Abstract: A display substrate and a display apparatus are disclosed. The display substrate includes a base substrate including a display region and a peripheral region located on at least one side of the display region, and a first gate drive circuit, the first gate drive circuit includes a first clock signal line, a second clock signal line and N shift register units that are cascaded; each shift register unit of the N shift register units includes a first output circuit; the first output circuit includes the first output transistor, the orthographic projection of the second clock signal line on the base substrate is located between an orthographic projection of the first output transistor on the base substrate and the orthographic projection of the first clock signal line on the base substrate. The display substrate can reduce load of the first clock signal line and the second clock signal line.

Abstract: The present application discloses a current collector, and manufacturing method and equipment thereof, and a current collector preform, wherein the current collector may include a porous foam metal part and solid metal part(s); the porous foam metal part may be uncompressed, and the porous foam metal part may include a first edge and a second edge oppositely distributed in a first direction, the first direction may be perpendicular to the thickness direction of the current collector; the first edge and/or the second edge may be connected with the solid metal part(s).

Abstract: Provided are an image fusion method and apparatus, an electronic device, and a storage medium. The method includes the following steps: A shooting operation acting on a first page of a target shooting activity is received, where the first page is an H5 page; in response to the shooting operation, a camera is called through system shooting software to collect an original image; a fusion operation for the original image is received; and in response to the fusion operation, the original image is fused with a first target effect, a static target image that includes a static image obtained by fusing the original image with the first target effect and the first description information related to the static image is generated, and the static target image is displayed on a second page, where the second page is an H5 page.

Abstract: A reasonable millisecond time control method for excavation blasting of a tunnel is provided, and includes: acquiring physical mechanical parameters to establish a millisecond blasting model, and designing four dimensions blasting parameters of explosive quantity, hole number, inter-hole millisecond and inter-row millisecond; simulating, based on the millisecond blasting model, a blasting process of an explosive package using blasting parameters to obtain a blasting vibration curve; obtaining single-hole blasting vibration waveforms, solving a vibration synthesis curve through a vibration synthesis theory; comparing the vibration synthesis curve with the blasting vibration curve to obtain a coupling relationship of blasting parameters; determining a target group of explosive quantity and hole numbers, determining a target millisecond through the coupling relationship of blasting parameters, and relating a millisecond blasting control strategy to control, and it is used for tunneling project to reduce cut blas

Abstract: An osteotomy calibration method, calibration device, and an orthopedic surgery system are provided by present application. Firstly using the osteotomy calibration device to obtain the calculated position information of the current osteotomy plane, and then determining a position error between the calculated position information and a predetermined position information of a planned osteotomy plane, and if the position error exceeds a preset value, calculating and transmitting a relocation information to a robotic arm to control and relocate the robotic arm. By comparing and identifying the position error between the current osteotomy plane formed by the first osteotomy and the planned predetermined osteotomy plane, relocating the robotic arm, and performing a secondary correction of the osteotomy plane. In addition, by relocating the robotic arm and secondary correction of the osteotomy plane, additional bone nails which is to fix the navigation tool to the bone can be avoided.

Abstract: Provided is a display device. The display device includes a controller, a display module, and a temperature sensor disposed in the display module; wherein the controller is connected to the display module and the temperature sensor; the temperature sensor is configured to detect a temperature of the display module; and the controller is configured to: adjust a gamma parameter of the display module to a target gamma parameter corresponding to the temperature of the display module; determine a target drive voltage required by the display module with the target gamma parameter; and drive, based on the target drive voltage, the display module to display an image.

Abstract: The invention provides a reaction system for preparing butyraldehyde by propylene carbonylation, comprising: a reactor; a side wall of the reactor is sequentially provided with a catalyst inlet, a propylene inlet and a synthesis gas inlet from top to bottom; the bottom of the reactor is provided with a solvent inlet; two micro-interface generators are arranged inside of the reactor from top to bottom, and the micro-interface generator located at a top end is connected to the propylene inlet to break the propylene gas into micron-scale micro-bubbles; the micro-interface generator located at a bottom is connected to the synthesis gas inlet for breaking the synthesis gas into micron-scale micro-bubbles; the outlets of the two micro-interface generators are opposite, and the outlets are connected with a gas distributor for evenly distributing raw materials.

