Abstract: Described herein are MAT2A inhibitors and pharmaceutical compositions comprising said inhibitors. The subject compounds and compositions are useful for the treatment of a disease or disorder associated with MAT2A.

Abstract: A method for reducing frequency interference, and a communication satellite system. The method includes configuring the communication satellite system, determining a first range of areas in which a spatial isolation angle between the LEO satellite and the GEO satellite does not satisfy a minimum spatial isolation angle within service areas of the movable spot beams, enabling the movable spot beams to not enter the areas, and when the movable spot beams of the transmitting and receiving user antennas of multiple adjacent LEO satellites provide services to a same area, calculating a spatial isolation angles between the movable spot beams of the transmitting and receiving user antennas of any two adjacent LEO satellites, and in response to the spatial isolation angle not satisfying the minimum spatial isolation angle, assigning different sub-frequencies to the movable spot beams that do not satisfy the minimum spatial isolation angle.

Abstract: Delivery devices configured to deliver therapeutic and visualization devices to a surgical site are disclosed. An example delivery device may include a proximally disposed handle; a shaft extending distally from the handle, the shaft including a therapeutic device lumen configured to deliver a working end of a therapeutic device therethrough, a first portion of the shaft being steerable; and a space-making element disposed proximate a distal end portion of the shaft and configured to separate biological tissues to create or expand a working space. At least a portion of the space-making element may be reconfigurable between a retracted configuration and an expanded configuration.

Abstract: A display substrate and a display device are provided. The display substrate includes a base substrate and a plurality of reset signal lines. The base substrate includes a display region which includes sub-pixels arranged in array, each sub-pixels includes a pixel driving circuit and a light-emitting element. The plurality of reset signal lines extends in a first direction and include a plurality of first reset signal lines for providing a first reset signal and a plurality of second reset signal lines for providing a second reset signal, and one of the plurality of first reset signal lines and one of the plurality of second reset signal lines are respectively connected to pixel driving circuits of a plurality of sub-pixels located in a same row. A layer where the plurality of first reset signal lines are located is different from layers where the plurality of second reset signal lines are located.

Abstract: The disclosure provides a displaying substrate, a manufacturing method thereof, and a display panel, and relates to the technical field of display. The displaying substrate comprises a first supporting base (1), plurality of vibrating element modules (2), and a display module (3). The display module (3) comprises display units (31), connecting units (32) and hollowed-out units (33). Each connecting unit (32) is located between two adjacent display units (31). Each hollowed-out unit (33) is located between two adjacent display units (31) except an area where the corresponding connecting unit (32) is located. The hollowed-out units (33) are provided with cavities (40) corresponding to the vibrating element modules (2). Orthographic projections of the hollowed-out units (33) on a reference plane cover orthographic projections of the vibrating element modules (2) on the reference plane. The vibrating element modules (2) and the cavities (40) form a transducer.

Abstract: Provided is a method and device for receiving OAM information blocks. The method includes: determining a reference position and a delivery cycle value of reception of the OAM information block; determining an expected reception position of a next OAM information block according to the reference position and the delivery cycle value, determining an effective reception range according to the expected reception position, and extracting an OAM information block in a client service code block stream within the effective reception range; and synchronizing a sequence relationship of the OAM information blocks according to the type and a sorting result of the extracted OAM information blocks, and extracting content of the OAM information blocks after synchronization so as to monitor the service quality of a carrying pipeline.

Abstract: A semiconductor device and a method and tool for film deposition are provided. The method of film deposition includes holding a semiconductor device in a chamber by a holding component, wherein the chamber is defined by a showerhead and a pedestal, providing reacting gases by the showerhead from a bottom side of the chamber, and forming a first dielectric layer on a backside surface of the semiconductor device.

Abstract: The compound as shown in formula (I) or a pharmaceutically acceptable salt or pharmaceutical composition thereof, and a preparation method therefor, and the use thereof as an MAT2A inhibitor. Ring A, ring Q, X, Y, X1, X2, L and R1 in formula (I) are as defined in the description.

