Patents by Inventor Feng Fan

Feng Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060175038
    Abstract: A rotary-type total heat exchanger (10) includes two blowers (21, 22), a rotary wheel (33), an air-guiding member (41) and an air-regulating member (42). The blowers are used to provide a first airflow and a second airflow into the total heat exchanger. The rotary wheel defines therein a plurality of air passageways (331). Upon rotation, the rotary wheel is capable of exchanging heat and moisture between the airflows when the airflows separately flow though the air passageways of the rotary wheel. The air-guiding member is in fluid communication with one of the blowers for guiding one of the airflows toward the rotary wheel. The air-regulating member is located between the rotary wheel and the air-guiding member for distributing the guided airflow over the air passageways of the rotary wheel.
    Type: Application
    Filed: October 20, 2005
    Publication date: August 10, 2006
    Applicant: Foxconn Technology CO., LTD.
    Inventors: Tay-Jian Liu, Shun-Yuan Jan, Shang-Chih Liang, Chih-Feng Fan
  • Patent number: 6909608
    Abstract: The present invention provides a heat sink assembly. The heat sink assembly comprises a first heat sink with a fan disposed therein, a second heat sink and a heat pipe. The heat pipe has two ends respectively being disposed inside the first heat sink and the second heat sink, The heat pipe is disposed in a side of the first heat sink and the second heat sink and connects the first heat sink and the second heat sink with a space therein for positioning the fan. Therefore, the first heat sink and the second heat sink become a main heat-dissipating region and a sub heat-dissipating region. Heat is dissipated first in the first heat sink (the main heat-dissipating region) and then transferred via the heat pipe to the second heat sink (the sub heat-dissipating region) for being dissipated again.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: June 21, 2005
    Assignee: Datech Technology Co., Ltd.
    Inventor: Wei-Feng Fan
  • Publication number: 20040165350
    Abstract: The present invention provides a heat sink assembly. The heat sink assembly comprises a first heat sink with a fan disposed therein, a second heat sink and a heat pipe. The heat pipe has two ends respectively being disposed inside the first heat sink and the second heat sink, The heat pipe Is disposed In a side of the first heat sink and the second heat sink and connects the first heat sink and the second heat sink with a space therein for positioning the fan. Therefore, the first heat sink and the second heat sink become a main heat-dissipating region and a sub heat-dissipating region. Heat is dissipated first in the first heat sink (the main heat-dissipating region) and then transferred via the heat pipe to the second heat sink (the sub heat-dissipating region) for being dissipated again.
    Type: Application
    Filed: July 1, 2003
    Publication date: August 26, 2004
    Applicant: Datech Technology Co., Ltd.
    Inventor: Wei-Feng Fan
  • Patent number: 6421201
    Abstract: A disc drive spindle motor includes a fixed member coupled to the chassis, and a rotor rotatable about the fixed member for rotating a magnetic storage disc in the contaminant free cavity. A bearing, which may be a hydrodynamic bearing, ball bearing or other bearing type, interconnects the fixed member and the rotor, and supports the rotor for rotation relative to the fixed member. A simple condensation seal is supported from either the fixed member or the rotor, adjacent the bearing opening where outgassing may occur. The seal incorporates a cooling surface which is supported from either the hub/rotor or the fixed member adjacent the region where outgassing occurs; the surface preferably should be wavy, or fin shaped to provide a maximum surface area for better heat transfer and better cooling effect, so that the surface is relatively cooler than the surrounding operating environment. The surface is shaped and made of a material, e.g.
    Type: Grant
    Filed: November 2, 2000
    Date of Patent: July 16, 2002
    Inventors: Raquib Uddin Khan, Matt Loren Shumway, Susan Feng Fan
  • Patent number: 6237069
    Abstract: An apparatus and method for transferring a block of data between a first storage area in a first, unpacked format and a second, narrower storage area in a second, packed format. The present invention includes a set of working registers to temporarily store and manipulate portions of the block of data as it is transferred between the first and second storage areas. By employing this set of working registers, the present invention transfers blocks of data between the first and second storage areas with a low latency and the highest possible throughput.
    Type: Grant
    Filed: December 29, 1998
    Date of Patent: May 22, 2001
    Assignee: Oak Technology, Inc.
    Inventor: Xue Feng Fan
  • Patent number: D487885
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: March 30, 2004
    Assignee: Datech Technology Co., Ltd.
    Inventor: Wei-Feng Fan
  • Patent number: D417093
    Type: Grant
    Filed: September 15, 1998
    Date of Patent: November 30, 1999
    Inventor: Ming-Feng Fan