Abstract: An electronic device includes electrical components in a housing. The components may include optical components such as a display. Protective structures may be used to protect the optical components. The protective structures may include one or more protective transparent layers such as layers of glass or crystalline material such as sapphire. The protective transparent layers may be coated with an oleophobic coating. To enhance coating durability, catalyst may be used to help bond the oleophobic coating. An adhesion promotion layer such as a silicon oxide layer may be deposited on the transparent protective layer. A catalyst layer such as a layer of sodium fluoride may be deposited on the adhesion promotion layer. The oleophobic material may be evaporated or otherwise deposited on the catalyst layer. Heat and moisture may help the oleophobic material form chemical bonds with the adhesion promotion layer, thereby forming a durable oleophobic coating.

Abstract: A bonding and transferring method for die package structures is provided, including providing a die package structure which has a positioning adhesive disposed thereon, and providing a vibration base having at least one cavity corresponding to the positioning adhesive. By alignment of the positioning adhesive and the cavity, the die package structure can be positioned into the vibration base. A target substrate is further provided and bonded with the vibration base having the die package structure disposed thereon through a metal material. And a laser process is then performed to melt the metal material. At last, the vibration base and the positioning adhesive are removed so the die package structure is successfully bonded and transferred onto the target substrate. By employing the proposed process method of the present invention, rapid mass transfer result is accomplished, and the packaging yield of vertical light emitting diode die package structures is optimized.

Abstract: A chip slot is disclosed, which includes a slot, where a plurality of terminal groups are disposed in the slot, terminals in each terminal group include metal sheets that are symmetrically disposed on two opposite inner side walls of the slot, and each metal sheet has a bending pin that extends outside the slot; bending directions of bending pins on the terminals in each terminal group are same; and for any row of metal sheets in any two adjacent terminal groups, along an arrangement direction of the row of metal sheets, bending pins of the metal sheets in the adjacent terminal groups are alternately arranged on both sides of the row of metal sheets. The bending pins of the row of metal sheets are bent toward two different directions.

Abstract: User data security is provided. Encrypted user data are identified in a virtual machine. A private key of a public/private cryptographic key pair corresponding to a user is retrieved. The encrypted user data is decrypted within the virtual machine utilizing the private key corresponding to the user to form decrypted user data. The encrypted user data are replaced in the virtual machine with the decrypted user data. The decrypted user data is processed in the virtual machine to perform a service in a cloud environment.

Abstract: The present invention provides a curable compound product that forms a cured product having excellent heat resistance and high insulating properties by performing heat treatment. The curable compound product of the present disclosure contains a compound represented by Formula (1) below, and a proportion of a group represented by Formula (r-1) below to the sum of the group represented by Formula (r-1) below and a group represented by Formula (r-2) below is 97% or greater. In Formula (1), R1 and R2 are identical or different, and each represent the group represented by Formula (r-1) the group represented by Formula (r-2) below: D1 and D2 are identical or different, and each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below.

Abstract: A via-filling method of a TGV substrate includes steps: filling a plurality of metal balls into a plurality of vias of the TGV substrate; using a heating process to melt the plurality of metal balls to form a liquid-state metal; and cooling down the liquid-state metal to form a solid-state metal inside the plurality of vias. Because the method needn't use solvents or fluxes, the solid-state metal inside the plurality of vias have better electric conductivity.

Abstract: An apparatus is provided that includes a block of memory cells having a NAND string that includes a first select transistor, and a control circuit coupled to the block of memory cells. The control circuit is configured to perform an erase operation on the block of memory cells by determining a first count of a number of times that the block of memory cells previously has been programmed and erased, determining based on the first count a first drain-to-gate voltage of the first select transistor, wherein the first drain-to-gate voltage is configured to cause the first select transistor to generate a first gate-induced drain leakage current, and applying a first erase pulse to the first select transistor based on the determined first drain-to-gate voltage.

