Patents by Inventor Feng Liu

Feng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240094700
    Abstract: A reshaping method for metal product includes acquiring position data information of a workpiece; converting the position data information into coordinate information, and fitting the coordinate information to obtain a surface contour curve of the workpiece; comparing the surface contour curve with a standard contour curve to generate a comparison result; obtaining reshaping information of the workpiece based on the comparison result; and controlling the reshaping system to reshape the workpiece. The disclosure acquires position data information of the workpiece by measuring, converts the position data information into coordinate information, fits the coordinate information to obtain the surface contour curve of the workpiece, compares the surface contour curve with the standard contour curve to obtain deformation situation, and reshapes the workpiece according to the reshaping information based on the deformation situation, which improves efficiency of workpiece reshaping and reducing labor costs.
    Type: Application
    Filed: September 30, 2021
    Publication date: March 21, 2024
    Inventors: YU XIA, JI-CHAO XU, LIN-FEI QIU, JIAN-GUANG GAO, FENG LIU, XIN-ZHI WANG
  • Publication number: 20240093944
    Abstract: The present invention application relates to a spiral heat exchanger and a heat exchange device.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 21, 2024
    Applicant: SHANGHAI XINGYE MATERIALS TECHNOLOGY CO., LTD.
    Inventors: Feng GAO, Zaixiang LIU, Yanfeng CHEN, Yuanfeng CAI, Bing WANG, Zhengyan NIU
  • Publication number: 20240091321
    Abstract: Provided herein are novel IGF2 peptides, fusion proteins, and nucleic acid sequences encoding novel IGF2 peptides and fusion proteins for the treatment of lysorsomal storage disorders, wherein the IGF2 peptides confer enhanced properties, such as enhanced expression, secretion and cellular uptake. The constructs provided herein are useful in treating lysosomal storage disorders by both enzyme replacement therapy and gene therapy.
    Type: Application
    Filed: October 12, 2020
    Publication date: March 21, 2024
    Applicant: Amicus Therapeutics, Inc.
    Inventors: Hung V. Do, Steven Tuske, Russell Gotschall, Ce Feng Liu
  • Publication number: 20240092814
    Abstract: Provided are a water-soluble Pd(II) complex, a synthesis method thereof and use thereof as a catalytic precursor. The complex has a chemical name, ammonium dinitrooxalato palladium (II), and a molecular formula of (NH4)2[Pd(NO2)2(C2O4)]·nH2O (n is the number of crystal water). The Pd(II) complex is synthesized by using PdCl2 or [Pd(NH3)2Cl2] as a starting material which is firstly converted into [Pd(NH3)4]Cl2 in ammonium hydroxide, followed by a chemical reaction between [Pd(NH3)4]Cl2 and excessive NaNO2 to produce trans-[Pd(NH3)2(NO2)2] via ligand substitution mechanism, and finally dissolving trans-[Pd(NH3)2(NO2)2] in an aqueous solution of oxalic acid leads to the formation of the target product (NH4)2[Pd(NO2)2(C2O4)]·2H2O. The complex does not contain chlorine and other elements that are harmful to a catalyst, is readily soluble in water and has a low thermal decomposition temperature.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 21, 2024
    Inventors: Weiping Liu, Juan Yu, Li Chen, Anli Gao, Yunsheng Dai, Feng Liu, Jing Jiang, Jiyang Xie, Hao Zhou, Qiaowen Chang, Caixian Yan
  • Publication number: 20240096784
    Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.
    Type: Application
    Filed: January 3, 2023
    Publication date: March 21, 2024
    Inventors: Meng-Hsien Lin, Hsing-Chih Lin, Ming-Tsong Wang, Min-Feng Kao, Kuan-Hua Lin, Jen-Cheng Liu, Dun-Nian Yaung, Ko Chun Liu
  • Publication number: 20240097978
    Abstract: A network slice upgrading method and device are disclosed. The method may include, acquiring version information of each service instance, and receiving an upgrade instruction; downloading an upgrade package after receiving the upgrade instruction, and simultaneously performing an upgrade to a service instance in each NF according to the upgrade package until each upgrade is completed; wherein, the upgrade instruction comprises a preset upgrade proportion and an upgrade order.