Abstract: Provided are an auxiliary alloy casting piece, a high-remanence and high-coercive force NdFeB permanent magnet, and preparation methods thereof. The method for preparing the auxiliary alloy casting piece includes the following steps: providing an auxiliary alloy material including, by mass percentage, 40% to 45% of Pr, 1% to 2% of Co, 0.5% to 1% of Ga, 0.6% to 0.8% of B, 0.1% to 0.2% of V, 0.3% to 0.7% of Ti, and a balance of Fe; smelting the auxiliary alloy material to obtain a smelted material; and subjecting the smelted material to a quick-setting casting to obtain the auxiliary alloy casting piece; where the quick-setting casting includes a refining and a casting in sequence.

Abstract: A method and a tool for film deposition are provided. The method of film deposition includes holding a semiconductor device in a chamber by a holding component, wherein the chamber is defined by a showerhead and a pedestal, providing reacting gases by the showerhead from a bottom side of the chamber, and forming a first dielectric layer on a backside surface of the semiconductor device.

Abstract: Embodiments of the present application provide a method and a device for controlling train formation tracking, the method comprising: obtaining a current distance between a first train and a second train in a train formation, wherein the first train is adjacent to the second train and located behind the second train; determining a target tracking mode of the first train based on the current distance, wherein the target tracking mode is one of a speed tracking mode, a distance tracking mode and a braking mode; and tracking the second train, by the first train based on the target tracking mode. Tracking efficiency is improved according to the method of the embodiments of the present application.

Abstract: A power source module for powering a motherboard comprises a rectifier circuit, a controlling unit, and a leakage protection circuit. The rectifier circuit electrically connected with the motherboard converts the input voltage into the first voltage configured for powering the motherboard. The controlling unit electrically connected with the motherboard outputs the control signals based on an operation state of the motherboard. The leakage protection circuit electrically connected with the controlling unit guides the control signals into a signal line before the motherboard being powered. The leakage protection circuit avoids the control signals to the component of the motherboard, and an operation time sequence of the component is not disturbed before being powered. A power distribution board and a server system are also disclosed.

Abstract: Processes for preparing compounds of Formula (1) and Formula (2) are described, wherein X, Y, Z, R1-R7, L and n are defined herein. Intermediates useful in the preparation of the compounds of Formula (1) and Formula (2) are also described.

Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: The present disclosure relates to a backlight module, a method for designing the same, and a display device. The backlight module includes: a first substrate; a plurality of LED chips on the first substrate; and a light control structure on the first substrate. The backlight module includes a plurality of light control region groups in one-to-one correspondence with the plurality of light-emitting diode chips, each light control region group includes at least a first light control region and a second light control region. The light control structure includes a plurality of light control substructure groups respectively located in the plurality of light control region groups. Each light control substructure group includes at least a first light control substructure in the first light control region and a second light control substructure in the second light control region.

Abstract: A semiconductor structure includes a substrate, a conductive via and a first insulation layer. The conductive via is through the substrate. The first insulation layer is between the substrate and the conductive via. A first surface of the first insulation layer facing the substrate and a second surface of the first insulation layer facing the conductive via are extended along different directions.

Abstract: An array substrate has a display area and a non-display area including a first bonding region. The array substrate includes: a plurality of pixel columns disposed in the display area, each of the plurality of pixel columns including a plurality of light-emitting units that are arranged in a second direction, the second direction being perpendicular to a direction in which an edge of the display area proximate to the first bonding region extends; and at least three first power supply input terminals disposed in the first bonding region, each first power supply input terminal being connected to at least one pixel column of the plurality of pixel columns, so as to provide a first power supply signal to the at least one pixel column.

Abstract: This disclosure relates to a see-through display device, including: a collimated light source assembly, configured to form collimated light and control a light emitting direction; a first light extraction layer, configured to extract, in a collimated manner, the light ray transmitted inside the light guide plate through a light extraction outlet; an extinction layer and a second light extraction layer, wherein the extinction layer includes a light guide region and a light absorption region which are arranged alternately, and the second light extraction layer includes multiple light extraction inlets; a reflecting layer, arranged on a side, close to the light guide plate, of the second light extraction layer and configured to reflect the collimated light extracted from the light extraction outlet to the light guide plate; and a liquid crystal dimming layer. This disclosure further relates to a manufacturing method of the see-through display device.