photo-cured layer at 350° C. is not greater than 3.5%.

Abstract: In one embodiment, a photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material includes an isocyanate group containing compound of formula (1): R1-R2-N?C?O (1), with R1 including a carbon-carbon double bond, and R2 being substituted or unsubstituted alkyl, aryl, or alkylaryl. An amount of 1 wt % to 10 wt % of the isocyanate group containing compound can cause a strong adhesion strength of the photocurable composition to a silicon substrate after curing, and may allow the omission of an adhesion layer between substrate and the photo-cured layer.

Abstract: A photocurable composition can comprise a polymerizable material, and a photoinitiator, wherein the polymerizable material can comprise at least one polymerizable monomer and at least one reactive polymer. The reactive polymer can have a carbon content of at least 75% based on the total weight of the reactive polymer; a molecular weight of the at least one reactive polymer can be at least 400 g/mol and not greater than 50,000 g/mol; an amount of the reactive polymer may be at least 5 wt %; and a viscosity of the photocurable composition may be not greater than 100 mPa·s. The photocurable composition may have a low linear shrinkage after curing, a high carbon content and high etch resistance and being suitable for AIP or NIL processing.

Abstract: A photocurable composition can comprise a polymerizable material, at least one non-reactive polymer, and a photoinitiator, wherein the non-reactive polymer can have a carbon content of at least 80% based on the total weight of the non-reactive polymer; a molecular weight of the at least one non-reactive polymer can be at least 750 g/mol and not greater than 20,000 g/mol; an amount of the non-reactive polymer may be at least 10 wt % and not greater than 30 wt %; and a viscosity of the photocurable composition may be not greater than 110 mPa·s. The photocurable composition may have a low linear shrinkage after curing, a high carbon content and high etch resistance and being suitable for AIP or NIL processing.

Abstract: A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material can comprise a first polymerizable monomer having a structure of Formula (1) or Formula (2): with X being C1-C4-alkyl or oxygen (O); n being 0 or 1 Y1, Y2 being with R3 or, with R3 being H or methyl, wherein Y1 and Y2 may be the same or different and an amount of Y1 and Y2 per benzene ring being 1, 2, or 3; R1, R2 being substituted or unsubstituted alkyl or aryl, and an amount of each of R1 and R2 per benzene ring being 0, 1, 2, 3, or 4.

Abstract: A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material may comprise at least one first polymerizable monomer having a structure of Formula (1): (R1)x—Ar—(R2)y (1), with Ar being one or more substituted or unsubstituted aromatic rings; R1 being a structure covalently bonded to Ar including at least one acrylate group; x being 1-4; and R2 being —CH?CH2 or —CCH3=CH2 covalently bonded to Ar; y being 1-4.

Abstract: A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material can comprise at least one acrylate monomer including at least one cyano group (CN-acrylate monomer). The presence of a low amount of the CN-acrylate monomer between 10 wt % and not greater than 30 wt % can lower the contact angle of the composition and may improve the etch resistance of a photo-cured layer made from the photocurable composition.

Abstract: A photocurable composition can comprise a polymerizable material, a fullerene or fullerene derivative in an amount of at least 0.2 wt % and not greater than 5.0 wt %, and a photoinitiator and may be adapted for AIP or NIL processing. A photo-cured layer made from the photocurable composition can have an improved thermal stability in comparison to a photo-cured layer made from the same photocurable composition except not containing a fullerene or fullerene derivative.

Abstract: A curable composition comprises at least 10 wt % expanding monomers based on a total weight of the curable composition, at least 25 wt % acrylate monomers based on the total weight of the curable composition, a photoinitiator, and a photosensitizer. The acrylate monomers have a molecular weight of 500 or less. The curable composition has a viscosity of 10 cP or less. A total amount of the expanding monomers and the acrylate monomers are at least 90 wt % based on the total weight of the curable composition.

Abstract: In one embodiment, a photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material includes an isocyanate group containing compound of formula (1): R1-R2-N?C?O (1), with R1 including a carbon-carbon double bond, and R2 being substituted or unsubstituted alkyl, aryl, or alkylaryl. An amount of 1 wt % to 10 wt % of the isocyanate group containing compound can cause a strong adhesion strength of the photocurable composition to a silicon substrate after curing, and may allow the omission of an adhesion layer between substrate and the photo-cured layer.

Abstract: A photocurable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise at least one multi-functional vinylbenzene in an amount of 15 wt % to 85 wt % and at least one multi-functional acrylate monomer in an amount of 15 wt % to 85 wt % based on the total weight of the photocurable composition. A photo-cured layer of the photocurable composition can have a high heat stability up to 400° C. and a glass transition temperature of at least 135° C.

Abstract: A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa·s, and a cured layer of the curable composition can have a high thermal stability up to 350° C.

Abstract: A photocurable composition can comprise a polymerizable material, an organic ionic compound and a photoinitiator, wherein an amount of the organic ionic compound may be not greater than 1.5 wt %, the organic ionic compound comprises an organic cation, and a conductivity of the photocurable composition can be at least 20 ?S/cm. The photocurable composition can have an improved drop spreading and merging of drops in comparison to the same composition but not including the organic ionic compound.

Abstract: A photocurable coraposition can comprise a polyme.aizable material and a photoinitiator, wherein the polymerizahle material can comprise at least one acrylate monomer including at least one cyano group (CN-acrylate monomer). The presence of a low amount of the CN-acrylate monomer between 10 wt% and not greater than 30 wt% can lower the contact angle of the composition and may improve the etch resistance of a photo-cured layer made from the photocurable composition.

Abstract: A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa·s, and a cured layer of the curable composition can have a high thermal stability up to 350° C.