    Type: Application
    Filed: September 26, 2021
    Publication date: March 21, 2024
    Inventor: Feng LIU
  • Patent number: 11933663
    Abstract: An internal calibration mechanism of a weigh module has a driving structure, a calibration weight and a weight support frame. The weight support frame has an opening or a groove for loading the calibration weight. The weight support frame is connected to a load receiving portion at both sides thereof and is connected to a portion of a fixing portion that extends towards the load-receiving portion. In one case, the weight support frame, the load-receiving portion and the fixing portion are integrally formed. In another case, a force transmission connecting portion and a fulcrum connecting portion of the weight support frame are fixedly connected, respectively, to the load-receiving portion and to the extending portion of the fixing portion. In another case, flexure hinges connect the weight support frame to the load-receiving portion at both sides thereof and connect the weight support frame to the extending portion.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: March 19, 2024
    Assignee: Mettler Toledo Instrument (Shanghai) Company Limited
    Inventors: Baohui Liu, Chao Wu, Weixiang Sun, Naifeng Bian, Tianhua Xia, Feng Min
  • Patent number: 11931672
    Abstract: The three-stage axial flow degassing device adopts an efficient degassing technology including a vertical high speed swirling field, a horizontal rapid axial flow field and a vertical reversing scrubbing field formed by a combination of vertical tubes; the first-stage degasser performs the first-stage segmental vertical high speed swirling degassing operation, removes the gas phase carried by the gas-containing fluid, and forms a primary gas and a primary fluid; the microporous uniform mixer breaks bubbles of the primary fluid and forms a gas-liquid uniform mixed flow; the second-stage degasser performs the second-stage horizontal vane wheel swirling generating rapid axial flow degassing operation, removes the gas phase carried by the gas-liquid uniform mixed flow, and forms a secondary gas and a secondary fluid; the third-stage degasser performs the third-stage vertical reversing deep degassing operation, removes liquid phase carried by the secondary gas, and forms a tertiary gas and a tertiary fluid.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: March 19, 2024
    Assignee: QINGDAO UNIVERSITY OF TECHNOLOGY
    Inventors: Xinfu Liu, Huifeng Wang, Zhongxian Hao, Chunhua Liu, Ji Chen, Feng Liu, Xiaoming Wu, Peng Gao, Xiaolei Wang
  • Patent number: 11934106
    Abstract: An optical proximity correction (OPC) device and method is provided. The OPC device includes an analysis unit, a reverse pattern addition unit, a first OPC unit, a second OPC unit and an output unit. The analysis unit is configured to analyze a defect pattern from a photomask layout. The reverse pattern addition unit is configured to provide a reverse pattern within the defect pattern. The first OPC unit is configured to perform a first OPC procedure on whole of the photomask layout. The second OPC unit is configured to perform a second OPC procedure on the defect pattern of the photomask layout to enhance an exposure tolerance window. The output unit is configured to output the photomask layout which is corrected.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: March 19, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Shu-Yen Liu, Hui-Fang Kuo, Chian-Ting Huang, Wei-Cyuan Lo, Yung-Feng Cheng, Chung-Yi Chiu
  • Publication number: 20240084463
    Abstract: A system and method for CO2 capture and electroregeneration and synchronous conversion are provided. The system includes a CO2 capture subsystem, which uses an absorption liquid to capture CO2 and generate a capture liquid; and a CO2 electroregeneration and synchronous conversion subsystem, including a cathode chamber provided with a cathode electrode, a sample inlet, and a sample outlet, an anode chamber having an anode electrode, a sample inlet connected to an outlet of the capture liquid of the CO2 capture subsystem, and a sample outlet connected to the sample inlet of the cathode chamber for introducing CO2 regenerated by anodic oxidation into the cathode chamber for electroreduction, and a balance chamber in the middle having a sample outlet connected to an inlet of the absorption liquid of the CO2 capture subsystem. The system can perform self-circulation and stably operate, to capture, regenerate and convert CO2.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 14, 2024
    Inventors: Rui XIAO, Chao LIU, Tao LI, Weicong XU, Peijun LI, Feng GONG
  • Publication number: 20240086731
    Abstract: The present invention relates to a knowledge-graph extrapolating method and system based on multi-layer perception, the method comprising: using relational graph convolutional network encoders to learn embedding representations, and capturing dynamic evolution of a fact; designing emerging task processing units to construct multiple layers of entity sets, and assigning a matching historical relevance; classifying prediction tasks into different reasoning scenes, and connecting them to the corresponding processing unit for partition of entity sets; and using a multi-class task solving method to acquire predicted probability distributions of target entities, and taking the highest one as a prediction answer, so as to accomplish extrapolation of a temporal knowledge graph, wherein the prediction tasks are classified into different reasoning scenes according to whether it contains any entity or relation that has never appeared historically.
    Type: Application
    Filed: January 13, 2023
    Publication date: March 14, 2024
    Inventors: Feng ZHAO, Mingtao CHEN, Kangzheng LIU, Hai JIN
  • Publication number: 20240084484
    Abstract: The present disclosure provides a method and a device for preparing a modified poly (m-phenylene isophthalamide) (PMIA) fiber by continuous polymerization-dry-wet spinning. The method includes the following steps: (1) preparing a mixed solution of m-phenylenediamine (MPD) and a copolymerized diamine monomer in N,N-dimethylacetamide (DMAC) serving as a solvent using a cosolvent; (2) mixing isophthaloyl chloride (IPC) with the mixed solution of the MPD and the copolymerized diamine monomer in the DMAC, and conducting pre-polycondensation and polycondensation in sequence to obtain a modified PMIA resin solution; and (3) subjecting the modified PMIA resin solution to additive addition, filtration, defoaming, and dry-wet spinning to obtain the modified PMIA fiber.
    Type: Application
    Filed: October 11, 2022
    Publication date: March 14, 2024
    Applicant: ZHUZHOU TIMES NEW MATERIAL TECHNOLOGY CO., LTD.
