Heat pipe heat sink assembly

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Description

FIG. 1 is a perspective view of a heat pipe heat sink assembly, in accordance with the present invention;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat pipe heat sink assembly, as shown and described.

Referenced Cited
U.S. Patent Documents
5704419 January 6, 1998 Agonafer et al.
6263957 July 24, 2001 Chen et al.
6394175 May 28, 2002 Chen et al.
6414846 July 2, 2002 Chen
6434004 August 13, 2002 Matteson
D475354 June 3, 2003 Wang
Patent History
Patent number: D487885
Type: Grant
Filed: May 2, 2003
Date of Patent: Mar 30, 2004
Assignee: Datech Technology Co., Ltd. (Taipei Hsien)
Inventor: Wei-Feng Fan (Taipei)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Troxell Law Office PLLC
Application Number: 29/180,906
Classifications
Current U.S. Class: Heat Sink (D13/179)
International Classification: 1303;