Abstract: A vertical light emitting diode die packaging method is provided, including a plurality of following steps. At first, a plurality of drill hole is formed in a substrate and a first metal material is used to fill the drill holes. Next, disposing and fixing a plurality of vertical light emitting diode die on the substrate through a second metal material, and a transparent glue is used to cover thereon. A laser process is then employed to dissolve the transparent glue for forming ditches. And, a conductive liquid is applied to fill the ditches and an insulating glue is provided to embrace and encapsulate the vertical light emitting diode dies. By employing the packaging method of the present invention, the current external wire bonding process can be effectively replaced, thereby die size miniaturization as well as packaging yield of the vertical light emitting diode dies are believed to be optimized.

Abstract: Methods and systems for dry etching are disclosed. The system includes a wafer clamp ring having a central opening through which a substrate may be treated and a plurality of smaller, outer support holes for receiving pins from plunger assemblies. The outer support holes are tapered and change in diameter. The tapered shape reduces horizontal shifting of the wafer clamp ring which can occur as the wafer clamp ring is moved up-and-down during operational use. The reduced shifting increases wafer yield along the edges of the wafer.

Abstract: The present disclosure provides a time delay integration (TDI) sensor using a rolling shutter. The TDI sensor includes multiple pixel columns. Each pixel column includes multiple pixels arranged in an along-track direction, wherein two adjacent pixels or two adjacent pixel groups in every pixel column have a separation space therebetween. The separation space is equal to a pixel height multiplied by a time ratio of a line time difference of the rolling shutter and a frame period, or equal to a summation of at least one pixel height and a multiplication of the pixel height by the time ratio of the line time difference and the frame period. The TDI sensor further records defect pixels of a pixel array such that in integrating pixel data to integrators, the pixel data associated with the defect pixels is not integrated into corresponding integrators.

Abstract: This application relates to a method of processing augmented reality (AR) data at a terminal, and a storage medium, and the AR data propagation method includes: receiving AR data, the AR data carrying AR recognition data and being generated by a source terminal; displaying the AR data according to the AR recognition data; in response to receiving a user instruction, updating the AR data according to the user instruction; and sharing the updated AR data with a target terminal. With the solutions provided in this application, users can implement AR interactions with virtual world data by using a terminal with a relatively low configuration.

Abstract: A manufacturing method of a semiconductor structure is provided. A first semiconductor die includes a first semiconductor substrate, a first interconnect structure formed thereon, a first bonding conductor formed thereon, and a conductive via extending from the first interconnect structure toward a back surface of the first semiconductor substrate. The first semiconductor substrate is thinned to accessibly expose the conductive via to form a through semiconductor via (TSV). A second semiconductor die is bonded to the first semiconductor die. The second semiconductor die includes a second semiconductor substrate including an active surface facing the back surface of the first semiconductor substrate, a second interconnect structure between the second and the first semiconductor substrates, and a second bonding conductor between the second interconnect structure and the first semiconductor substrate and bonded to the TSV.

Abstract: Methods, systems and apparatus for memory devices with multiple string select line (SSL) cuts are provided. In one aspect, a semiconductor device includes: a three-dimensional (3D) array of memory cells and a plurality of common source lines (CSLs) configured to separate the 3D array of memory cells into a plurality of portions. Each portion of the plurality of portions is between two adjacent CSLs and includes a plurality of conductive layers separated from each other by insulating layers and a plurality of vertical channels arranged orthogonally through the plurality of conductive layers and the insulating layers, each of the plurality of vertical channels including a string of memory cells. A top part of each portion of one or more portions includes at least two SSL cuts configured to separate the portion into multiple independent units, and each of the independent units is selectable by a corresponding SSL of multiple SSLs.