    Inventors: Jun YANG, Kaikai CAO, Jin WANG, Yufeng LIU, Zhicheng SONG, You YANG, Feng YUAN, Wei WU, Zhijun ZHANG, Lei CHEN
  • Publication number: 20240087628
    Abstract: A multi-resistance-state spintronic device, including: a top electrode and a bottom electrode respectively connected to a read-write circuit; and a magnetic tunnel junction between two electrodes. The magnetic tunnel junction includes from top to bottom: a ferromagnetic reference layer, a barrier tunneling layer, a ferromagnetic free layer, and a spin-orbit coupling layer. Nucleation centers are provided at two ends of the ferromagnetic free layer to generate a magnetic domain wall; the spin-orbit coupling layer is connected to the bottom electrode, and when a write pulse is applied, an electron spin current is generated and drives the magnetic domain wall through a spin-orbit torque to move; a plurality of local magnetic domain wall pinning centers are provided at an interface between the spin-orbit coupling layer and the ferromagnetic free layer to enhance a strength of a DM interaction constant between interfaces.
    Type: Application
    Filed: December 30, 2020
    Publication date: March 14, 2024
    Inventors: Guozhong XING, Huai LIN, Feng ZHANG, Di WANG, Long LIU, Changqing XIE, Ling LI, Ming LIU
  • Publication number: 20240089231
    Abstract: Example chat interface creation method and apparatus are described. One example method includes displaying a first group chat interface on a touchscreen of an electronic device. The electronic device receives a first operation in the first group chat interface, and displaying displays a second group chat interface based on the first operation. The first group chat interface is a chat interface of a first chat group, and the first chat group includes a first user who enters the first group chat interface on the electronic device. The second group chat interface is a chat interface of a second chat group, and both the second chat group and the first chat group include the first user.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Ming JIANG, Feng LIU
  • Publication number: 20240088236
    Abstract: In a method of manufacturing a semiconductor device, underlying structures comprising gate electrodes and source/drain epitaxial layers are formed, one or more layers are formed over the underlying structures, a hard mask layer is formed over the one or more layers, one or more first resist layers are formed over the hard mask layer, a first photo resist pattern is formed over the one or more first resist layers, a width of the first photo resist pattern is adjusted, the one or more first resist layers are patterned by using the first photo resist pattern as an etching mask, thereby forming a first hard mask pattern, and the hard mask layer is patterned by using the first hard mask pattern, thereby forming a second hard mask pattern.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Wen HSIAO, Chun-Yen TAI, Yen-Hsin LIU, Ming-Jhih KUO, Ming-Feng SHIEH
  • Publication number: 20240090231
    Abstract: An integrated circuit is provided. The integrated circuit includes a three-dimensional memory device, a first word line driving circuit and a second word line driving circuit. The three-dimensional memory device includes stacking structures separately extending along a column direction. Each stacking structure includes a stack of word lines. The stacking structures have first staircase structures at a first side and second staircase structures at a second side. The word lines extend to steps of the first and second staircase structures. The first and second word line driving circuits lie below the three-dimensional memory device, and extend along the first and second sides, respectively. Some of the word lines in each stacking structure are routed to the first word line driving circuit from a first staircase structure, and others of the word lines in each stacking structure are routed to the second word line driving circuit from a second staircase structure.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Bo-Feng Young, Yi-Ching Liu, Sai-Hooi Yeong, Yih Wang, Yu-Ming Lin
  • Patent number: 11928503
    Abstract: Embodiments are directed to deploying a workload on the best/highest performance node. Nodes configured to accommodate a request for a workload are selected. Information is collected on each of the selected nodes and the workload. Predicted response times expected for the workload running on each of the selected nodes are determined. The workload is deployed on a node of the selected nodes, the node having a corresponding predicted response time for the workload, the workload being deployed on the node based at least in part on the corresponding predicted response time.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: March 12, 2024
    Assignee: International Business Machines Corporation
    Inventors: Qi Feng Huo, Yuan Yuan Wang, Da Li Liu, Lei Li, Yan Song Liu
  • Patent number: 11925210
    Abstract: An electric heating device having an air channel includes an upper cover component and a lower shell component. A heater component is arranged in a lower shell of the lower shell component, and includes a heater shell, a heating member and a heating member base arranged in the heater shell. A ventilation portion is arranged at a heating member base to guide an air flow to the heating member, and is matched with a first air inlet on the lower shell and a second air inlet on the heater shell. The air flow is led to the heating member from an outside of the lower shell through the first air inlet, the second air inlet, and the ventilation in sequence.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: March 12, 2024
    Assignee: CHINA TOBACCO GUANGDONG INDUSTRIAL CO., LTD.
    Inventors: Yibo Liu, Feng Li, Jing Hu, Ruifeng Zhao, Zhiyong Xiang
  • Patent number: D1017528
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: March 12, 2024
    Inventor: Feng Liu
  • Patent number: D1018527
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: March 19, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Han-Tsai Liu, Jyh-Chyang Tzou, Cheng-Shiue Jan, Yao-Hsien Yang, Pai-Feng Chen, I-Hao Chen