Abstract: The present disclosure discloses a Bluetooth communication method having audio source scanning mechanism and used in a Bluetooth audio play playback apparatus that includes steps outlined below. A one-to-one connection is established with a Bluetooth communication assistant apparatus. An audio source scanning is performed to generate audio source information according to a scanned Bluetooth audio source apparatus. The audio source information is transmitted to the Bluetooth communication assistant apparatus. A selection command from the Bluetooth communication assistant apparatus is received to select the scanned Bluetooth audio source apparatus as a selected Bluetooth audio source apparatus. Audio data from the selected Bluetooth audio source apparatus is received and playback.

Abstract: A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die package structure over the carrier substrate, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure, and removing the removable film to expose a top surface of the semiconductor die, wherein a top surface of the semiconductor die is lower than the top surface of the first stacked die package structure.

Abstract: A method, computer system, and a computer program product for syllable-based pronunciation help are provided. An input text in a first language may be received. A selection of a target language that is different from the first language may be received. From the target language, syllables with a pronunciation most closely matching a pronunciation of the input text in the first language are obtained. The obtaining is based on a comparison of one or more spectrograms for the input text with one or more spectrograms for text of the target language. The obtained syllables in the target language are presented.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a package substrate, a semiconductor chip disposed over the package substrate, and an integrated device located below and bonded to the lower surface of the semiconductor chip. The semiconductor chip has a lower surface facing the package substrate and is electrically connected to the package substrate through conductive structures. The integrated device is laterally surrounded by the conductive structures, and the integrated device and the conductive structures are located within boundaries of the semiconductor chip when viewed in a direction perpendicular to the lower surface of the semiconductor chip.

Abstract: The present disclosure discloses an address information feature extraction method based on a deep neural network model. The present disclosure uses a deep neural network architecture, and transforms tasks, such as text feature extraction, address standardization construction and semantic-geospatial fusion, into quantifiable deep neural network model construction and training optimization problems. Taking a character in an address as a basic input unit, the address language model is designed to express it in vectors, then a key technology of standardization construction of Chinese addresses is realized through neural network target tasks.

Abstract: A method includes: bonding a plurality of interposer dies to a first redistribution layer (RDL), each of the interposer dies comprising a substrate and a second RDL below the substrate; encapsulating the first RDL and the interposer dies; reducing a thickness of the substrate of each of the interposer dies; and electrically coupling the interposer dies to a first semiconductor die.

Abstract: An integrated circuit package integrates a photonic die (oDie) and an electronic die (eDie). More specifically, the integrated circuit package may include a plurality of redistribution layers communicatively coupled to at least one of the oDie and/or the eDie, where molded material at least partially surrounds the at least one of the oDie and/or the eDie.

Abstract: A photovoltaic device includes a substrate structure and at least one Se-containing layer, such as a CdSeTe layer. A process for manufacturing the photovoltaic device includes forming the CdSeTe layer over a substrate by at least one of sputtering, evaporation deposition, CVD, chemical bath deposition process, and vapor transport deposition process. The process can also include controlling a thickness range of the Se-containing layer.

Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.

Abstract: Provided is a package structure including a die, a through via, an encapsulant, a warpage controlling layer, and a cap. The through via is laterally aside the die. The encapsulant laterally encapsulates the through via and the die. The warpage controlling layer covers the encapsulant and the die. The cap is laterally aside the warpage controlling layer and on the through via. The cap has a top surface higher than a top surface of the encapsulant and lower than a top surface of the warpage controlling layer.

Abstract: A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.

Abstract: A system and method for measuring an image distance of power transmission lines with an unmanned aerial vehicle (UAV). The system includes: a UAV, a master console, and a plurality of cameras. The cameras are configured to collect 2D image data of a power transmission line corridor. The UAV includes a vehicle body, a lidar device, a rotor assembly, a power unit, a flight control processor, a state detection device, and a wireless communication module. The lidar device is configured to collect 3D point cloud data of the power transmission lines. The master console is configured to receive the 2D image data and the 3D point cloud data, and establish a mapping relationship between the 2D image data and the 3D point cloud data; recognize a target object, determine 3D point coordinates of the target object, and calculate a distance from the target object to the power transmission lines.

Abstract: Disclosed is an artificial intelligence infrared thermal imaging bra system with breast disease detecting function. The system includes a side support, two chest support layers and two shoulder straps; the two shoulder straps are fixed at both ends of the side support, and the two chest support layers are symmetrically fixed between the two shoulder straps at the top of the side support; the two chest support layers are internally provided with sliding mechanisms that are adjustable according to different chests of users; a rotating mechanism for driving the sliding mechanisms to move is arranged between the two chest support layers at the top of the side support, and the rotating mechanism and the sliding mechanisms are in transmission connection; one end of the side support is fixed with a sub-buckle, and the other end of the side support is provided with a stretching mechanism.

Abstract: A tungsten-base alloy material and a preparation method therefor. The preparation method comprises: 1) evenly grinding composite powder containing tungsten and zirconium oxide, and then performing annealing treatment at 700-1000° C. to obtain powder A; and 2) grinding and then compression moulding the powder A, and then performing liquid-phase sintering to obtain a tungsten-base alloy blank so as to obtain the tungsten-base alloy material.

Abstract: A material of thermoplastic fusible inner mold is provided, including: a high crystalline polymeric material and a lubricant material, the high crystalline polymeric material mixed with the lubricant material. An inner mold is further provided, made of the material of thermoplastic fusible inner mold described above. A method for manufacturing hollow part is further provided, including the following steps of: providing the inner mold; covering the inner mold with a part material; heating the inner mold which is covered with the part material to form the part material; and heating the inner mold covered with the part material which is formed at a predetermined temperature to melt the inner mold out of the part material which is formed to form the hollow part.

Abstract: A method for identifying a body region in a medical image includes obtaining a medical image including a number of consecutive bio-section images, inputting the medical image into a preset machine learning model to obtain a numerical value for each of the bio-section images corresponding to the body region to which the bio-section image belongs, determining whether the numerical values of the medical image are abnormal, adjusting the numerical values when the numerical values are abnormal, determining the body region corresponding to the numerical values or the adjusted numerical values, and labeling the body region in the medical image and outputting the labeled medical image. The bio-section images are cross-sectional images of a living body.

Abstract: A method for identifying a body region in a medical image includes obtaining a medical image including a number of consecutive bio-section images, inputting the medical image into a preset machine learning model to obtain a numerical value for each of the bio-section images corresponding to the body region to which the bio-section image belongs, determining whether the numerical values of the medical image are abnormal, adjusting the numerical values when the numerical values are abnormal, determining the body region corresponding to the numerical values or the adjusted numerical values, and labeling the body region in the medical image and outputting the labeled medical image. The bio-section images are cross-sectional images of a living body.

Abstract: An image stitching method includes: obtaining a control object of a first image; obtaining a control object of a second image; identifying a same control object of the first image and the second image, and location information of the same control object, where the location information includes first location information and second location information, the first location information indicates a location of the same control object in the first image, and the second location information indicates a location of the same control object in the second image; and stitching the first image and the second image into a third image according to the location information of the same control object.